Note

The mounting of the heatsink must be done with care. We do not take over guarantee for self-assembly.

Compatibility

This heatsink can be mounted on all TE741 Revision 5 and TE0741 Revision 4 (TE0741-04-…).

Accessories

GAP-PAD HC3.0 Pad 25 x 25 mm

Assembly

1. Please remove the two protective foils from the 25 × 25 mm gap pad and place the gap pad carefully on the FPGA.
   
   
2. Please check the alignment of the pins of the clip. Note that one pin is shorter (see drawing → short pin).
   
   
3. The heatsink must be clipped onto the FPGA according to the drawing, paying special attention to the orientation of the short pin.
   
   

   Incorrect pin alignment when clipping in the clip may result in damage to the TE0741.

Drawing