Notes :

  • only parts of the extract macro will be shown on the internal pages



TE0803-03-5DI21-AS

1 2

3456

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Module type

TETrenz Electronic
Module name
0803080608070808082008210835


Module Revision
01

PCB Revision 1 (initial)

Device name
2345679ABDFZU+
ZU2ZU3ZU4ZU5ZU6ZU7

ZU9

ZU11ZU15ZU17ZU19
KMNPJRXYSTUV

ZU+ RFSoC

ZU21ZU25ZU27ZU28ZU29ZU39ZU42ZU43ZU46ZU47ZU48ZU49
PS and engine type and speed grade
ABDFGHKMNPRSTXY
CG-1EG-1EV-1CG-2EG-2EV-2CG-3EG-3EV-3CG-1LEG-1LEV-1LCG-2LDR-1DR-2
Temp range (Tstr. abs. = -65°C to +150°C)
XC  (Standard-Grade)XA  (Automotive-Grade)XQ  (Defense-Grade)
Extended (0/+100°C)Industrial (–40/+100°C)Automotive(–40/125°C)Ind. (I)Automotive (Q)Industrial Military
EIQTRNM
DDR memory (TE0803/0807/0808: 4x; TE0820/0821: 2x)
0Not populated
1

TE0803/0807/0808: 2 GByte. TE0820/0821: 1 GByte

Commercial4Gbit - NT5AD256M16D4-HR #29165
2TE0803/0807/0808/0812: 4 GByte. TE0820/0821: 2 GByte.Industrial8Gbit - K4A8G165WB-BIRC#28375
3TE0803/0807/0808: 8 GByte. TE0820/0821: 4 GByteCommercial16Gbit (2 die) - K4AAG165WB-MCRC0CV#27787
4TE0803/0807/0808/0865: 8 GByte. TE0820/0821: 4 GByteIndustrial16Gbit - MT40A1G16RC-062E IT:B#30258
5TE0803/0807/0808: 4 GByte. TE0820/0821: 2 GByteAutomotive8Gbit - MT40A512M16JY-083E AAT:B#30246
6TE0803/0807/0808: 8 GByte. TE0820/0821: 4 GByteIndustrial16Gbit (2 die) - H5ANAG6NCMR-XNI#30673
7TE0813/TE0817/TE0818: 4 GByteIndustrial8GBit -  IS43QR16512A-083TBLI#30714
UTE0802/0823: 1 GByteIndustrial8Gbit - IS43LQ32256A-062BLI (LPDDR4)#29797
VTE0802/0823: 1 GByteCommercial8Gbit - K4F8E304HB-MGCJ (LPDDR4)#28217
XDDR SODIMM Socket
YIC Socket (IC Debug Holder)
Flash memory (2x for all modules)
0Not populated---
1TE0803/0807/0808/0820/0821/0823/0865: 128MByteIndustrial512Mbit - MT25QU512ABB8E12-0SIT#29292
2TE0803/0807/0808/0820/0821/0823: 64MByteIndustrial256Mbit - MT25QL256ABA8E12-1SIT#28856
3TE0803/0807/0808/0820/0821/0823: 256MByteIndustrial1Gbit - MT25QU01GBBB8E12-0SIT#28264
4TE0803/0807/0808/0820/0821/0823: 512MByte.Industrial2Gbit - MT25QU02GCBB8E12-0SIT#28286
5TE0803/0807/0808/0820/0821/0823: 64MByteAutomotive256Mbit - MT25QU256ABA8E12-0AAT#30245

6

TE0818/TE0830: 128MByteExtended (-40 .. +105 °C)512MBit - IS25WP512M-RHLE (not supported)#29423
7TE0812: 256MByte
Industrial1Gbit - MT25QL01GBBB8E12-0SIT#29992
eMMC (for TE0820/0821/0823)
-Not present (for TE0803/07/08)---
0Not populated (for TE0820/0821/0823)---
FTE00820/0821/0823: 8 GByte Industrial8GByte - IS21ES08G-JCLI#29169
GTE00820/0821/0823: 8 GByteCommercial8GByte - KLM8G1GETF-B041#28669 (NRND)
HTE00820/0821/0823/0812: 32 GByte
32GByte - ????
KTE00820/0821/0823: 64 GByteIndustrial64GByte - IS21ES64G-JCLI#29799
Other options (Connectors, custom options)
ModuleVariationDescription
AllAStandard connector height
LLow profile connector height
CStandard connector height, FPGA: XCZUxxx-xxxxxxxxx4524 (without encryption)
DLow profile connector height, FPGA: XCZUxxx-xxxxxxxxx4524 (without encryption)
...Custom assembly variant, look additional table below
Additional options
BlankNo extra options
SStarter Kit
KWith heat spreader
PPrototype
TFPGA supplied by customer


Other assembly variations (position 17)


ModuleVariationDescription
TE0803AStandard profile B2B connectors ST5-80-1.50-L-D-P-TR #27220

L

Low profile B2B connectors ST5-80-1.00-L-D-P-TR #27017
RCustom: standard hight connectors, R14 - 487k (PS_1V8 = 3.3V), U6 - SIT8008BI-71-33E-25.000000E, U32 - SiT8008BI-71-33E-33.333333E, U28 DNP, C81 DNP
CB2B connectors: standard profile , FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
XCustom: standard hight connectors, U41 → SBAS70-04LT1G
TE0807AStandard profile B2B connectors ST5-80-1.50-L-D-P-TR #27220
LLow profile B2B connectors ST5-80-1.00-L-D-P-TR #27017
CB2B connectors: standard profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
XB2B connectors: standard profile, U41 → SBAS70-04LT1G
TE0808AStandard profile B2B connectors ST5-80-1.50-L-D-P-TR #27220
LLow profile B2B connectors ST5-80-1.00-L-D-P-TR #27017
CB2B connectors: standard profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
XB2B connectors: standard profile, U41 → SBAS70-04LT1G
TE0812

A

Space grade model
BTest model
TE0820


AStandard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903

L

Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125
CB2B connectors: standard profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
IB2B connectors: standard profile, Ethernet PHY  U8 - 88E1512-A0-NNP2I000 DNP, no screws/spacers
JStandard assembly option, no screws/spacers
TE0821AStandard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903
CStandard profile B2B connectors, FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification

L

Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125
TE0823AStandard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903, HyperFlash/HyperRAM DNP
CStandard profile B2B connectors, FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification

L

Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125
TE0830AStandard assembly option PICMG ASP connectors
TE0850AStandard assembly option
BWithout FAN
CLanes SATA_R_SL, SATA_R_SCL disconnected from J1. Clock CK (U14/U73) connected to J1 
TEB0911AStandard assembly option