Template Revision 2.16
- Module: TRM Name always "TE Series Name" +TRM
Example: "TE0728 TRM" - Carrier: TRM Name usually "TEB Series Name" +TRM
Example: "TEB0728 TRM"
Template Change history: - 2.15 to 2.16
- remove fix table of content and page layout ( split page layout make trouble with pdf export)
- 2.14 to 2.15
- add excerpt macro to key features
- 2.13 to 2.14
- add fix table of content
- add table size as macro
- 2.12 to 2.13
- Changed controller Signals section
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Note for Download Link of the Scroll ignore macro: |
Table of Contents |
Overview
The Trenz Electronic CR00040-01 is an CRUVI peripheral module with multiple sensors
Refer to http://trenz.org/cr00040-info for the current online version of this manual and other available documentation.
Key Features
Note: 'description: Important components and connector or other Features of the module → please sort and indicate assembly options Key Features' must be split into 6 main groups for modules and mainboards: - SoC/FPGA
- Package: SFVC784
- Device: ZU2...ZU5*
- Engine: CG, EG, EV*
- Speed: -1LI, -2LE,*, **
- Temperature: I, E,*, **
- RAM/Storage
- Low Power DDR4 on PS
- Data width: 32bit
- Size: def. 2GB*
- Speed:***
- eMMC
- Data width: 8Bit
- size: def. 8GB *
- QSPI boot Flash in dual parallel mode (size depends on assembly version)
- Data width: 8bit
- size: def. 128MB *
- HyperRAM/Flash (optional, default not assembled)
- MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
- On Board
- Lattice LCMXO2
- PLL SI5338
- Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
- Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
- Interface
- 132 x HP PL I/Os (3 banks)
- ETH
- USB
- 4 GTR (for USB3, Sata, PCIe, DP)
- MIO for UART
- MIO for SD
- MIO for PJTAG
- JTAG
- Ctrl
- Power
- 3.3V-5V Main Input
- 3.3V Controller Input
- Variable Bank IO Power Input
- Dimension
- Notes
- * depends on assembly version
- ** also non low power assembly options possible
- *** depends on used U+ Zynq and DDR4 combination
Key Features' must be split into 6 main groups for carrier: - Modules
- TE0808, TE807, TE0803,...
- RAM/Storage
- On Board
- Interface
- E.g. ETH, USB, B2B, Display port
- Power
- E.g. Input supply voltage
- Dimension
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- EEPROM/Unique Identifier
- CO2 Sensor (temperatur/humidity)
- Air Pressure Sensor
- Ambient Light Sensor
- On-board
- Power
- Dimension
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Block Diagram
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Main Components
Notes : - Picture of the PCB (top and bottom side) with labels of important components
- Add List below
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- ...
- ...
- ...
Initial Delivery State
Notes : Only components like EEPROM, QSPI flash can be initialized by default at manufacture. If there is no components which might have initial data ( possible on carrier) you must keep the table empty |
Storage device name | Content | Notes |
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EEPROM | EUI-48 Node Identity | at offset 0xFA, 6 bytes |
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Signals, Interfaces and Pins
Notes : - For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
- For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
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Board to Board (B2B) I/Os
FPGA bank number and number of I/O signals connected to the B2B connector:
FPGA Bank | B2B Connector | I/O Signal Count | Voltage Level | Notes |
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On-board Peripherals
Notes : - add subsection for every component which is important for design, for example:
- Two 100 Mbit Ethernet Transciever PHY
- USB PHY
- Programmable Clock Generator
- Oscillators
- eMMCs
- RTC
- FTDI
- ...
- DIP-Switches
- Buttons
- LEDs
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Notes : In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection |
Chip/Interface | Designator | Notes |
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EEPROM | U1 |
| CO2 Sensor | U2 |
| Ambient Light Sensor | U3 |
| Pressure Sensor | U4 |
| RGB LED | D2 |
| Buzzer | LS1 |
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Quad SPI Flash Memory
Notes : Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options. |
MIO Pin | Schematic | U?? Pin | Notes |
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RTC
MIO Pin | Schematic | U? Pin | Notes |
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MIO Pin | I2C Address | Designator | Notes |
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EEPROM
J1 Pin | Schematic | U1 Pin | Notes |
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2 | SCL | 1 |
| 1 | SDA | 3 |
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I2C Address | Designator | Notes |
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1010_011x | U1 |
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LEDs
Designator | Color | Connected to | Active Level | Note |
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D2 | Red | D0 | High |
| D2 | Green | D1 | High |
| D2 | Blue | D2 | High |
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Power and Power-On Sequence
In 'Power and Power-on Sequence' section there are three important digrams which must be drawn: - Power on-sequence
- Power distribution
- Voltage monitoring circuit
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Power Supply
Power supply with minimum current capability of xx A for system startup is recommended.
Power Consumption
Power Input Pin | Typical Current |
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VCC | TBD* | VBUS | 0 (not used) |
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* TBD - To Be Determined
Power Distribution Dependencies
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Power Rails
Power Rail Name | B2B Connector J1 Pin | B2B Connector J2 Pin | B2B Connector J3 Pin | Direction | Notes |
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VCC | 10 | 1 | - | in |
| VBUS | 12 | - | 1 | n/a | not used |
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Board to Board Connectors
- This section is optional and only for modules.
use "include page" macro and link to the general B2B connector page of the module series, For example: 6 x 6 SoM LSHM B2B Connectors
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CR00040 module uses one Samtec connector at the bottom side.
1 x ?-?, (12 pins, 6 per row)
Operating Temperature: -??°C ~ ??°C
Current Rating: ??A per Contact
Number of Positions: ??
Number of Rows: 2
Technical Specifications
Absolute Maximum Ratings
Symbols | Description | Min | Max | Unit |
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VCC | Main Power | -0.3 | 4.8 | V | VBUS |
| n/a | n/a | V | SDA, SCL |
| -0.3 | 3.6 | V | INT1 |
| -0.3 | VCC+0.3 | V | INT2 |
| -0.3 | 3.6 | V | D0,D1,D2 |
| -5 | 3.6 | V | D3 |
| -25* | 25 | V | Temperature |
| -10 | 60 | °C |
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Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Parameter | Min | Typ | Max | Units | Reference Document |
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VCC | 2.4 | 3.3 | 3.6 | V | See LPS22HBTR datasheet. | VBUS | n/a | n/a | n/a | V | not used | Storage Temperature | 10 | - | 50 | °C | See SCD40 datasheet. | Short term storage Temperature | -40 | - | 70 | °C | See SCD40 datasheet. | Operating Temperature | -10 | - | 60 | °C | See SCD40 datasheet. |
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Physical Dimensions
PCB thickness: 1.6 mm.
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Currently Offered Variants
Revision History
Hardware Revision History
Date | Revision | Changes | Documentation Link |
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| 01 | Initial |
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Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
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Document Change History
- Note this list must be only updated, if the document is online on public doc!
- It's semi automatically, so do following
Add new row below first Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template - Metadata is only used of compatibility of older exports
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Date | Revision | Contributor | Description |
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