Template Revision 2.12

  • Module: TRM Name always "TE Series Name" +TRM
    Example: "TE0728 TRM"
  • Carrier: TRM Name usually "TEB Series Name" +TRM
    Example: "TEB0728 TRM"


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Important General Note:

  • If some section is configurable and depends on Firmware, please refer to the addition page (for example CPLD). If not available, add note, that this part is configurable
  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

    • Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)
      • Figure template:


        Create DrawIO object here: Attention if you copy from other page, objects are only linked.


        image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed



      • Table template:

        • Layout macro can be use for landscape of large tables

      • ExampleComment
        12



    • The anchors of the Scroll Title should be named consistant across TRMs. A incomplete list of examples is given below

      • <type>_<main section>_<name>

        • type: Figure, Table
        • main section:
          • "OV" for Overview
          • "SIP" for Signal Interfaces and Pins,
          • "OBP" for On board Peripherals,
          • "PWR" for Power and Power-On Sequence,
          • "B2B" for Board to Board Connector,
          • "TS" for Technical Specification
          • "VCP" for Variants Currently in Production
          •  "RH" for Revision History
        • name: custom, some fix names, see below
      • Fix names:
        • "Figure_OV_BD" for Block Diagram

        • "Figure_OV_MC" for Main Components

        • "Table_OV_IDS" for Initial Delivery State

        • "Table_PWR_PC" for Power Consumption

        • "Figure_PWR_PD" for Power Distribution
        • "Figure_PWR_PS" for Power Sequence
        • "Figure_PWR_PM" for Power Monitoring
        • "Table_PWR_PR" for Power Rails
        • "Table_PWR_BV" for Bank Voltages
        • "Table_TS_AMR" for Absolute_Maximum_Ratings

        • "Table_TS_ROC" for Recommended_Operating_Conditions

        • "Figure_TS_PD" for Physical_Dimensions
        • "Table_VCP_SO" for TE_Shop_Overview
        • "Table_RH_HRH" for Hardware_Revision_History

        • "Figure_RH_HRN" for Hardware_Revision_Number
        • "Table_RH_DCH" for Document_Change_History
    • Use Anchor in the document: add link macro and add "#<anchorname>
    • Refer to Anchror from external : <page url>#<pagename without space characters>-<anchorname>



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Note for Download Link of the Scroll ignore macro:


Download PDF version of this document.


Table of Contents

Overview

The Trenz Electronic TEMB0005 is a carrier for the module TEM00005. The carrier is equipped with a LAN socket, a FTDI JTAG/UART to USB2.0 solution, three low speed and one high speed CRUVI B2B Connectors, a PMod Connector.

Refer to http://trenz.org/temb0005-info for the current online version of this manual and other available documentation.

Notes :

Key Features

Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension



Block Diagram

add drawIO object here.

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .






Main Components

Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .






  1. SMD Header 6x1, J3
  2. RJ45 LAN Socket, J1
  3. B2B Connector, J11
  4. Barrel Jack, J4
  5. Green LEDs, D1...4
  6. User Push Button, S2
  7. PMod 2x6 SMD Host Socket, J9
  8. FT2232H FTDI, U1
  9. Reset Push Button, S1
  10. Micro USB2.0 Socket, J2
  11. Red LED (PG_DCDC), D8
  12. Green LED (5VIN), D5
  13. High Speed CRUVI Connectors, J5
  14. Low Speed CRUVI Connectors, J8
  15. Low Speed CRUVI Connectors, J7
  16. Low Speed CRUVI Connectors, J6

Initial Delivery State

Notes :

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty


Storage device name

Content

Notes

EEPROMProgrammedFTDI Confirguration


Configuration Signals

  • Overview of Boot Mode, Reset, Enables.


Signal

B2BConnected toNote
M_RESETJ11- 11Push Button, S1Module Reset
EN_VADJJ11-110DCDC, U6pull-down, input from module
SEL_VADJJ11-108DCDC, U6

pull-up, input from module.
'low' → 1.8V,
'high'→ 2.5V


Signals, Interfaces and Pins

Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

The carrier TEMB0005 is equipped with a Samtec (SS4) B2B Connector. More information in the following table.

