7.5 x 10 cm modules use four Samtec AcceleRate HD High-Density on the bottom side.
- 4 x ADM6-60-01.5-L-4-2 (compatible to ADF6-60-01.5-L-4-2), (240 pins, "60" per row)
Features
- Board-to-Board Connector 240-pins, 60 contacts per row
- .025" (0.635 mm) pitch
- Data Rate: max 56 Gbps
- Mates with: ADM6/APF6
- Insulator Material: LCP, Black
- Contact Material: Copper Alloy
- Plating: Au or Sn over 50 µ" (1.27 µm) N
- Operating Temperature Range: -55 ºC to +125 ºC
- • PCIe 5.0 capable: Yes
- Lead-Free Solderable: Yes
- RoHS Compliant: Yes
Connector Mating height
When using the same type on baseboard, the mating height is 5mm. Other mating heights are possible by using connectors with a different height
| Order number | Connector on baseboard | compatible to | Mating height |
|---|---|---|---|
| ????? | REF-????? | ADM6-60-01.5-L-4-2 | 5 mm |
| ADF6-60-01.5-L-4-2 | 5 mm |
Connectors.
The module can be manufactured using other connectors upon request.
Connector Speed Ratings
The AcceleRate HD High-Density connector speed rating depends on the stacking height; please see the following table:
| Stacking height | Speed rating |
|---|---|
| 5 mm | 10/ 25/ 56 Gbps |
Speed rating.
Current Rating
Current rating of Samtec AcceleRate HD High-Density B2B connectors is 1.34 A per pin (4 pins powered)
Connector Mechanical Ratings
- Shock: 100G, 6 ms Sine
- Vibration: 7.5G random, 2 hours per axis, 3 axes total
Manufacturer Documentation
Overview
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