Table of Contents
The Trenz Electronic TE0820 is an industrial-grade 4 x 5 cm MPSoC SoM (System on Module) module integrating a Xilinx Zynq UltraScale+ with up to 4 GByte 32-Bit DDR4 SDRAM, max. 128 MByte SPI Boot Flash memory for configuration and operation and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking strips. All Trenz Electronic SoMs in 4 x 5 cm form factor are mechanically compatible.
- Xilinx Zynq UltraScale+ MPSoC (XCZU2CG / XCZU2EG, XCZU3CG / XCZU3EG or XCZU4CG / XCZU4EV)
- Quad-core or dual-core Cortex-A53 64-bit ARM v8 application processing unit (APU) (depends on assembly variant CG,EG,EV)
- Dual Cortex-R5 32-bit ARM v7 real-time processing unit (RPU)
Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
- PCI Express® interface version 2.1 compliant
- SATA 3.1 specification compliant interface
DisplayPort source-only interface with video resolution up to 4k x 2k
- USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
- 1 GB/s serial GMII interface
- 132 x HP PL I/Os (3 banks)
- 14 x PS MIOs (6 of the MIOs intended for SD card interface in default configuration)
- 4 x serial PS GTR transceivers
- 2 GByte DDR4 SDRAM, 32bit databus-width
- 128 MByte QSPI boot Flash in dual parallel mode
- 8 GByte eMMC
- Programmable quad PLL clock generator PLL for PS GTR clocks (optional external reference)
- Gigabit Ethernet transceiver PHY ( )
- MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
- Hi-speed USB2 ULPI transceiver with full OTG support (
- Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips
- All power supplies on board
- Size: 50 x 40 mm
Additional assembly options are available for cost or performance optimization upon request.
- Xilinx Zynq UltraScale+ MPSoC, U1
- 1.8V, 512 Mbit QSPI flash memory, U7
- 1.8V, 512 Mbit QSPI flash memory, U17
- 8 Gbit (512 x 16) DDR4 SDRAM, U2
- 8 Gbit (512 x 16) DDR4 SDRAM, U3
- Marvell Alaska 88E1512 integrated 10/100/1000 Mbps energy efficient ethernet transceiver, U8
- 6A PowerSoC DC-DC converter (PL_VCCINT, 0.85V), U5
- B2B connector Samtec Razor Beam™ LSHM-150, JM1
- B2B connector Samtec Razor Beam™ LSHM-150, JM2
- B2B connector Samtec Razor Beam™ LSHM-130, JM3
- 8 GByte eMMC memory, U6
- Lattice Semiconductor MachXO2 System Controller CPLD, U21
- I2C programmable, any frequency , any output quad clock generator, U10
- Highly integrated full featured hi-speed USB 2.0 ULPI transceiver, U18
- LED D1(Red) Done Pin
- LED D2 (Green) CPLD Status, User LED
- LED D3 (Red) PS Error
- LED D4 (Green) PS Error Status
Initial Delivery State
|Storage Device Name|
SPI Flash OTP Area
Empty, not programmed
Except serial number programmed by flash vendor.
SPI Flash Quad Enable bit
SPI Flash main array
|Si5338 OTP NVM||Not programmed||-|
|CPLD (LCMXO2-256HC)||SC0820-02 QSPI Firmware||See Boot Process section.|
Table 1: Initial delivery state of programmable devices on the module
Two different firmware versions are available, one with the QSPI boot option and other with the SD Card boot option.
|B2B JM1 MODE Pin||Default CPLD Firmware||QSPI Firmware Version||SD Card Firmware Version|
|Low||SD||JTAG||Boot from SD Card|
|High||Flash||Boot from Flash||JTAG|
Table 2: Boot mode pin description
For more information refer to the TE0820 CPLD - BootMode section.
Signals, Interfaces and Pins
Board to Board (B2B) I/Os
Zynq MPSoC's I/O banks signals connected to the B2B connectors:
I/O Signal Count
|Max voltage 1.8V|
|Max voltage 1.8V|
|Max voltage 1.8V|
|Max voltage 1.8V|
|Max voltage 1.8V|
1 differential input
Table 3: General overview of board to board I/O signals
For detailed information about the pin-out, please refer to the Pin-out table.