DesignatorsInterfaceI/O Signal CountConnected toNotes
J11






JTAG4x Single EndedFTDI, U1
MSIOD24x Single Ended, 12x Differential PairsCRUVI B2B, J5A0...5, B0...5 (N/P)
MSIO/GPIO8x Single EndedCRUVI B2B, J6A_X0...7
MSIO8x Single EndedCRUVI B2B, J7B_X0...7
MSIO/GPIO8x Single EndedCRUVI B2B, J8C_X0...7
LEDs (2x MSIO, 2x MSIO/GPIO)4x Single EndedD1...4LED1...4
MSIO8x Single EndedPmod Header, J9
Push Button1x Single EndedPush Button, S1M_RESET
Push Button1x Single EndedPush Button, S2pull-up, User Button
MSIO/GPIO/I2C2x Single EndedCRUVI B2B J6I2C
ETH

2x Differential Pairs

2x Single Ended

RJ45 Socket, J1

RJ45 LEDs, J1


Yellow and Green LEDs

UART2x Single EndedFTDI, U1UART RX/TX
FTDI I/O2x Single EndedFTDI, U1BDBUS2-BDBUS3
CLK

1x Single Ended

Oscillator, U8

30 MHz

MSIOD

4x Single Ended

CRUVI B2B, J5

RESET, HSIO, HSO, HSI

IO (3x MSIO, 4x MSIO/GPIO, 2x MSIO GPIO/I2C)9x Single EndedCRUVI B2B, J5
Power Signal1x Single Ended

RED LED, D8


PG_DCDC
SC_SPI4x Single Endedpin header, J3SC_CLK, SC_SDO, SC_SDI, SC_SS
GOLDEN1x Single EndedTestpoint, TP1GOLDEN
JTAGSEL1x Single EndedTestpoint, TP2JTAGSEL


CRUVI B2B Connectors

The TEMB0005 is equipped with three Low Speed Connectors J6...8 and a High Speed Connector J5. These connectors are provided for CRUVI extension cards. More information is provided in the  B2B Connectors section.

SpeedDesignatorsSchematicConnected toNotes
LowJ6A_X0...1B2B, J11alternative GPIO

A_X2...5B2B, J11alternative SPI

A_X6...7B2B, J11alternative I2C0 SDA/SCL
J7B_X0...7|B2B, J11
J8C_X0...7B2B, J11alternative GPIO
HighJ5A0...A5 (N/P)B2B, J11HS I/O
B0...B5 (N/P)B2B, J11HS I/O
HSIO, HI, HO, RESETB2B, J11HS I/O single ended

SMB_ALERT, SMB_SDA, SMB_SCL, MODE, REFCLK

B2B, J11
DI,DO,SCK,SELB2B, J11alternative GPIO


USB2.0 Socket

There is a USB2.0 Socket, J2 provided in order to use JTAG/UART via FTDI, U1.

Pin SchematicConnected toNotes
IDN.CN.C
D+DL_PFTDI, U1Through Line Filter, L1
D-DL_NFTDI, U1Through Line Filter, L1
VbusVBUSDiode, U2


RJ45 LAN Socket

There is a RJ45 Ethernet LAN Socket, J1 connected to B2B, J11 via 2x channels data receive and transmit.

Pin SchematicConnected toNotes
TD+ETH1_TX_PB2B, J11
TD-ETH1_TX_NB2B, J11
RD+ETH1_RX_PB2B, J11
RD-ETH1_RX_NB2B, J11
Green LEDETH1_LED0B2B, J11Link/Activity indicator
Yellow LEDETH1_LED1B2B, J11Speed indicator


PMod Header

There is a PMod Header, J9 connected to the B2B, J11 and all signals are protected from invers polarity by two diodes D6, D7.

SchematicConnected toNotes
PM0...3 (N/P)B2B, J11


Pin Header

There is a Pin Header 6x1, J3 provided for SPI signals. 

Pin SchematicConnected toNotes
13.3VB2B, J11
2GNDB2B, J11
3SC_SDOB2B, J11
4SC_SDIB2B, J11
5SC_SSB2B, J11
6SC_CLKB2B, J11


UART 

There is an UART channel provided in order to communicate with the module and signals are accessible via B2B, J11 through the FTDI, U1.

U1 PinSchematicConnected toNotes
BDBUS1UART1_TXDB2B, J11FTDI receiver input
BDBUS0UART1_RXDB2B, J11FTDI transmitter output



JTAG Interface

JTAG access is provided through B2B connector J11 connected to the FTDI. For more information please refer to the FTDI section.

