The 7.5 x 10 cm modules use four Samtec AcceleRate HD High-Density on the bottom side.

  • 4 x ADM6-60-01.5-L-4-2 (compatible to ADF6-60-01.5-L-4-2), (240 pins, "60" per row)

The carriers for 7.5 x 10 cm modules use four Samtec AcceleRate HD High-Density on the bottom side.

  • 4 x ADF6-60-03.5-L-4-2 (compatible to ADF6-60-01.5-L-4-2), (240 pins, "60" per row)
Features
  • Board-to-Board Connector 240-pins, 60 contacts per row
  • 0.025" (0.635 mm) pitch
  • Data Rate: max 56 Gbps 
  • Mates with: ADM6/APF6
  • Insulator Material: LCP, Black
  • Contact Material:  Copper Alloy
  • Plating: Au or Sn over 50 µ" (1.27 µm) N
  • Operating Temperature Range: -55 ºC to +125 ºC
  • • PCIe 5.0 capable: Yes
  • Lead-Free Solderable: Yes
  • RoHS Compliant: Yes
Connector Mating height

When using the same type on baseboard, the mating height is 5mm. Other mating heights are possible by using connectors with a different height

Order numberConnector on baseboardcompatible toMating height
30095REF-30095ADM6-60-01.5-L-4-25 mm
31137REF-31137ADF6-60-03.5-L-4-25 mm
Connectors.

The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The  AcceleRate HD High-Density  connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
5 mm 10/ 25/ 56 Gbps
Speed rating.
Current Rating

Current rating of  Samtec AcceleRate HD High-Density B2B connectors is 1.34 A per pin (4 pins powered)

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total


Manufacturer Documentation

  File Modified
PDF File adm6-xxx-xx.x-xxx-x-x-x-footprint.pdf 22 07, 2021 by Pedram Babakhani
PDF File adm6-xxx-xx.x-xxx-4-x-x-xr-mkt.pdf 22 07, 2021 by Pedram Babakhani
PDF File adm6.pdf 22 07, 2021 by Pedram Babakhani
PDF File adf6.pdf 22 07, 2021 by Pedram Babakhani
PDF File 20200225_hsc_adm6-xx-01p5-xxx-4-a_adf6-xx-03p5-xxx-4-a.pdf 22 07, 2021 by Pedram Babakhani



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