Template Revision 2.12

  • Module: TRM Name always "TE Series Name" +TRM
    Example: "TE0728 TRM"
  • Carrier: TRM Name usually "TEB Series Name" +TRM
    Example: "TEB0728 TRM"


<!-- tables have all same width (web max 1200px and pdf full page(640px), flexible width or fix width on menu for single column can be used as before) -->
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Important General Note:

  • If some section is configurable and depends on Firmware, please refer to the addition page (for example CPLD). If not available, add note, that this part is configurable
  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

    • Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)
      • Figure template:


        Create DrawIO object here: Attention if you copy from other page, objects are only linked.


        image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed



      • Table template:

        • Layout macro can be use for landscape of large tables

      • ExampleComment
        12



    • The anchors of the Scroll Title should be named consistant across TRMs. A incomplete list of examples is given below

      • <type>_<main section>_<name>

        • type: Figure, Table
        • main section:
          • "OV" for Overview
          • "SIP" for Signal Interfaces and Pins,
          • "OBP" for On board Peripherals,
          • "PWR" for Power and Power-On Sequence,
          • "B2B" for Board to Board Connector,
          • "TS" for Technical Specification
          • "VCP" for Variants Currently in Production
          •  "RH" for Revision History
        • name: custom, some fix names, see below
      • Fix names:
        • "Figure_OV_BD" for Block Diagram

        • "Figure_OV_MC" for Main Components

        • "Table_OV_IDS" for Initial Delivery State

        • "Table_PWR_PC" for Power Consumption

        • "Figure_PWR_PD" for Power Distribution
        • "Figure_PWR_PS" for Power Sequence
        • "Figure_PWR_PM" for Power Monitoring
        • "Table_PWR_PR" for Power Rails
        • "Table_PWR_BV" for Bank Voltages
        • "Table_TS_AMR" for Absolute_Maximum_Ratings

        • "Table_TS_ROC" for Recommended_Operating_Conditions

        • "Figure_TS_PD" for Physical_Dimensions
        • "Table_VCP_SO" for TE_Shop_Overview
        • "Table_RH_HRH" for Hardware_Revision_History

        • "Figure_RH_HRN" for Hardware_Revision_Number
        • "Table_RH_DCH" for Document_Change_History
    • Use Anchor in the document: add link macro and add "#<anchorname>
    • Refer to Anchror from external : <page url>#<pagename without space characters>-<anchorname>



-----------------------------------------------------------------------


Note for Download Link of the Scroll ignore macro:


Download PDF version of this document.


Table of Contents

Overview

The Trenz Electronic TEMB0005 is an industrial-grade carrier for the module TEM00005. The carrier is equipped with a Gigabit LAN socket, a USB2.0 interface, two different Samtec B2B Connectors, three Tiger Claw Samtec Dual Sockets, a PMod Connector, a pin header and  a FTDI.  Find more information in the FTDI sections.

Refer to http://trenz.org/temb0005-info for the current online version of this manual and other available documentation.

Notes :

Key Features

Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension



Block Diagram

add drawIO object here.

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .






Main Components

Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .






  1. SMD Header 6x1, J3
  2. RJ45 LAN Socket, J1
  3. B2B Razor Beam Connector, J11
  4. Barrel Jack, J4
  5. Green LEDs, D1...4
  6. User Push Button, S2
  7. PMod 2x6 SMD Host Socket, J9
  8. FT2232H FTDI, U1
  9. Reset Push Button, S1
  10. Micro USB2.0 Socket, J2
  11. Red LED (PG_DCDC), D8
  12. Green LED (5VIN), D5
  13. B2B Mezzanine Connector, J5
  14. Dual Wipe Socket, J8
  15. Dual Wipe Socket, J7
  16. Dual Wipe Socket, J6

Initial Delivery State

Notes :

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty


Storage device name

Content

Notes

EEPROMProgrammedFTDI Confirguration


Configuration Signals

  • Overview of Boot Mode, Reset, Enables.


