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Table of Contents
Overview
The Trenz Electronic TEB0835 is a carrier for TE0835 module which is based on Xilinx UltraScale+ RFSoC.
Refer to http://trenz.org/teb0835-info for the current online version of this manual and other available documentation.
Key Features
- Modules:
- TE0835
- RAM/Storage
- 4Kb EEPROM
- On Board
- Programmable Clock Generator
- I2C Switch IC
- 9x Green LEDs
- 16x RF Transformation
- Reset Push Button
- SDIO Port Expander
- DIP Switch
- Interface
- 10x UMCC Connectors
- 6x SMA Connectors
- 2x Micro USB2.0
- 2x UEC5 Connectors
- 2x UCC8 Connectors
- PCIe x8 Card
- 2x Samtec Razor Beam SS5 (2x80 pol) Board to Board Connectors
- Power
- 5V Input Supply Voltage
- Dimension
- 106.6 x 167.6 mm
Block Diagram
Main Components
- SMA Connectors, J1,J3,J5,J7,J9,J11
- U.FL (UMCC) Connectors, J2,J4,J6,J8, J10, J12...16
- Green LEDs, D6...11
- B2B Connector, J18
- B2B Connector, J17
- Micro SD Card Connector, J28
- Reset Push Button, BTN1
- Mosfet Transistors
- PCIe Connector, J19
- Micro USB2.0 Connectors, J29-J30
- Gigabit RJ45 Connector, J31
- DIP Switch, S1
- UEC5 Connector, J22,J24
- UCC8 Connector, J23,J25
- 4x1 Pin Header, J21
- FTDI, U12
- Green LEDs, D1...3
- 4x1 Pin Header, J20
- EEPROM, U15
- PCIe Card, J26
Initial Delivery State
Storage device name | Content | Notes |
---|---|---|
EEPROM | Programmed | FTDI Configuration |
Configuration Signals
Boot Mode must be set using MODE[3:0] on CPLD provided on the module TE0835.
MODE Signal State | |Boot Mode |
---|---|
--- | ---- |
Signal | B2B | I/O | Note |
---|---|---|---|
RESETN | J17- 36 | Input | Connected to Push Button, BTN1 |
Signals, Interfaces and Pins
Board to Board (B2B) I/Os
FPGA bank number and number of I/O signals connected to the B2B connector:
FPGA Bank | B2B Connector | I/O Signal Count | Voltage Level | Notes |
---|---|---|---|---|
Bank 500 | J17 | 12x Single Ended | 1.8V | MIO14...25 |
Bank 501 | J17 | 20x Single Ended | 1.8V | MIO26...51 |
Bank 505 | J17 | 18x Single Ended, 9x Differential pairs | 0.85V | EXT_CLKIN_PSMGT, RX/TX0...3 |
Bank 128 | J17 | 18x Single Ended, 9x Differential pairs | 0.9V | B128_CLK, RX/TX0...3 |
Bank 129 | J17 | 18x Single Ended, 9x Differential pairs | 0.9V | B129_CLK, RX/TX0...3 |
Bank 65 | J18 | 24x Single Ended, 12x Differential pairs | 1.8V | |
Bank 88 | J18 | 16x Single Ended, 8x Differential pairs | 3.3V | HD_B88 |
JTAG Interface
JTAG access to the TEB0835 SoM is provided through B2B connector J17.
JTAG Signal | B2B Connector |
---|---|
TMS | J17-24 |
TDI | J17-20 |
TDO | J17-18 |
TCK | J17-22 |
Gigabit Ethernet
Signal Name | Connected to | Signal Description | Note |
---|---|---|---|
PHY_MDI0...3 | B2B, J17 | Media Data | |
PHY_LED0...1 | B2B, J17 | Speed/Link Indicators LED | Yellow/Green |
Micro USB2.0
The TEB0835 is equipped with two Micro USB2.0 Connectors J29, J30.
Designator | Signal Name | Connected to | Note |
---|---|---|---|
J29 | D_N/D_P | FTDI,U12 | Data |
USB_VBUS | Diode, D4 | VBUS | |
J30 | USB_N/USB_P | B2B, J17 | Data |
USB0_VBUS | B2B, J17 | VBUS | |
USB0_ID | B2B, J17 | ID |
SMA Connectors
There are 6 SMA Connectors provided for Analog and Digital signals.
Designator | Signal Name | Connected to | Note |
---|---|---|---|
J1 | ADC0_IN | B2B, J18 | |
J3 | ADC2_IN | B2B, J18 | |
J5 | ADC4_IN | B2B, J18 | |
J7 | ADC6_IN | B2B, J18 | |
J9 | DAC0_OUT | B2B, J18 | |
J11 | DAC2_OUT | B2B, J18 |
UMCC Connectors
There are 8 UMCC Connectors provided for Analog and Digital signals input and output.
