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The Trenz Electronic TE0745 is an industrial/commercial/extended grade module integrating a Xilinx Zynq SoC (XC7Z-030, XC7Z-035 or XC7Z-045), 1 GByte DDR3/L SDRAM, 32/64 MByte SPI Flash memory for configuration and operation and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking strips.
Refer to http://trenz.org/te0745-info for the current online version of this manual and other available documentation.
Industrial grade Xilinx Zynq SoC (XCZ7030, XC7Z035, XC7Z045)
Additional assembly options are available for cost or performance optimization upon request.
Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.
If there is no components which might have initial data ( possible on carrier) you must keep the table empty
BOOTMODE is connected to MIO4 and B2B Connector J2 (Pin 133) and BOOTMODE_1 is connected to MIO5 and System Controller CPLD and default high.
FPGA bank number and number of I/O signals connected to the B2B connector:
JTAG interface access is provided through the SoC's PS configuration bank 0, it is connected to B2B connector J1.
The I2C interface on B2B connector J2 has PS_3.3V as reference voltage and is connected to the Zynq SoC via voltage level translating (3.3V ↔ 1.8V) I2C bus repeater (U17).
Following on-module I2C interface are connected to the same I2C bus:
I2C bus is accessible from SoC over following MIO:
1) Note: MGT bank 111 not available at XC7Z030 Zynq SoC.
you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.
In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection
Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.
On-board QSPI flash memory (U14) on the TE0745-02 is provided by Micron Serial NOR Flash Memory 256/512 Mbit (32/64 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used. Quad SPI Flash (U14) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500, pins MIO1 ... MIO6.
The TE0745 SoM has two volatile Intelligent Memory 512 MByte DDR3L-1600 SDRAM IC for storing user application code and data.
DDR3 SDRAM can be varied on demand for other assembly options. DDR3 can have density of maximum 512MB due to available addressing. The maximum possible speed for DDR3 SDRAM is 1600 Mb/s.
An temperature compensated is used as Real Time Clock (U24). Battery voltage must be supplied to the clock from the base board via pin 'VBAT_IN' (J1-146). Battery backed registers can be accessed over I2C bus at slave address mentioned in the table below. General purpose RAM of the RTC can be accessed at I2C slave address 0x57. RTC IC is supported by Linux so it can be used as hwclock device.
The interrupt line 'RTC_INT' of the RTC is connected to System Controller CPLD bank 3 pin 4.
There is a Silicon Labs I2C programmable quad PLL clock generator (U16) on-board. It's output frequencies can be programmed by using the I2C-bus with address 0x70.
A 25.00 MHz (U21) oscillator is connected to pin 3 (IN3) and is used to generate the output clocks.
Once running, the frequency and other parameters can be changed by programming the device using the I2C-bus connected between the Zynq module (master) and reference clock signal generator (slave).
The System Controller CPLD (U2) is central system management unit where essential control signals are logically linked by the implemented logic in CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. Interfaces like JTAG and I2C between the on-board peripherals and to the FPGA-module are by-passed, forwarded and controlled by the System Controller CPLD.
Other tasks of the System Controller CPLD are the monitoring of the power-on sequence and to display the programming state of the FPGA module.
For current CPLD Firmware description, check TE0745 CPLD
Hi-speed USB ULPI PHY (U32) is provided on the board. The ULPI interface is connected to the Zynq PS USB0 via MIO28..39, bank 501 (see also section). The I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.00 MHz oscillator (U33).
A serial EEPROM (U23) contains a globally unique 48-bit node address, which is compatible with EUI-48(TM) specification. The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use.
On-board Gigabit Ethernet PHY (U7) is provided on the board. The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from an on-board 25.00 MHz oscillator (U9), the 125MHz output clock signal CLK_125MHZ is connected to the pin J2-150 of B2B connector J2.
Power supply with minimum current capability of 3.0 A for system startup is recommended.
The maximum power consumption of a module mainly depends on the design which is running on the FPGA.
* TBD - To Be Determined
For the lowest power consumption and highest efficiency of on board DC-DC regulators it is recommended to powering the module from one single 3.3V supply. All input power supplies have a nominal value of 3.3V. Although the input power supplies can be powered up in any order, it is recommended to power them up simultaneously.
The on-board voltages of the TE0745 SoC module will be powered-up in order of a determined sequence after the external voltages 'PL_VIN', 'PS_VIN' and 'PS_3.3V' are available. All those power-rails can be powered up, with 3.3V power sources, also shared.
|To avoid any damage to the module, check for stabilized on-board voltages should be carried out(i.e. power good and enable signals) before powering up any SoC's I/O bank voltages VCCO_x. All I/Os should be tri-stated during power-on sequence.|
Core voltages and main supply voltages have to reach stable state and their "Power Good"-signals have to be asserted before other voltages like PL bank's I/O voltages can be powered up.
It is important that all baseboard I/Os are tri-stated at power-on until the "Power Good"-signals 'PWR_PS_OK' (J2-139) and 'PWR_PL_OK' (J2-135) are high, meaning that all on-module voltages have become stable and module is properly powered up.
Current rating of Samtec Razor Beam LP Terminal/Socket Strip ST5/SS5 B2B connectors is 1.5 A per pin (1 pin powered per row).
The TE0745 SoM meets the recommended criteria to power up the Xilinx Zynq MPSoC properly by keeping a specific sequence of enabling the on-board DCDC converters dedicated to the particular functional units of the Zynq chip and powering up the on-board voltages.
Following diagram clarifies the sequence of enabling the particular on-board voltages, which will power-up in descending order as listed in the blocks of the diagram:
The Enable-Signal 'EN_PL' is permanently logic high in standard SC-CPLD firmware. The "Power Good"-signals 'PWR_PS_OK' and 'PWR_PL_OK' (latter low-active, extern pull-up needed) are available B2B-connector J2 (pins J2-139, J2-135) and on the SC-CPLD.
The voltages 'VCCPINT' and 'PS_1.8V' are monitored by the voltage monitor circuit U41, which generates the POR_B reset signal at Power-On. A manual reset is also possible by driving the MR-pin (available on J2-131 or SC-CPLD) to GND. Leave this pin unconnected or connect to VDD (PS_1.8V) when unused.
Attention: PS_3.3V is directly connected to numerous on-board peripherals as supply and I/O voltage.
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
The module operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Module size: 52 mm × 76 mm. Please download the assembly diagram for exact numbers
Mating height with standard connectors: 4mm
PCB thickness: 1.6mm
Highest part on PCB: approx. 3mm. Please download the step model for exact numbers
Set correct link to the shop page overview table of the product on English and German.
Example for TE0728:
if not available, set.
Product changes can be seen in TE0745 Product Change Notifications page.
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.