The Xilinx Zynq UltraScale+ device used on the TE0820 module has 4 GTR transceivers. All 4 are wired directly to B2B connector JM3. MGT (Multi Gigabit Transceiver) lane consists of one transmit and one receive (TX/RX) differential pairs, four signals total per one MGT lane. Following table lists lane number, FPGA bank number, transceiver type, signal schematic name, board-to-board pin connection and FPGA pins connection:
|Lane||Bank||Type||Signal Name||B2B Pin||FPGA Pin|
Table 4: MGT lanes
There are 3 clock sources for the GTR transceivers. B505_CLK0 is connected directly to B2B connector JM3, so the clock can be provided by the carrier board. Clocks B505_CLK1 and B505_CLK3 are provided by the on-board clock generator (U10). As there are no capacitive coupling of the data and clock lines that are connected to the connectors, these may be required on the user’s PCB depending on the application.
|Clock signal||Bank||Source||FPGA Pin||Notes|
|B505_CLK0_P||505||B2B, JM3-31||PS_MGTREFCLK0P_505, F23||Supplied by the carrier board|
|B505_CLK0_N||505||B2B, JM3-33||PS_MGTREFCLK0N_505, F24||Supplied by the carrier board|
|B505_CLK1_P||505||U10, CLK2A||PS_MGTREFCLK1P_505, E21||On-board Si5338A|
|B505_CLK1_N||505||U10, CLK2B||PS_MGTREFCLK1N_505, E22||On-board Si5338A|
|B505_CLK2_P||505||N/A||PS_MGTREFCLK2P_505, C21||Not connected|
|B505_CLK2_N||505||N/A||PS_MGTREFCLK2N_505, C22||Not connected|
|B505_CLK3_P||505||U10, CLK1A||PS_MGTREFCLK3P_505, A21||On-board Si5338A|
|B505_CLK3_N||505||U10, CLK1B||PS_MGTREFCLK3N_505, A22||On-board Si5338A|
Table 5: MGT reference clock sources
JTAG access to the Xilinx Zynq-7000 is provided through B2B connector JM2.
B2B Connector Pin
Table 6: JTAG interface signals
Pin 89 JTAGEN of B2B connector JM1 is used to control which device is accessible via JTAG. If set to low or grounded, JTAG interface will be routed to the Xilinx Zynq MPSoC. If pulled high, JTAG interface will be routed to the System Controller CPLD.
System Controller CPLD I/O Pins
Special purpose pins are connected to System Controller CPLD and have following default configuration:
|Pin Name||Mode||Function||Default Configuration|
No hard wired function on PCB. When forced low, PGOOD goes low without effect on power management
|PGOOD||Output||Power Good||Only indirect used for power status, see CPLD description|
|NOSEQ||-||-||No used for Power sequencing, see CPLD description|
Active low reset, gated to POR_B
|JTAGEN||Input||JTAG Select||Low for normal operation, high for CPLD JTAG access|
Table 7: System Controller CPLD special purpose pins.
- 4 x 5 SoM Integration Guide#4x5SoMIntegrationGuide-4x5ModuleControllerIOs
- TE0820 CPLD
- TE0820-REV01_REV02 CPLD
Default PS MIO Mapping
|PS MIO||Function||B2B Pin||Connected to||PS MIO||Function||B2B Pin||Connected to|
|0||SPI0||-||U7-B2, CLK||40..45||-||-||Not connected|
|1||SPI0||-||U7-D2, DO/IO1||46||SD||JM1-17||B2B, SD_DAT3|
|4||SPI0||-||U7-D3, DI/IO0||49||SD||JM1-23||B2B, SD_DAT0|
|5||SPI0||-||U7-C2, CS||50||SD||JM1-25||B2B, SD_CMD|
|6||N/A||-||Not connected||51||SD||JM1-27||B2B, SD_CLK|
|7||SPI1||-||U17-C2, CS||52||USB_PHY||-||U18-31, OTG-DIR|
|8||SPI1||-||U17-D3, DI/IO0||53||USB_PHY||-||U18-31, OTG-DIR|
|9||SPI1||-||U17-D2, DO/IO1||54||USB_PHY||-||U18-5, OTG-DATA2|
|10||SPI1||-||U17-C4, WP/IO2||55||USB_PHY||-||U18-2, OTG-NXT|
|11||SPI1||-||U17-D4, HOLD/IO3||56||USB_PHY||-||U18-3, OTG-DATA0|
|12||SPI1||-||U17-B2, CLK||57||USB_PHY||-||U18-4, OTG-DATA1|
|13..20||eMMC||-||U6, MMC-D0..D7||58||USB_PHY||-||U18-29, OTG-STP|
|21||eMMC||-||U6, MMC-CMD||59||USB_PHY||-||U18-6, OTG-DATA3|
|22||eMMC||-||U6, MMC-CLKR||60||USB_PHY||-||U18-7, OTG-DATA4|
|23||eMMC||-||U6, MMC-RST||61||USB_PHY||-||U18-9, OTG-DATA5|
|24||ETH||-||U8, ETH-RST||62||USB_PHY||-||U18-10, OTG-DATA6|
