• Module: TRM Name always "TE Series Name" +TRM
    Example: "TE0728 TRM"

Template Change history:

DateVersionChangesAuthor

4.1
  • Minor changes
    • Notes
    • Tables
ED

4.0
  • Rework for smaller TRM which can be generated faster
    • Reduce Signal Interfaces Pin
    • Reduce On Board Perihery
    • Reduce Power
    • Move Configuration Signals from Overview to own section
JH

3.12
  • Version History
    • changed from list to table
  • all
    • changed title-alignment for tables from left to center
ma

3.11
  • update "Recommended Operating Conditions" section


3.1
  • New general notes for temperature range to "Recommended Operating Conditions"


3.02
  • add again fix table of content with workaround to use it for pdf and wiki
  • Export Link for key features examples
    • Notes for different Types (with and without Main FPGA)
  • Export Link for Signals, Interfaces and Pins examples
    • Notes for different Types (Modul, Modul Hypride, Evalboard, Carrier)


3.01
  • remove fix table of content and page layout ( split page layout make trouble with pdf export)
  • changed and add note to signal and interfaces, to on board periphery section
  • ...(not finished)


3.00
  • → separation of Carrier/Module and evaluation kit TRM


2.15
  • add excerpt macro to key features


2.14
  • add fix table of content
  • add table size as macro



Important General Note:

  • If some section is configurable and depends on Firmware, please refer to the addition page (for example CPLD). If not available, add note, that this part is configurable
  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

    • Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)
      • Figure template:


        Create DrawIO object here: Attention if you copy from other page, objects are only linked.


        image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed



      • Table template:

        • Layout macro can be use for landscape of large tables

      • ExampleComment
        12



    • The anchors of the Scroll Title should be named consistant across TRMs. A incomplete list of examples is given below

      • <type>_<main section>_<name>

        • type: Figure, Table
        • main section:
          • "OV" for Overview
          • "SIP" for Signal Interfaces and Pins,
          • "OBP" for On board Peripherals,
          • "PWR" for Power and Power-On Sequence,
          • "B2B" for Board to Board Connector,
          • "TS" for Technical Specification
          • "VCP" for Variants Currently in Production
          •  "RH" for Revision History
        • name: custom, some fix names, see below
      • Fix names:
        • "Figure_OV_BD" for Block Diagram

        • "Figure_OV_MC" for Main Components

        • "Table_OV_IDS" for Initial Delivery State

        • "Table_PWR_PC" for Power Consumption

        • "Figure_PWR_PD" for Power Distribution
        • "Figure_PWR_PS" for Power Sequence
        • "Figure_PWR_PM" for Power Monitoring
        • "Table_PWR_PR" for Power Rails
        • "Table_PWR_BV" for Bank Voltages
        • "Table_TS_AMR" for Absolute_Maximum_Ratings

        • "Table_TS_ROC" for Recommended_Operating_Conditions

        • "Figure_TS_PD" for Physical_Dimensions
        • "Table_VCP_SO" for TE_Shop_Overview
        • "Table_RH_HRH" for Hardware_Revision_History

        • "Figure_RH_HRN" for Hardware_Revision_Number
        • "Table_RH_DCH" for Document_Change_History
    • Use Anchor in the document: add link macro and add "#<anchorname>
    • Refer to Anchror from external : <page url>#<pagename without space characters>-<anchorname>



-----------------------------------------------------------------------


Note for Download Link of the Scroll ignore macro:


Download PDF version of this document.

Overview

The Trenz Electronic TE0817 is an industrial grade MPSoC SOM integrating a Xilinx Zynq UltraScale+ MPSoC, DDR4 SDRAM with 64-Bit width data bus connection, SPI Boot Flash memory for configuration and operation, transceivers and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking connections in a compact 5.2 cm x 7.6 cm form factor.

Refer to http://trenz.org/te0817-info for the current online version of this manual and other available documentation.