JTAG Signal

B2B Connector

TMSJ11-14
TDIJ11-8
TDOJ11-10
TCK

J11-12

JTAGSELJ11-9


Test Points

you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OKJ2-120



Test PointSignalConnected toNotes
TP1GOLDENB2B, J11
TP2JTAGSELB2B, J11
TP3PG_DCDCB2B, J11Red LED, D8
TP4VADJRegulator, U6
TP5PROBE_BB2B, J11
TP6PROBE_AB2B, J11


On-board Peripherals

Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection


Chip/InterfaceDesignatorNotes
FTDIU1
TEMB0005 TRM#LEDsD1...D6
Push ButtonsS1-S2
TEMB0005 TRM#EEPROMU3
Oscillator
U4, U8


FTDI FT2232H

The FTDI chip (U8) converts signals from USB2 to variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity of the FT2232H chip which is used in  Multi-Protocol Synchronous Serial Engine (MPPSE) mode for JTAG. 

The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U10.

PinSchematicConnected toNotes
ADBUS0TCKFPGA Bank 1B, U6JTAG interface
ADBUS1TDIFPGA Bank 1B, U6
ADBUS2TDOFPGA Bank 1B, U6
ADBUS3TMS

FPGA Bank 1B, U6

BDBUS0F_UART_TXFPGA Bank 1B, U6UART transmitter output
BDBUS1F_UART_RXFPGA Bank 1B, U6UART receiver input
BDBUS2BDBUS2B2B,J11I/O
BDBUS3BDBUS3B2B,J11I/O
OSCIOSCIOscillator, U4Clock 12 MHz
EECSEECSEEPROM, U3EEPROM Contains FTDI configuration
EECLKEECLKEEPROM, U3
EEDATAEEDATAEEPROM, U3
DM/DPD_N/ D_PMicro USB, J2USB to UART
nRESET3.3V3.3V


EEPROM

There is an EEPROM IC, U3 provided for storing the FTDI (U1) configuration. 

PinSchematicNotes
DI/DOEEDATAData
CLKEECLKClock
CSEECSSelect


The I2C address is as the following.

I2C AddressDesignatorNotes
0x70U3


Push Buttons

There are two Push Buttons provided on the TEMB0005 designated as S1, S2. The Push Button S2 is considered to be as user buttons and S1 is provided to reset the module on the carrier.

DesignatorSchematicConnected toFunctionalityNote
S1M_RESETB2B, J11Reset
S2ButtonBUTTONUser Button


LEDs

There are 4 green LEDs provided as user LEDs.

DesignatorColorConnected toActive LevelNote
D1...D4GreenB2B, J11Active HighUser LEDS
D5Green5VINActive HighPower Status LED
D6RedPG_DCDCActive Lowfrom module



Clock Sources

DesignatorDescriptionFrequencyNote
U4MEMS Oscillator12 MHz
U8MEMS Oscillator30 MHz


Power and Power-On Sequence

In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

Power supply with minimum current capability of 2 A for system startup is recommended.

Power Consumption

Power Input PinTypical Current
5VINTBD*


* TBD - To Be Determined

Power Distribution Dependencies




Power-On Sequence




Power Rails

Power Rail Name

B2B Connector J11 Pin

CRUVI Connector J5 Pin

B2B Connector J6 Pin

B2B Connector J7 Pin

B2B Connector J8 PinDirectionNotes
3.3V1, 2, 3, 4-101010Output
VDAJ2236---Output
5VIN--121212Output


Board to Board Connectors

  • This section is optional and only for modules.
  • use "include page" macro and link to the general B2B connector page of the module series,

    For example: 6 x 6 SoM LSHM B2B Connectors

CRUVI B2B Connectors

Technical Specifications

Absolute Maximum Ratings

SymbolsDescriptionMinMaxUnit
VINInput Supply Voltage2.534V
T_STGStorage Temperature-55125°C


Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

ParameterMinMaxUnitsReference Document
VIN4.065.58VSee the carrier datasheets.
T_OPT070°CPush button datasheet.


Physical Dimensions

PCB thickness: 1.6 mm.

In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .






Currently Offered Variants 

Set correct link to the shop page overview table of the product on English and German.

Example for TE0706:

    ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0706

    DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0706


Trenz shop TEMB0005 overview page
English pageGerman page


Revision History

Hardware Revision History

Set correct links to download  arrier, e.g. TE0706 REV02:

  TE0706-02  ->   https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/REV02/Documents

Note:

  • Date format:  YYYY-MM-DD


DateRevisionChangesDocumentation Link
2020-05-20REV01

Initial Release

---


Hardware revision number can be found on the PCB board together with the module model number separated by the dash.




Document Change History

  • Note this list must be only updated, if the document is online on public doc!
  • It's semi automatically, so do following
    • Add new row below first

    • Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

    • Metadata is only used of compatibility of older exports


DateRevisionContributorDescription

  • Initial Release

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all

  • --


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