Designator | Signal Name | Connected to | Note |
---|---|---|---|
J2 | ADC1_IN | B2B, J18 | |
J4 | ADC3_IN | B2B, J18 | |
J6 | ADC5_IN | B2B, J18 | |
J8 | ADC7_IN | B2B, J18 | |
J10 | DAC1_OUT | B2B, J18 | |
J12 | DAC3_OUT | B2B, J18 | |
J13 | DAC4_OUT | B2B, J18 | |
J14 | DAC5_OUT | B2B, J18 | |
J15 | DAC6_OUT | B2B, J18 | |
J16 | DAC7_OUT | B2B, J18 |
UCE5 Connectors
The TEB0835 is equipped with two UCE5 Connectors.
Designator | Signal Name | Connected to | Note |
---|---|---|---|
J22 | B128_TX0...3 | B2B, J17 | 8x Single Ended/ 4x LVDS Pairs |
B128_RX0...3 | B2B, J17 | 8x Single Ended/ 4x LVDS Pairs | |
J24 | B129_TX0...3 | B2B, J17 | 8x Single Ended/ 4x LVDS Pairs |
B129_RX0...3 | B2B, J17 | 8x Single Ended/ 4x LVDS Pairs |
UCC8 Connectors
The TEB0835 is equipped with two UCC8 Connectors.
Designator | Signal Name | Connected to | Note |
---|---|---|---|
J23 | FFA_MPRS | B2B, J17 | |
FFA_MSEL | B2B, J17 | ||
FFA_INTL | B2B, J17 | ||
FFA_RSTL | B2B, J17 | ||
FFA_SCL/FFA_SDA | I2C Switch, U7 | ||
J25 | FFB_MPRS | B2B, J17 | |
FFB_MSEL | B2B, J17 | ||
FFB_INTL | B2B, J17 | ||
FFB_RSTL | B2B, J17 | ||
FFB_SCL/FFB_SDA | I2C Switch, U7 |
PCIe Card
There is a PICe-8x-Kurz card provided on the TEB0835 board.
Signal Name | Connected to | Note |
---|---|---|
B505_RX0...3 | B2B, J17 | 8x Single Ended/ 4x LVDS Pairs |
B505_TX0...3 | B2B, J17 | 8x Single Ended/ 4x LVDS Pairs |
EXT_CLKIN_PSMGT | B2B, J17 | |
PCIE_RSTB_R | B2B, J17 | Pulled up to 1.8V |
MIO Pins
MIO Pin | Connected to | B2B | Notes |
---|---|---|---|
MIO0...12 | SPI FLash, U24-U25 | - | Dual SPI FLash |
MIO13 | LED Green, D1 | - | 3.3V_CPLD |
MIO14...25 | FPGA Bank 500,U1 | J1 | PSMIO |
MIO26...27 | FPGA Bank 501,U1 | J1 | PSMIO |
MIO28...29 | CPLD, U31 | - | UART_TX, UART_RX |
MIO30...31 | FPGA Bank 501, U1 | J1 | PSMIO |
MIO32...33 | EEPROM,U23 | - | I2C_SCL, I2C_SDA |
MIO34...35 | FPGA Bank 501,U1 | J1 | PSMIO |
MIO36 | Gigabit ETH, U20 | - | ETH_RST |
MIO37 | USB2.0, U11 | - | USB_RST |
MIO38...51 | FPGA Bank 501, U1 | J1 | PSMIO |
MIO52...62 | USB2.0, U11 | - | USB |
MIO63...77 | Gigabit ETH, U20 | - | ETH |
Test Points
Test Point | Signal | Connected to | Notes |
---|---|---|---|
TP1 | 5V | B2B, J17 | |
TP2...3 | GND | GND | |
TP4 | ADC0_VCM | B2B, J18 | |
TP5 | ADC1_VCM | B2B, J18 | |
TP6 | USB_VBUS | Micro USB2.0, J29 | |
TP7 | UART0_RX | B2B, J17 | |
TP8 | UART0_TX | B2B, J17 | |
TP9 | ADC2_VCM | B2B, J18 | |
TP10 | ADC3_VCM | B2B, J18 | |
TP11 | ADC4_VCM | B2B, J18 | |
TP12 | ADC5_VCM | B2B, J18 | |
TP13 | ADC6_VCM | B2B, J18 | |
TP14 | ADC7_VCM | B2B, J18 |
On-board Peripherals
Chip/Interface | Designator | Notes |
---|---|---|
EEPROM | U15 | |
FTDI | U12 | |
LEDs | D1...11 | |
Oscillators | U16, U6 | |
PLL Clock Generator | U5 |
EEPROM
Pin | Schematic | Connected to | Notes |
---|---|---|---|
CS | EECS | FTDI, U12 | |
CLK | EECLK | FTDI, U12 | |
DIN | EEDATA | FTDI, U12 |
I2C Address | Designator | Notes |
---|---|---|
A0 | U15 |
LEDs
Designator | Color | Connected to | Active Level | Note |
---|---|---|---|---|
D1 | Green | PG_1.8V | High | |
D2 | Green | PG_3.3V | High | |
D3 | Green | PG_5V | High | |
D6...11 | Green | B2B, J18 | High |
Clock Sources
Designator | Description | Frequency | Note |
---|---|---|---|
U6 | MEMS Oscillator | 25MHz | |
U16 | MEMS Oscillator | 12MHz | |
U5 | PLL Clock Generator | Variable |
Programmable Clock Generator
There is a programmable clock generator on-board (U5) provided in order to generate variable clocks for the module. Programming can be done using I2C via PIN header J20. The I2C Address is 0x70.
