Overview

Online version of this manual and other related documents can be found at https://wiki.trenz-electronic.de/display/PD/TE0703

See page "4 x 5 cm carriers" to get information about the SoMs supported by the TE0703 Carrier Board.

Main Components

1. Samtec Razor Beam™ high-speed hermaphroditic 50 positions terminal strip, board to board connector, JB1
2. Samtec Razor Beam™ high-speed hermaphroditic 50 positions terminal strip, board to board connector, JB2
3. Samtec Razor Beam™ high-speed hermaphroditic 30 positions terminal strip, board to board connector, JB3
4. Micro SD card socket with detect switch, J3
5. LED indicators D1 and D2
6. Mini-USB B connector, J4
7. LED indicators D3 and D4
8. Configuration DIP switches, S2 (see table under ... section)
9. User push button(Reset), S1
10. Backplane connector(VG96) placeholder, J1
11. Backplane connector(VG96) placeholder, J2
12. VCCIO voltage selection jumper block, J5, J8, J9 and J10 (see Power section)
13. Trxcom 1000Base-T Gigabit RJ45 Magjack, J14
14. USB type A receptacle, J6 (optional micro USB 2.0 type B receptacle available, J12)
15. 5VDC power connector jack, J13

Key Features

• 2 x VG96 backplane connectors (mounting holes and solder pads)
• SDIO port expander with voltage-level translation
• Micro SD card socket, can be used to boot system
• 4 x user LEDs, 2 x red and 2 x green
• Mini USB connector (USB JTAG and UART interface)
• 1 x user-push button routed to CPLD. By default it is configured as system reset button.
• RJ45 Gigabit Ethernet socket with 4 integrated LEDs.
• USB Host Connector
• Barrel jack for 5V Power Supply input
• 4A High-Efficiency Power SoC DC-DC Step-Down Converter(Enpirion EN6347) for 3.3V Power Supply
• Trenz 4x5 Module Socket (3 x Samtec LSHM series connectors)
• USB JTAG and UART Interface (FTDI FT2232H), compatible with Xilinx Tools (also with many other tools)
• 2 x User configurable DIP switches

Interfaces and Pins

Board to Board (B2B) I/O's

For detailed information about the B2B pin out, please refer to the Master Pinout Table. 

Micro SD Card Socket

Micro SD Card socket is not directly wired to the B2B connector pins, but through a Texas Instruments TXS02612 SDIO port expander, which is needed for voltage translation due to the different voltage levels of the Micro SD Card and MIO bank 501 of the Xilinx Zynq 7000 chip. The Micro SD Card has 3.3V signalling, but the MIO Bank 501 on the Xilinx Zynq 7000 chip is set to 1.8V. !!! (card detect signal...)

Dual channel USB UART/FIFO

TE0703 has on-board USB 2.0 High Speed UART/FIFO FT2232HQ from FTDI. Channel A can only be used in simple UART mode, Channel B can be used as UART, FIFO, JTAG (MPSSE) or High Speed Serial modes. An standard 256 Byte EEPROM to store custom Configuration settings for FT2232H is available. EEPROM settings can be changed using FTDI provided tools that can be downloaded from FTDI website. See FTDI website for more information.

Ethernet 

On-board ethernet jack J14 pins are routed to B2B connector JB1. Ethernet jack J14 LED's are all routed to CPLD Bank 1.

USB Interface

TE0703 board has two physical USB sockets:

• J4 as mini USB type B socket wired to on-board FTDI FT2232H chip.
• J6 as USB type A wired to B2B connector JM3 (there is usually something like SMSC USB3320 or similar USB transceiver on the module).

JTAG Interface

JTAG access to the CPLD and Xilinx Zynq chip is provided via Mini-USB JTAG Interface (FTDI FT2232H) and controlled by DIP switch S2-3.

LED's

There are four LED's onboard:

LED's D3 and D4 are connected to the 4x5 B2B connector pins. Those LEDs can be controlled by FPGA Module

DIP switches

Power

Power Supply

Power supply with minimum current capability of 3A for system startup is recommended.

Power Consumption

Typical value: TE0703-05 + TE0715-01 module. SD micro card inserted. Ethernet connected, link up. System booted into Linux prompt and idling. Average power consumption was 5V/0.55A.

VCCIO voltage selection jumpers J5, J8, J9 and J10

Refer to the 4x5 Module Integration Guide for VCCIO voltage options.

If you choose to power IO banks

Initial Delivery State

Board is shipped in following configuration:

• VCCIO voltage selection jumpers are all set to 1.8V.
• S1 switch configured as reset button in CPLD.
• Two VG96 backplane connectors are not soldered to the board, but they are included in the package as separate components.
• S2 DIP switches are configured as follows:

Different delivery configurations are available upon request.

Technical Specifications

Absolute Maximum Ratings

Recommended Operating Conditions

....

Physical Dimensions

• Board size:  PCB 100mm ×  64.5mm. Notice that the mini USB-B jack on the left and ethernet RJ-45 jack on the right are hanging slightly over the edge of the PCB making the total width of the longer side approximately 106mm. Please download the assembly diagram for exact numbers.

• Mating height of the module with standard connectors: 8mm

• PCB thickness: 1.65mm

• Highest parts on the PCB are USB type A jack and ethernet RJ-45 jack, approximately 15mm. Please download the step model for exact numbers.

 All dimensions are given in mm.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Board operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Weight

42g - Plain board

13g - VG96 connector x 2

Document Change History

Date	Rrevision	Contributors	Description
06.09.2016			Something...

Hardware Revision History

Hardware revision number is printed on the PCB board next to the module model number separated by the dash.

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