Signal

B2BConnected toNote

RESET

J11- 54B2B, J5General Reset
M_RESETJ11- 11Push Button, S1Module Reset


Signals, Interfaces and Pins

Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

FPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes































USB2.0 Socket

Pin SchematicConnected toNotes

























RJ45 LAN Socket

Pin SchematicConnected toNotes

























Dual Sockets

Pin SchematicConnected toNotes

























PMod Header

Pin SchematicConnected toNotes

























Pin Header

Pin SchematicConnected toNotes

























UART 

PinSchematicU?? PinNotes

UART-Tx
Driver Input

UART-Rx
Reciever Output



JTAG Interface

JTAG access is provided through B2B connector J11 connected to the FTDI. For more information please refer to the FTDI section.

JTAG Signal

B2B Connector

TMSJ11-14
TDIJ11-8
TDOJ11-10
TCK

J11-12

JTAGSELJ11-9


Test Points

you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OKJ2-120



Test PointSignalConnected toNotes
TP1GOLDENB2B, J11
TP2JTAGSELB2B, J11
TP3PG_DCDCB2B, J11Red LED, D8
TP4VADJRegulator, U6
TP5PROBE_BB2B, J11
TP6PROBE_AB2B, J11


On-board Peripherals

Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection


Chip/InterfaceDesignatorNotes
















EEPROM

MIO PinSchematicU?? PinNotes










MIO PinI2C AddressDesignatorNotes





LEDs

DesignatorColorConnected toActive LevelNote
D1...D4GreenB2B, J11Active High
D5Green5VINActive High
D6RedPG_DCDCActive Low


CAN Transceiver

BankSchematicU?? PinNotes

D-Tx
Driver Input

R-Rx
Reciever Output



Clock Sources

DesignatorDescriptionFrequencyNote
U4MEMS Oscillator12 MHz
U8MEMS Oscillator30 MHz


Programmable Clock Generator

There is a programmable clock generator on-board (U??) provided in order to generate variable clocks for the module. Programming can be done using I2C via PIN header J??.  The I2C Address is 0x??.

U?? Pin
SignalConnected toDirectionNote

IN0





IN1



IN2



IN3



XAXB





SCLK



SDA



OUT0



OUT1



OUT2



OUT3



OUT4



OUT5



OUT6



OUT7



OUT8/OUT9




Power and Power-On Sequence

In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

Power supply with minimum current capability of xx A for system startup is recommended.

Power Consumption

Power Input PinTypical Current
5VINTBD*


* TBD - To Be Determined

Power Distribution Dependencies




Power-On Sequence




Power Rails

Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes

























Bank Voltages

Bank          

Schematic Name

Voltage

Notes






























Board to Board Connectors

  • This section is optional and only for modules.
  • use "include page" macro and link to the general B2B connector page of the module series,

    For example: 6 x 6 SoM LSHM B2B Connectors

? x ? modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.

Technical Specifications

Absolute Maximum Ratings

SymbolsDescriptionMinMaxUnit




V




V




V











Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

ParameterMinMaxUnitsReference Document



VSee ???? datasheets.



VSee Xilinx ???? datasheet.



°CSee Xilinx ???? datasheet.



°CSee Xilinx ???? datasheet.


Physical Dimensions

PCB thickness: 1.7 mm.

In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .






Currently Offered Variants 

Set correct link to the shop page overview table of the product on English and German.

Example for TE0706:

    ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0706

    DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0706


Trenz shop TEMB0005 overview page
English pageGerman page


Revision History

Hardware Revision History

Set correct links to download  arrier, e.g. TE0706 REV02:

  TE0706-02  ->   https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/REV02/Documents

Note:

  • Date format:  YYYY-MM-DD


DateRevisionChangesDocumentation Link
2020-05-20REV01Initial Release---


Hardware revision number can be found on the PCB board together with the module model number separated by the dash.




Document Change History

  • Note this list must be only updated, if the document is online on public doc!
  • It's semi automatically, so do following
    • Add new row below first

    • Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

    • Metadata is only used of compatibility of older exports


DateRevisionContributorDescription

  • Initial Release

--

all

  • --


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