Notes :

Key Features

Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

See examples fro different types <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-KeyFeatures


  • SoC
    • Device: ZU4 / ZU5 / ZU7 1)
    • Engine: CG / EG / EV 1)
    • Speedgrade: -1 / -2 / -3 1)
    • Temperature Range: Extended / Industrial 1)
    • Package: FBVB900
  • RAM/Storage
    • 4 GByte DDR4 SDRAM 2)
    • 2 x 64 MByte Serial Flash 3)
    • EEPROM with MAC address
  • On Board
    • Oscillator
  • Interface
    • 4 x B2B Connector (ADM6)
      • up to 204 PL IO

        • HP: 156
        • HD: 48
      • up to 65 PS MIO

      • 4 GTR
      • 16 GTH
      • I2C, JTAG
  • Power
    • 3.3 V power supply via B2B Connector needed 4).
  • Dimension
    • 76 mm x 52 mm
  • Notes
    1) Please, take care of the possible assembly options. Furthermore, check whether the power supply is powerful enough for your FPGA design.
    2) Up to 8 GByte are possible with a maximum bandwidth of 2400 MBit/s.
    3) Please, take care of the possible assembly options.
    4) Dependant on the assembly option a higher input voltage may be possible.

Block Diagram

add drawIO object in Scroll Ignore section and add reference image in Scroll Only.

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


Title (not anchor) of all Scroll Title such as DrawIOs and Tables should be changed according to the Module name.

Example: TE0812 Block Diagram


All created DrawIOs  should be named according to the Module name:

Example: DrawIO of TE0812 Block Diagram should be named TE0812_OV_BD






Main Components

Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .







  1. SoC, U1
  2. DDR4, U2, U3, U9, U12
  3. Quad SPI Flash, U7, U17
  4. Connector, J1, J2, J3, J4
  5. EEPROM, U11
  6. Clock Generator, U5
  7. Oscillator, U25, U32

Initial Delivery State


Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty



Storage device name

Content

Notes

DDR4 SDRAMnot programmed
Quad SPI Flashnot programmed
EEPROMnot programmed besides factory programmed MAC address
Programmable Clock Generatornot programmed


Signals, Interfaces and Pins

For subsection examples see: <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-Signals,InterfacesandPins

  • Table with all connectors and Designator
  • List of different interfaces per connector
  • IO CNT (for FPGA IOs where functionality can be changed by customer)


Connectors

Connector TypeDesignatorInterfaceIO CNT 1)Notes
B2BJM1MGT PL12 x MGT (RX/TX)
B2BJM1HP52 SE / 24 DIFF
B2BJM2MGT PS2 x MGT CLK
B2BJM2CLKDIFF CLK
B2BJM2MGT PL4 x MGT (RX/TX)
B2BJM2MGT PS4 x MGT (RX/TX)
B2BJM2CFGJTAG
B2BJM2CFGMODE
B2BJM3HD48 SE / 24 DIFF
B2BJM3MGT PL3 x MGT CLK
B2BJM3CLKDIFF CLK
B2BJM3MIO65 GPIO
B2BJM4HP104 SE / 48 DIFF

1) IO CNT depends on assembly variant. E.g. the MGTs are not available for all FPGAs


Test Points

you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalNotes1)
TP1PWR_PL_OK

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.



Test PointSignalNotes1)
TP1PLL_SCLpulled-up to SI_PLL_1V8
TP2PLL_SDApulled-up to SI_PLL_1V8
TP5GND
TP6TCK
TP7TDI
TP8TDO
TP9TMS
TP12PL_VCCINT
TP15FP_0V85
TP16DDR_2V5
TP17DCDC_2V0
TP18DDR_PLL
TP20PL_VCU
TP23VTT
TP24AUX_R
TP25AVTT_R
TP26AVCC_R
TP27PS_PLL
TP28PS_AVTT
TP29PS_AUX
TP30PS_AVCC
TP31LP_0V85
TP32GND

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.


