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Company | Trenz Electronic GmbH |
---|---|
PCN Number | PCN-20220725 |
Title | TE0820-04 to TE0820-05 Hardware Revision Change |
Subject | Hardware Revision Change |
Issue Date | 2022-08-15 |
This change affects all Trenz Electronic TE0820 SoMs: TE0820-04*.
Affected Product | Replacement |
---|---|
TE0820-04-2AE21MA | TE0820-05-2AE21MA |
TE0820-04-2AE21MAZ | TE0820-05-2AE21MAZ |
TE0820-04-2AI21MA | TE0820-05-2AI21MA |
TE0820-04-2AI21MAZ | TE0820-05-2AI21MAZ |
TE0820-04-2AI21MAZ | TE0820-05-2AI21MAZ |
TE0820-04-2AI21MC | TE0820-05-2AI21MC |
TE0820-04-2AI21MCZ | TE0820-05-2AI21MCZ |
TE0820-04-2BE21MA | TE0820-05-2BE21MA |
TE0820-04-2BE21MAJ | TE0820-05-2BE21MAJ |
TE0820-04-2BE21MAZ | TE0820-05-2BE21MAZ |
TE0820-04-2BE21ML | TE0820-05-2BE21ML |
TE0820-04-2BE21MLZ | TE0820-05-2BE21MLZ |
TE0820-04-2BI21MA | TE0820-05-2BI21MA |
TE0820-04-2BI21MAZ | TE0820-05-2BI21MAZ |
TE0820-04-2BI21ML | TE0820-05-2BI21ML |
TE0820-04-2BI21MLZ | TE0820-05-2BI21MLZ |
TE0820-04-3AE21MA | TE0820-05-3AE21MA |
TE0820-04-3AE21MAZ | TE0820-05-3AE21MAZ |
TE0820-04-3BE21MA | TE0820-05-3BE21MA |
TE0820-04-3BE21MAZ | TE0820-05-3BE21MAZ |
TE0820-04-3BE21ML | TE0820-05-3BE21ML |
TE0820-04-3BE21MLZ | TE0820-05-3BE21MLZ |
TE0820-04-3BI21ML | TE0820-05-3BI21ML |
TE0820-04-3BI21MLZ | TE0820-05-3BI21MLZ |
TE0820-04-4AE21MA | TE0820-05-4AE21MA |
TE0820-04-4AE21MAZ | TE0820-05-4AE21MAZ |
TE0820-04-4AI21MC | TE0820-05-4AI21MC |
TE0820-04-4AI21MCZ | TE0820-05-4AI21MCZ |
TE0820-04-4AI21MI | TE0820-05-4AI21MI |
TE0820-04-4BI21PL | TE0820-05-4BI21PL |
TE0820-04-4BI21PLZ | TE0820-05-4BI21PLZ |
TE0820-04-4DE21MA | TE0820-05-4DE21MA |
TE0820-04-4DE21MAZ | TE0820-05-4DE21MAZ |
TE0820-04-4DI21MA | TE0820-05-4DI21MA |
TE0820-04-4DI21MAZ | TE0820-05-4DI21MAZ |
TE0820-04-5DI21MA | TE0820-05-5DI21MA |
TE0820-04-5DI21MAZ | TE0820-05-5DI21MAZ |
TE0820-04-5DR21MA | TE0820-05-5DR21MA |
TE0820-04-5DR21MAZ | TE0820-05-5DR21MAZ |
TE0820-04-S002C1 | TE0820-05-S002C1 |
Type: Schematic Change
Reason: BOM Optimization
Impact: None. Minor changes in electrical characteristics.
Type: Schematic Change
Reason: BOM Optimization
Impact: None. Minor changes in electrical characteristics.
Type: Schematic Change
Reason: BOM Optimization
Impact: None. Minor changes in electrical characteristics.
Type: Schematic Change
Reason: Follow Xilinx recommendations.
Impact: None. Minor changes in electrical characteristics.
Type: Schematic Change
Reason: Allow automatic DDR4 testing.
Impact: None.
Type: Schematic Change
Reason: BOM Optimization
Impact: None. Minor changes in electrical characteristics.
Type: Schematic Change
Reason: Power management improvement.
Impact: None.
Type: Schematic Change
Reason: Improve power management.
Impact: None.
Type: Schematic Change
Reason: Improve module reset and power-up.
Impact: Changed reset and power-up handling. Please, verify that the module meets your requierements.
Type: Schematic Change
Reason: Connect both PHY signals to SoC.
Impact: None.
Type: Schematic Change
Reason: Improvement to allow "POR_OVERRIDE" state change.
Impact: None.
Type: Schematic Change
Reason: Improvement to protect reset input signal.
Impact: None.
Type: Schematic Change
Reason: Use latest component data.
Impact: None.
Type: Documentation Update
Reason: Power documentation improvement.
Impact: None.
From XXXXX, after old stock is gone. If the new revision is not suitable for your application and still the former revision of the board is needed, please contact us.
If you have any questions related to this PCN, please contact Trenz Electronics Technical Support at
phone
national calls: 05741 3200-0
international calls: 0049 5741 3200-0
Any projected dates in this PCN are based on the most current product information at the time this PCN is being issued, but they may change due to unforeseen circumstances. For the latest schedule and any other information, please contact your local Trenz Electronic sales office, technical support or local distributor.
This PCN follows JEDEC Standard J-STD-046.