|26||MIO||JM1-95||B2B, as PJTAG MIO possible||64||ETH||-||U8-53, ETH-TXCK|
|27||MIO||JM1-93||B2B, as PJTAG MIO possible||65..66||ETH||-||U8-50..51, ETH-TXD0..1|
|28||MIO||JM1-99||B2B, as PJTAG MIO possible||67..68||ETH||-||U8-54..55, ETH-TXD2..3|
|29||MIO||JM1-97||B2B, as PJTAG MIO possible||69||ETH||-||U8-56, ETH-TXCTL|
|30||MIO||JM1-92||B2B (UART RX)||70||ETH||-||U8-46, ETH-RXCK|
|31||MIO||JM1-85||B2B (UART TX)||71..72||ETH||-||U8-44..45, ETH-RXD0..1|
|34..37||-||-||Not connected||76||ETH||-||U8-7, ETH-MDC|
|38||I2C||-||U10-12, SCL||77||ETH||-||U8-8, ETH-MDIO|
Table 8: TE0820-03 PS MIO mapping
On-board Gigabit Ethernet PHY is provided with Marvell Alaska 88E1512 chip. The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. SGMII (SFP copper or fiber) can be used directly with the Ethernet PHY, as the SGMII pins are available on the B2B connector JM3. The reference clock input of the PHY is supplied from an on-board 25MHz oscillator (U11), the 125MHz output clock is left unconnected.
Ethernet PHY connection
|PHY Pin||ZYNQ PS||ZYNQ PL||Notes|
|LED0||-||K8||Can be routed via PL to any free PL I/O pin in B2B connector.|
|LED1||-||-||CPLD pin 17.|
|CONFIG||-||-||Wired to the 1.8V.|
|SGMII||-||-||Routed to the B2B connector JM3.|
Table 9: General overview of the Gigabit Ethernet PHY signals
USB PHY is provided by Microchip USB3320. The ULPI interface is connected to the Zynq PS USB0. I/O voltage is fixed at 1.8V. Reference clock input for the USB PHY is supplied by the on-board 52.000000 MHz oscillator (U14).
USB PHY connection
|PHY Pin||ZYNQ Pin||B2B Name||Notes|
|ULPI||MIO52..63||-||Zynq USB0 MIO pins are connected to the USB PHY.|
|REFCLK||-||-||52.000000 MHz from on-board oscillator (U14).|
|REFSEL[0..2]||-||-||Reference clock frequency select, all set to GND selects 52.000000 MHz.|
|RESETB||MIO25||-||Active low reset.|
|CLKOUT||MIO52||-||Connected to 1.8V, selects reference clock operation mode.|
|DP, DM||-||OTG_D_P, OTG_D_N||USB data lines routed to B2B connector JM3 pins 47 and 49.|
|CPEN||-||VBUS_V_EN||External USB power switch active high enable signal, routed to JM3 pin 17.|
|VBUS||-||USB_VBUS||Connect to USB VBUS via a series of resistors, see reference schematics, routed to JM3 pin 55.|
|ID||-||OTG_ID||For an A-device connect to ground, for a B-device left floating. routed from JM3 pin 23.|
Table 10: General overview of the USB PHY signals.
On-board I2C devices are connected to MIO38 (SCL) and MIO39 (SDA) which are configured as I2C0 by default. Addresses for on-board I2C slave devices are listed in the table below:
|I2C Device||I2C Address||Notes|
Table 11: Address table of the I2C bus slave devices.
System Controller CPLD
The System Controller CPLD (U21) is provided by Lattice Semiconductor LCMXO2-256HC (MachXO2 product family). It is the central system management unit with module specific firmware installed to monitor and control various signals of the FPGA, on-board peripherals, I/O interfaces and module as a whole.
See also TE0820 System Controller CPLD page.
eMMC Flash Memory
eMMC Flash memory device(U6) is connected to the ZynqMP PS MIO bank 500 pins MIO13..MIO23. eMMC chips IS21ES08G-JCLI (FLASH - NAND Speicher-IC (64 Gb x 1) MMC ) is used.
By default TE0820-03 module has two 16-bit wide Samsung K4A8G165WB DDR4 SDRAM chips arranged into 32-bit wide memory bus providing total of 2 GBytes of on-board RAM. Different memory sizes are available optionally.
Quad SPI Flash Memory
Two quad SPI compatible serial bus flash MT25QU512ABB8E12-0SIT memory chips are provided for FPGA configuration file storage. After configuration completes the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths to be used. The maximum data transfer rate depends on the bus width and clock frequency.