U?? Pin | Signal | Connected to | Direction | Note |
---|---|---|---|---|
IN3 | CLK_25MHZ_R | Oscillator, U6 | Input | |
SCL | PLL_SCL | B2B, J17 | Input | |
SDA | PLL_SDA | B2B, J17 | In/Out | |
INTR | PLL_INTR_N | B2B, J17 | Output | |
CLK1 | B129_CLK1 | B2B, J17 | Output | |
CLK2 | B128_CLK1 | B2B, J17 | Output |
Power and Power-On Sequence
Power Supply
Power supply with minimum current capability of 3 A for system startup is recommended.
Power Consumption
Power Input Pin | Typical Current |
---|---|
VIN | TBD* |
* TBD - To Be Determined
Power Distribution Dependencies
Power-On Sequence
Create DrawIO object here: Attention if you copy from other page, objects are only linked.
Power Rails
Power Rail Name | B2B JM17 | B2B JM2 | Direction | Notes |
---|---|---|---|---|
VIN | 1,2,3,4,5,6,8 | - | Input | |
PSBATT | 14 | - | Input | |
3.3V_CPLD | 16 | - | Output |
Board to Board Connectors
The TE0835 has two Samtec Razor Beam on the bottom side.
Order | REF Number | Samtec Number | Type | Mated Height | Data sheet | Comment |
---|---|---|---|---|---|---|
27220 | REF-192552-02 | ST5-80-1.50-L-D-P-TR | Module connector | 5 mm | http://suddendocs.samtec.com/catalog_english/st5.pdf | Standard connector used on module |
27219 | REF-192552-01 | SS5-80-3.50-L-D-K-TR | Baseboard connector | 5 mm | http://suddendocs.samtec.com/catalog_english/ss5.pdf | Standard connector used on board |
With different connectors from the used series other mating heights are possible (according to the Datasheet). The module and base board can be manufactured using other connectors upon request.
Connector Specifications | Value |
---|---|
Insulator material | Liquid crystal polymer |
Stacking height | 5 mm |
Contact material | Phosphor-bronze |
Plating | Au or Sn over 50 μ" (1.27 μm) Ni |
Current rating | 1.6 A per pin (2 pins powered) |
Operating temperature range | -55 °C to +125 °C |
RoHS compliant | Yes |
Connector Speed Ratings
The LSHM connector speed rating depends on the stacking height; please see the following table:
Stacking height | Speed rating |
---|---|
5 mm, Single-Ended | 13.5GHz / 27Gbps |
5 mm, Differential | 20GHz / 40Gbps |
4 mm, Single-Ended | 13GHz / 26Gbps |
4 mm, Differential | 13.5GHz / 27Gbps |
Current Rating
Current rating of Samtec Razor Beam™ SS5/ST5 B2B connectors is 1.6A per pin (2 pins powered).
Connector Mechanical Ratings
- Shock: 100G, 6 ms sawtooth wave
- Vibration: 7.56G 'RMS', 2 hours per axis, 3 axes total
Manufacturer Documentation
Technical Specifications
Absolute Maximum Ratings
Symbols | Description | Min | Max | Unit |
---|---|---|---|---|
V | ||||
V | ||||
°C | ||||
°C |
Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
V | See ???? datasheets. | |||
°C | See Xilinx ???? datasheet. | |||
°C | See Xilinx ???? datasheet. |
Physical Dimensions
Module size: 106.6 mm × 167.7 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 5 mm.
PCB thickness: 1.5 mm.
Currently Offered Variants
Trenz shop TEB0835 overview page | |
---|---|
English page | German page |
Revision History
Hardware Revision History
Date | Revision | Changes | Documentation Link |
---|---|---|---|
2019-11-29 | REV01 | Initial Release | REV01 |
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Document Change History
Date | Revision | Contributor | Description |
---|---|---|---|
| |||
-- | all |
|
Disclaimer
Data Privacy
Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy
Document Warranty
The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.
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Technology Licenses
The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.
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REACH, RoHS and WEEE
REACH
Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).
RoHS
Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.
WEEE
Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.