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TE0803-03-5DI21-AS


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Module type



TETrenz Electronic


Module name

0803080608070808082008210835




Module Revision

01

PCB Revision 1 (initial)



Device name

2345679ABDFZU+

ZU2ZU3ZU4ZU5ZU6ZU7

ZU9

ZU11ZU15ZU17ZU19

KMNPJRXYSTUV

ZU+ RFSoC



ZU21ZU25ZU27ZU28ZU29ZU39ZU42ZU43ZU46ZU47ZU48ZU49

PS and engine type and speed grade

ABDFGHKMNPRSTXY

CG-1EG-1EV-1CG-2EG-2EV-2CG-3EG-3EV-3CG-1LEG-1LEV-1LCG-2LDR-1DR-2

Temp range (Tstr. abs. = -65°C to +150°C)

XC  (Standard-Grade)XA  (Automotive-Grade)XQ  (Defense-Grade)

Extended (0/+100°C)Industrial (–40/+100°C)Automotive(–40/125°C)Ind. (I)Automotive (Q)Industrial Military

EIQTRNM

DDR memory (TE0803/0807/0808: 4x; TE0820/0821: 2x)

0Not populated

1

TE0803/0807/0808: 2 GByte. TE0820/0821: 1 GByte

Commercial4Gbit - NT5AD256M16D4-HR #29165

2TE0803/0807/0808: 4 GByte. TE0820/0821: 2 GByte. TE0812: 1 GByteIndustrial8Gbit - K4A8G165WB-BIRC#28375

3TE0803/0807/0808: 8 GByte. TE0820/0821: 4 GByteCommercial16Gbit (2 die) - K4AAG165WB-MCRC0CV#27787

4TE0803/0807/0808: 8 GByte. TE0820/0821: 4 GByteIndustrial16Gbit - MT40A1G16RC-062E IT:B#30258

5TE0803/0807/0808: 4 GByte. TE0820/0821: 2 GByteAutomotive8Gbit - MT40A512M16JY-083E AAT:B#30246

6TE0803/0807/0808: 8 GByte. TE0820/0821: 4 GByteIndustrial16Gbit (2 die) - H5ANAG6NCMR-XNI#30673

T
Industrial4GBit - MT53E128M32D2DS-053 WT:A#30663

UTE0802/0823: 1 GByteIndustrial8Gbit - IS43LQ32256A-062BLI (LPDDR4)#29797

VTE0802/0823: 1 GByteCommercial8Gbit - K4F8E304HB-MGCJ (LPDDR4)#28217

XDDR SODIMM Socket


YIC Socket (IC Debug Holder)


Flash memory (2x for all modules)

0Not populated---

1TE0803/0807/0808/0820/0821/0823: 1 Gbit.Industrial512Mbit - MT25QU512ABB8E12-0SIT#29292

2TE0803/0807/0808/0820/0821/0823: 512 Mbit.Industrial256Mbit - MT25QL256ABA8E12-1SIT#28856

3TE0803/0807/0808/0820/0821/0823: 2 Gbit.Industrial1Gbit - MT25QU01GBBB8E12-0SIT#28264

4TE0803/0807/0808/0820/0821/0823: 4 Gbit.Industrial2Gbit - MT25QU02GCBB8E12-0SIT#28286

5TE0803/0807/0808/0820/0821/0823: 512 Mbit.Automotive256Mbit - MT25QU256ABA8E12-0AAT#30245

   6TE0830: 1 GbitExtended512MBit - IS25WP512M-RHLE#29423

7TE0812: 1 Gbit.Industrial1Gbit - MT25QL01GBBB8E12-0SIT#29992

eMMC (for TE0820/0821/0823)


-Not present (for TE0803/07/08)---

0Not populated (for TE0820/0821/0823)---

FTE00820/0821/0823: 8 GByte Industrial8GByte - IS21ES08G-JCLI#29169

GTE00820/0821/0823: 8 GByteCommercial8GByte - KLM8G1GETF-B041#28669

HTE00820/0821/0823/0812: 32 GByte
32GByte - ????

KTE00820/0821/0823: 64 GByteIndustrial64GByte - IS21ES64G-JCLI#29799

Other options (Connectors, custom options)

ModuleVariationDescription

AllAStandard connector height

LLow profile connector height

CStandard connector height, FPGA: XCZUxxx-xxxxxxxxx4524 (without encryption)

DLow profile connector height, FPGA: XCZUxxx-xxxxxxxxx4524 (without encryption)

...Custom assembly variant, look additional table below

Additional options
BlankNo extra options

SStarter Kit

KWith heat spreader

PPrototype

TFPGA supplied by customer



Other assembly variations (position 17)

ModuleVariationDescription
TE0803AStandard profile B2B connectors ST5-80-1.50-L-D-P-TR #27220

L

Low profile B2B connectors ST5-80-1.00-L-D-P-TR #27017
RCustom: standard hight connectors, R14 - 487k (PS_1V8 = 3.3V), U6 - SIT8008BI-71-33E-25.000000E, U32 - SiT8008BI-71-33E-33.333333E, U28 DNP, C81 DNP
CB2B connectors: standard profile , FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
XCustom: standard hight connectors, U41 → SBAS70-04LT1G
TE0807AStandard profile B2B connectors ST5-80-1.50-L-D-P-TR #27220
LLow profile B2B connectors ST5-80-1.00-L-D-P-TR #27017
CB2B connectors: standard profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
XB2B connectors: standard profile, U41 → SBAS70-04LT1G
TE0808AStandard profile B2B connectors ST5-80-1.50-L-D-P-TR #27220
LLow profile B2B connectors ST5-80-1.00-L-D-P-TR #27017
CB2B connectors: standard profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
XB2B connectors: standard profile, U41 → SBAS70-04LT1G
TE0820


AStandard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903

L

Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125
CB2B connectors: standard profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
IB2B connectors: standard profile, Ethernet PHY  U8 - 88E1512-A0-NNP2I000 DNP, no screws/spacers
TE0821AStandard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903
CStandard profile B2B connectors, FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification

L

Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125
TE0823AStandard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903, HyperFlash/HyperRAM DNP
CStandard profile B2B connectors, FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification

L

Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125
TE0830AStandard assembly option PICMG ASP connectors
TE0850AStandard assembly option
BWithout FAN
CLanes SATA_R_SL, SATA_R_SCL disconnected from J1. Clock CK (U14/U73) connected to J1 
TEB0911AStandard assembly option
TE0812

A

Space grade model
TE0812BTest model










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