Gigabit Ethernet PHY
On-board Gigabit Ethernet PHY (U8) is provided with Marvell Alaska 88E1512 IC (U8). The Ethernet PHY RGMII interface is connected to the ZynqMP Ethernet3 PS GEM3. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from an on-board 25.000000 MHz oscillator (U11).
High-speed USB ULPI PHY
Hi-speed USB ULPI PHY (U18) is provided with USB3320 from Microchip. The ULPI interface is connected to the Zynq PS USB0 via MIO52..63, bank 502. The I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.000000 MHz oscillator (U14).
MAC Address EEPROM
A Microchip 24AA025E48 serial EEPROM (U25) contains a globally unique 48-bit node address, which is compatible with EUI-48(TM) specification. The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use. It is accessible over I2C bus with slave device address 0x50.
Programmable Clock Generator
There is a Silicon Labs I2C programmable clock generator Si5338A (U10) chip on the module. It's output frequencies can be programmed using the I2C bus address 0x70 or 0x71. Default address is 0x70, IN4/I2C_LSB pin must be set to high for address 0x71.
A 25.000000 MHz oscillator is connected to the pin IN3 and is used to generate the output clocks. The oscillator has its output enable pin permanently connected to 1.8V power rail, thus making output frequency available as soon as 1.8V is present. Three of the Si5338 clock outputs are connected to the FPGA. One is connected to a logic bank and the other two are connected to the GTR banks.
Once running, the frequency and other parameters can be changed by programming the device using the I2C bus connected between the FPGA (master) and clock generator (slave). For this, proper I2C bus logic has to be implemented in FPGA.
External clock signal supply from B2B connector JM3, pins JM3-32/JM3-34
Fixed input clock signal from reference clock generator SiT8008BI-73-18S-25.000000E (U11)
|IN4||-||LSB of the default I2C address, wired to ground mean address is 0x70|
|Wired to ground|
Bank 65 clock input, pins K9 and J9
MGT reference clock 3 to FPGA Bank 505 PS GTR
MGT reference clock 1 to FPGA Bank 505 PS GTR
|CLK3 A/B||-||Not connected|
Table 12: General overview of the on-board quad clock generator I/O signals
The module has following reference clock signals provided by on-board oscillators and external source from carrier board:
|Clock Source||Schematic Name||Frequency||Clock Destination|
|SiTime SiT8008BI oscillator, U32||PS_CLK||33.333333 MHz||Zynq MPSoC U1,pin R16|
|SiTime SiT8008BI oscillator, U11||-||25.000000 MHz||Quad PLL clock generator U10, pin 3, and Ethernet PHY U8, pin 34|
|SiT8008AI-73-XXS oscillator, U14||-||52.000000 MHz||USB PHY U18, Pin 26|
Table 13: Reference clock signals
|LED||Color||Connected to||Description and Notes|
|D1||Red||PS Config bank 503||Reflects inverted DONE signal when FPGA configuration is completed|
|D2||Green||System Controller CPLD, bank 3||Exact function is defined by SC CPLD firmware|
|D3||Red||PS Config bank 503||Reflects Zynq MPSoC control signal 'ERR_OUT'|
|D4||Green||PS Config bank 503||Reflects Zynq MPSoC control signal 'ERR_STATUS'|
Table 14: On-board LEDs
Power and Power-on Sequence
Power supply with minimum current capability of 3A for system startup is recommended.
|Power Input||Typical Current|
Table 15: Power consumption
* TBD - To Be Determined soon with reference design setup.
Single 3.3V power supply with minimum current capability of 4A for system startup is recommended.
For the lowest power consumption and highest efficiency of the on-board DC-DC regulators it is recommended to power the module from one single 3.3V supply. All input power supplies should have a nominal value of 3.3V. Although the input power supplies can be powered up in any order, it is recommended to power them up simultaneously.
Power Distribution Dependencies
See also Xilinx datasheet DS925 for additional information. User should also check related base board documentation when intending base board design for TE0820 module.
The TE0820 SoM keeping a specific sequence of enabling the on-board DC-DC converters dedicated to the particular functional units of the Zynq chip and powering up the on-board voltages.
Following diagram clarifies the sequence of enabling the particular on-board voltages, which will power-up in descending order as listed in the blocks of the diagram:
For highest efficiency of the on-board DC-DC regulators, it is recommended to use one 3.3V power source for both VIN and 3.3VIN power rails. Although VIN and 3.3VIN can be powered up in any order, it is recommended to power them up simultaneously.
It is important that all carrier board I/Os are 3-stated at power-on until 3.3V_out or 1.8V_out is present on B2B connector JM2 pins 10 and 12, indicating that all on-module voltages have become stable and module is properly powered up.