On-board Peripherals

Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection by assigning advance link using: #NameOfTheSection

Example:

Chip/InterfaceDesignatorConnected ToNotes
ETH PHYU10
  • B2B connector J1
  • SoC MIO
Gigabit ETH PHY



Chip/InterfaceDesignatorConnected ToNotes

DDR4 SDRAM

U2, U3, U9, U12SoC - PS

Quad SPI Flash

U7, U17SoC - PSBooting.

EEPROM

U11B2B - J2

Clock Generator

U5SoC, B2B

Oscillator

U25Clock Generator25 MHz

Oscillator

U32SoC33.333333 MHz



For example subsections see: <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-On-boardPeripherals

Configuration and System Control Signals

  • Overview  all Controller signals, like Reset, Boote Mode, JTAG Interface(Connector or USB In case of FTDI)...
  • In case it's connected to CPLD always link to CPLD description and add not from the  current implementation here(in case it's available)


Connector+Pin

Signal Name

Direction1)Description
JM1.A45POR_OVERRIDEINOverride power-on reset delay 2).
JM2.A30PG_PLL_1V8OUTSI_PLL_1V8 power rail powered-up.
JM2.A31ERR_OUTOUTPS error indication 2).
JM2.A34ERR_STATUSOUTPS error status 2).
JM2.A35LP_GOODOUTLow-power domain powered-up. Pulled up to 3.3VIN
JM2.A36PLL_SCLINI2C clock
JM2.A37PLL_SDAIN/OUTI2C data
JM2.A40PG_VCUOUTVCU power rail powered-up.
JM2.A41EN_PSGTINEnable GTR transceiver power-up.
JM2.A44 / JM2.A45 /
JM2.A46 / JM2.A47
TCK / TDI / TDO / TMSSignal-dependent

JTAG configuration and debugging interface.

JTAG reference voltage: PS_1V8

JM2.B29PG_PSGTOUTGTR transceivers powered-up.
JM2.B30PROG_BIN/OUTPower-on reset 2). Pulled-up to PS_1V8.
JM2.B33SRST_BINSystem reset 2). Pulled-up to PS_1V8.
JM2.B34INIT_BIN/OUTInitialization completion indicator after POR 2). Pulled-up to PS_1V8.
JM2.B37PG_PLOUTProgrammable logic powered-up.
JM2.B38EN_FPDINEnable full-power domain power-up.
JM2.B41PG_FPDOUTFull-power domain powered-up.
JM2.B42EN_LPDINEnable low-power domain power-up.
JM2.B45PG_DDROUTDDR power supply powered-up.
JM2.B46DONEOUTPS done signal 2). Pulled-up to PS_1V8.
JM2.B47EN_DDRINEnable DDR power-up.
JM2.C30EN_GT_LINNot connected.
JM2.C31MRINManual reset.
JM2.C32PLL_SEL0INPLL clock selection.
JM2.C33PLL_RSTINPLL reset.
JM2.C35EN_PLINEnable programable logic power-up.
JM2.C36EN_GT_RINEnable GTH transceiver power-up.
JM2.C37PLL_FDECINPLL Frequency decrementation.
JM2.C44 / JM2.C45 / JM2.C46 / JM2.C47MODE3..0INBoot mode selection 2):
  • JTAG
  • QUAD-SPI (32 Bit)
  • SD1 (2.0)
  • eMMC (1.8 V)
  • SD1 LS (3.0)

Supported Modes depends also on used Carrier.

JM2.D29EN_PLL_PWRINEnable PLL power supply.
JM2.D30PLL_FINCINPLL Frequency incrementation.
JM2.D31PLL_LOLnOUTLoss of lock status.
JM2.D32PLL_SEL1INPLL clock selection.
JM2.D33PG_GT_ROUTGTH Transceivers powered-up.
JM2.D37PSBATTINPS RTC Battery supply voltage 2) 3).
JM2.D38PUDC_BINConfiguration pull-ups setting 2). Pulled-up to PL_1V8.
JM2.D45 / JM2.D46DX_P / DX_N-SoC temperatur sensing diode pins 2).