See Xilinx datasheet DS925 for additional information. User should also check related carrier board documentation when choosing carrier board design for TE0715 module.
|Power Rail Name on B2B Connector||JM1 Pins||JM2 Pins||Direction||Notes|
1, 3, 5
|2, 4, 6, 8||Input||Supply voltage from the carrier board|
|3.3V||-||10, 12||Output||Internal 3.3V voltage level|
|3.3VIN||13, 15||-||Input||Supply voltage from the carrier board|
|1.8V||39||-||Output||Internal 1.8V voltage level|
|JTAG VREF||-||91||Output||JTAG reference voltage.|
Attention: Net name on schematic is "3.3VIN"
|VCCO_64||-||7, 9||Input||High performance I/O bank voltage|
|VCCO_65||-||5||Input||High performance I/O bank voltage|
|VCCO_66||9, 11||-||Input||High performance I/O bank voltage|
Table 16: TE0820-03 power rails
|Bank||Name on Schematic||Voltage||Range|
|64 HP||VCCO_64||User||HP: 1.0V to 1.8V|
|65 HP||VCCO_65||User||HP: 1.0V to 1.8V|
|66 HP||VCCO_66||User||HP: 1.0V to 1.8V|
Table 17: TE0820-03 I/O bank voltages
See Xilinx Zynq UltraScale+ datasheet DS925 for the voltage ranges allowed.
Board to Board Connectors
These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.
4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.
- 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
- 1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)
Connector Mating height
When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height
|Order number||Connector on baseboard||compatible to||Mating height|
The module can be manufactured using other connectors upon request.
Connector Speed Ratings
The LSHM connector speed rating depends on the stacking height; please see the following table:
|Stacking height||Speed rating|
|12 mm, Single-Ended||7.5 GHz / 15 Gbps|
|12 mm, Differential|
6.5 GHz / 13 Gbps
|5 mm, Single-Ended||11.5 GHz / 23 Gbps|
|5 mm, Differential||7.0 GHz / 14 Gbps|
Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).
Connector Mechanical Ratings
- Shock: 100G, 6 ms Sine
- Vibration: 7.5G random, 2 hours per axis, 3 axes total
Variants Currently In Production
Absolute Maximum Ratings
VIN supply voltage
|See EN6347QI and TPS82085SIL datasheets|
|3.3VIN supply voltage||-0.1||3.630||V||Xilinx DS925 and TPS27082L datasheet|
|PS I/O supply voltage, VCCO_PSIO||-0.5||3.630||V||Xilinx document DS925|
|PS I/O input voltage||-0.5||VCCO_PSIO + 0.55||V||Xilinx document DS925|
|HP I/O bank supply voltage, VCCO||-0.5||2.0||V||Xilinx document DS925|
|HP I/O bank input voltage||-0.55||VCCO + 0.55||V||Xilinx document DS925|
|PS GTR reference clocks absolute input voltage||-0.5||1.1||V||Xilinx document DS925|
|PS GTR absolute input voltage||-0.5||1.1||V||Xilinx document DS925|
Voltage on SC CPLD pins
|Lattice Semiconductor MachXO2 datasheet|
|See eMMC datasheet|
Table 18: Module absolute maximum ratings
Recommended Operating Conditions
|VIN supply voltage||3.3||6||V||See TPS82085S datasheet|
|3.3VIN supply voltage||3.3||3.465||V||See LCMXO2-256HC, Xilinx DS925 datasheet|
|PS I/O supply voltage, VCCO_PSIO||1.710||3.465||V||Xilinx document DS925|
|PS I/O input voltage||–0.20||VCCO_PSIO + 0.20||V||Xilinx document DS925|
|HP I/O banks supply voltage, VCCO||0.950||1.9||V||Xilinx document DS925|
|HP I/O banks input voltage||-0.20||VCCO + 0.20||V||Xilinx document DS925|
|Voltage on SC CPLD pins||-0.3||3.6||V||Lattice Semiconductor MachXO2 datasheet|
|Operating Temperature Range||0||85||°C||Xilinx document DS925, extended grade Zynq temperarure range|
Table 19: Recommended operating conditions
Module operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Module size: 50 mm × 40 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8 mm
PCB thickness: 1.6 mm
Highest part on PCB: approximately 5 mm. Please download the step model for exact numbers.
All dimensions are shown in millimeters.
Hardware Revision History
|PCN Link||Documentation Link|
|-||03||current available module revision||-||TE0820-03|
Table 20: Hardware revision history table
Document Change History
Table 21: Document change history
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