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.

2) See UG1085 for additional information.

3) See Recommended Operating Conditions.

Power and Power-On Sequence

Enter the default value for power supply and startup of the module here.

  • Order of power provided Voltages and Reset/Enable signals

Link to Schematics, for power images or more details


Power Rails

List of all Powerrails which are accessible by the customer

  • Main Power Rails and Variable Bank Power




Power Rail Name/ Schematic NameConnector.PinDirection1)Notes
VCCO_66JM1.A32 / JM1.A33IN
VREF_66JM1.A41IN
3.3VINJM1.A54 / JM1.A55 / JM1.B55 / JM1.B56IN

PL_1V8

JM1.C32 / JM1.C33 / JM1.D33 / JM1.D34OUT
PL_DCINJM1.C56 / JM1.C57 / JM1.C58 / JM1.C59 / JM1.C60 / JM1.D56 / JM1.D57 / JM1.D58 / JM1.D59 / JM1.D60IN
LP_DCDCJM2.A50 / JM2.A51 / JM2.A52 / JM2.B50 / JM2.B51 / JM2.B52 / JM2.C50 / JM2.C51 / JM2.C52 / JM2.D50 / JM2.D51 / JM2.D52IN
DCDCINJM2.A57 / JM2.A58 / JM2.A59 / JM2.A60 / JM2.B57 / JM2.B58 / JM2.B59 / JM2.B60 / JM2.C57 / JM2.C58 / JM2.C59 / JM2.C60 / JM2.D57 / JM2.D58 / JM2.D59 / JM2.D60 / IN
PS_BATTJM2.D37IN
DDR_1V2JM2.D47OUT
PS_1V8JM2.C34 / JM2.D34 / JM3.A56 / JM3.B56 / JM3.C56 / JM3.D56OUT
PLL_3V3JM3.A55IN
GT_DCDCJM3.A59 / JM3.A60 / JM3.B59 / JM3.B60 / JM3.C59 / JM3.C60 / JM3.D59 / JM3.D60 /IN
VCCO_48JM3.C7 / JM3.C8 / JM3.D8 / JM3.D9IN
VCCO_47JM3.C19 / JM3.C20 / JM3.D20 / JM3.D21IN
VCCO_64JM4.B21 / JM4.B39IN
VREF_64JM4.B30IN
VCCO_65JM4.C21 / JM4.C39IN
VREF_65JM4.C30IN

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.


Recommended Power up Sequencing

List baseboard design hints for final baseboard development.

The power up sequencing highly depends on the use case. In general, it should be possible to enable/disable the processing system (PS) / programmable logic (PL) independently. Furthermore, within the processing logic it should be possible to enable/disable only low-power domain and/or low-power and full-power domain. Additionally, usage of GTR for PS side and GTH for PL side should be possible. Because of this flexibility the needed parts of the following table needs to be selected individually. For detailed information take a look into schematics.


SequenceNet nameRecommended Voltage RangePull-up/downDescriptionNotes
0---Configuration signal setup.See Configuration and System Control Signals.
1 1)PSBATT1.2 V ... 1.5 V-Battery connection.Battery Power Domain usage. When not used, tie to GND.
13.3VIN3.3 V (± 5 %)-Management power supply.Management module power supply. 0.5 A recommended.
GTH / GTR Transceiver clocking (Only necessary in cases where the PLL clock is used for GTH / GTH.):
1 1)GT_DCDC3.3 V (± 5 %) 2)
GTH transceiver power supply.Main module power supply for GTH / GTY transceiver. 5 A recommended. Power consumption depends mainly on design and cooling solution.
1 1)EN_PLL_PWR-PD 3), GNDPLL power enable.
1 1)PG_PLL_1V8-PU 3), 3.3 VPLL power good status.
2Processing System (PS):Procedure for PS starting.
2.1Low-power domain:Bring-up for low-power domain PS.
2.1.1LP_DCDC3.3 V (± 5 %) 2)-Low-power domain power supply.Main module power supply for low-power domain. 5.5 A recommended. Power consumption depends mainly on design and cooling solution.
2.1.2EN_LPD-PU 3), 3.3 VLow-power domain power enable.
2.1.3LP_GOOD-PU 3), 3.3 VLow-power domain power good status.Module power-on sequencing for low-power domain finished.
2.2Full-power domain:Bring-up for full-power domain PS.Full-power PS domain needs powered low-power PS domain.
2.2.1DCDCIN3.3 V (± 5 %) 2)
Full-power domainand GTR transceiver power supply.Main module power supply for full-power domain. 7 A recommended. Power consumption depends mainly on design and cooling solution.
2.2.2EN_FPD3.3 V-Full-power domain power enable.
2.2.3PG_FPD-PU 3), 3.3 VFull-power domain power good status.Module power-on sequencing for full-power domain finished.
2.2.4EN_DDR3.3 V-DDR memory power enable.
2.2.5PG_DDR
PU 3), 3.3 VDDR memory power good status.Module power-on sequencing for DDR memory finished.

2.3

GTR TransceiverProcedure for GTR transceiver starting.PS transceiver usage needs powered PS (low- and full-power domain).
2.3.1EN_PSGT3.3 V-GTR transceiver power enable.
2.3.2PG_PSGT-PU 3), 3.3 VGTR transceiver power good status.Module power-on sequencing for GTR transceiver finished.
2Programmable Logic (PL)Procedure for PL starting.PS and PL can be started independently.
2.1PL_DCIN3.3 V (± 5 %) 2) 4)-Programmable logic power supply.Main module power supply for programmable logic. 12 A recommended. Power consumption depends mainly on design and cooling solution.
2.2EN_PL-PU 3), 3.3 VProgrammable logic power enable.
2.3PG_PL-PU 3), 3.3 VProgrammable logic power good status.Module power-on sequencing for programmable logic finished. Periphery and variable bank voltages can be enabled on carrier.
2.4VCCO_47 / VCCO_48 / VCCO_64 / VCCO_65 / VCCO_66 5)-Module bank voltages.Enable bank voltages after PG_PL deassertion.
2.5PG_VCU-PU 3), 3.3 VVCU power good status.
3GTH / GTY TransceiverProcedure for GTH / GTY transceiver starting.PL transceiver usage needs powered PL and low-power PS domain.
3.1GT_DCDC3.3 V (± 5 %) 2)-GTH transceiver power supply.Main module power supply for GTH transceiver. 5 A recommended. Power consumption depends mainly on design and cooling solution.
3.2EN_GT_R3.3 V-GTH / GTY transceiver power enable.
3.3PG_GT_R-PU 3), 3.3 VGTH / GTY transceiver power good status.

1) (optional)

2) Dependent on the assembly option a higher input voltage may be possible. 

3) (on module)

4) This value depends highly on DCDC U4. Higher values may be possible with different DCDCs. For more information consult schematic and according datasheets.

5) See DS925 for additional information.

Board to Board Connectors

  • This section is optional and only for modules.
  • use "include page" macro and link to the general B2B connector page of the module series,

    For example: 6 x 6 SoM LSHM B2B Connectors

Technical Specifications

List of all Powerrails which are accessible by the customer

  • Main Power Rails and Variable Bank Power add boarder one time maximum Rating (Board will damaged)

Absolute Maximum Ratings *)

Power Rail Name/ Schematic NameDescriptionMinMaxUnit
LP_DCDCMicromodule Power-0.3006.0V
DCDCINMicromodule Power-0.3007.0V
GT_DCDCMicromodule Power-0.3006.0V
PL_DCIN 1)Micromodule Power-0.300

4.0

V
3.3VINMicromodule Power-0.3003.600V
PLL_3V3PLL power supply-0.5003.8V
PS_BATTRTC / BBRAM-0.5002.000V
VCCO_47HD IO Bank power supply-0.5003.400V
VCCO_48HD IO Bank power supply-0.5003.400V
VCCO_64HP IO Bank power supply-0.5002.000V

VCCO_65

HP IO Bank power supply-0.5002.000V
VCCO_66HP IO Bank power supply-0.5002.000V
VREF_64Bank input reference voltage-0.5002.000V
VREF_65Bank input reference voltage-0.5002.000V
VREF_66Bank input reference voltage-0.5002.000V

1) This value depends highly on DCDC U4. Higher values are possible with different DCDCs. For more information consult schematic and according datasheets.

*) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these
   or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

This TRM is generic for all variants. Temperature range can be different depending on assembly version.  Voltage range is mostly the same during variants (exceptions are possible, depending on custom request)

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

  • Variants of modules are described here: Article Number Information
  • Modules with commercial temperature grade are equipped with components that cover at least the range of 0°C to 75°C
  • Modules with extended temperature grade are equipped with components that cover at least the range of 0°C to 85°C
  • Modules with industrial temperature grade are equipped with components that cover at least the range of -40°C to 85°C
  • The actual operating temperature range will depend on the FPGA / SoC design / usage and cooling and other variables.


ParameterMinMaxUnitsReference Document
LP_DCDC 1)3.1353.465V
DCDCIN 1)3.1353.465V
GT_DCDC 1)3.1353.465V
PL_DCIN 1) 2)3.135

3.465

V
3.3VIN3.1353.465V
PLL_3V33.1353.465V
PS_BATT1.21.5VSee FPGA datasheet.
VCCO_471.1643.399VSee FPGA datasheet.
VCCO_481.1643.399VSee FPGA datasheet.
VCCO_640.971.854VSee FPGA datasheet.

VCCO_65

0.971.854VSee FPGA datasheet.
VCCO_660.971.854VSee FPGA datasheet.
VREF_640.61.2VSee FPGA datasheet.
VREF_650.61.2VSee FPGA datasheet.
VREF_660.61.2VSee FPGA datasheet.

1) Dependent on the assembly option a higher input voltage may be possible. 

2) This value depends highly on DCDC U4. Higher values may possible with different DCDCs. For more information consult schematic and according datasheets.


Physical Dimensions

  • Module size: 76 mm × 52 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 5 mm.

PCB thickness: 1.74 mm (± 10 %) (???).

In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .






Currently Offered Variants 

Set correct link to the shop page overview table of the product on English and German.

Example for TE0706:

    ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0813

    DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0813


Trenz shop TE0817 overview page
English pageGerman page


Revision History

Hardware Revision History

Set correct links to download  Carrier, e.g. TE0706 REV02:

  TE0706-02  ->   https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/REV02/Documents

Note:

  • Date format:  YYYY-MM-DD
  • Example: 

    DateRevisionChangesDocumentation Link
    2020-11-25REV02
    • Resistors R14 and R15 was replaced by 953R (was 5K1)
    • Resistor R5 was replaced by 5K1, R8 by 953R (was 9K09 and 1K69 respectively)
    REV02







DateRevisionChangesDocumentation Link
-REV01First Production ReleaseREV01


Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Document Change History

  • Note this list must be only updated, if the document is online on public doc!
  • It's semi automatically, so do following
    • Add new row below first

    • Copy "Page Information Macro (date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

    • Metadata is only used of compatibility of older exports


DateRevisionContributorDescription

Corrected max possible DDR4 assembly option

2023-01-16

v.14

ED

  • Fixed issue in absolute maximum ratings
2022-11-08v.13ED
  • Initial Document

--

all

  • --


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