Template Revision 2.15 (todo change key features to new style) - Module: TRM Name always "TE Series Name" +TRM
Example: "TE0745 TRM" - Carrier: TRM Name usually "TEB Series Name" +TRM
Example: "TEB0745 TRM"
Template Change history: - 2.14 to 2.15
- add excerpt macro to key features
- 2.13 to 2.14
- add fix table of content
- add table size as macro
- 2.12 to 2.13
- Changed controller Signals section
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Note for Download Link of the Scroll ignore macro: |
Overview
The Trenz Electronic TE0745 is an industrial/commercial/extended grade module integrating a Xilinx Zynq SoC (XC7Z-030, XC7Z-035 or XC7Z-045), 1 GByte DDR3/L SDRAM, 32/64 MByte SPI Flash memory for configuration and operation and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking strips.
Refer to http://trenz.org/te0745-info for the current online version of this manual and other available documentation.
Key Features
Additional assembly options are available for cost or performance optimization upon request.
Block Diagram
Main Components
Notes : - Picture of the PCB (top and bottom side) with labels of important components
- Add List below
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- Xilinx Zynq XC7Z family SoC, U1
- Quad SPI Flash memory, U14
- Reference clock signal oscillator, U12
- Reference clock signal oscillator, U9
- 1 Gigabit Ethernet PHY, U7
- DDR3L SDRAM (8 Banks a 32 MWords, 16-bit word width), U3
- DDR3 memory termination regulator with buffered reference voltage VTTREF, U18
- Real-Time-Clock, U24
- level-shifting I2C bus repeater, U17
- Red LED, D2
- Green LED, D1
- DDR3L SDRAM (8 Banks a 32 MWords, 16-bit word width), U5
- 12A DC-DC PowerSoC (VCCINT), U4
- DC-DC regulator (MGTAVTT), U8
- DC-DC regulator (MGTAUX), U6
- DC-DC regulator (MGTAVCC), U11
- I2C Programmable Quad Clock Generator, U13
- Reference clock signal oscillator, U21
- B2B Connector, J3
- B2B Connector, J1
- B2B Connector, J2
- Quad SPI Flash memory, U14
- USB transceiver PHY , U32
- Reference clock signal oscillator, U33
- EEPROM for MAC address, U23
- System Controller CPLD, U2
Initial Delivery State
Notes : Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture. If there is no components which might have initial data ( possible on carrier) you must keep the table empty |
Storage device name | Content | Notes |
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EEPROM | User content, not programmed | Valid MAC Address from manufacturer. | SPI Flash OTP Area | not programmed | Except serial number programmed by flash vendor. | SPI Flash Quad Enable bit | Programmed | - | SPI Flash main array | Not programmed | - | eFUSE USER | Not programmed | - | eFUSE Security | Not programmed | - | Si5338 OTP NVM | Not programmed | OTP not re-programmable after delivery from factory |
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Configuration Signals
- Overview of Boot Mode, Reset, Enables.
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BOOTMODE is connected to MIO4 and B2B Connector J2 (Pin 133) and BOOTMODE_1 is connected to MIO5 and System Controller CPLD and default high.
Boot Mode | BOOTMODE_1 (MIO5) | BOOTMODE (MIO4) | Note |
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JTAG Boot mode | 0 | 0 | JTAG only is only possible with other CPLD Firmware | ---- | 0 | 1 | not supported | QSPI | 1 | 0 |
| SD Card | 1 | 1 |
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Signal | B2B | Direction | Note |
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RST_IN_N | J2-131 | Input | Low-active Power-On reset pin, controls POR_B-signal (Bank 500 - C23) | PS_SRST | J2-152 | Input | Low-active PS system-reset pin of Zynq chip. | JTAG_EN | J1-148 | Input | Low FPGA access, high CPLD access |
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Signals, Interfaces and Pins
Notes : - For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
- For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
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Board to Board (B2B) I/Os
FPGA bank number and number of I/O signals connected to the B2B connector:
FPGA Bank | Type | B2B Connector | I/O Signal Count | Voltage Level | Notes |
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12 | HR | J1 | 48 Diff (24 LVS pair), 2 Single ended | VCCIO_12 pins J1-54, J1-55 | Voltage range 1.2V to 3.3V | 13 | HR | J1 | 48 Diff (24 LVS pair), 2 Single ended | VCCIO_13 pins J1-112, J1-113 | Voltage range 1.2V to 3.3V | 33 | HP | J3 | 48 Diff (24 LVS pair), 2 Single ended | VCCIO_33 pins J3-115, J3-120 | Voltage range 1.2V to 1.8V | 34 | HP | J2 | 48 Diff (24 LVS pair), 2 Single ended | VCCIO_34 pins J2-29, J2-30 | Voltage range 1.2V to 1.8V | 35 | HP | J2 | 48 Diff (24 LVS pair), 2 Single ended | VCCIO_35 pins J2-87, J2-88 | Voltage range 1.2V to 1.8V | 500 | MIO | J2 | 5 | 1.8V | MIO0, MIO12 ... MIO15, user configurable I/O's on B2B | 501 | MIO | J3 | 12 | 1.8V | MIO40 ... MIO51, user configurable I/O's on B2B |
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System Controller I/O Pins
Pin Name | Direction | Function | B2B | Default Configuration |
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JTAG_EN | Input | JTAG select | J1-148 | During normal operating mode the JTAG_EN pin should be in the low state for JTAG signals to be forwarded to the Zynq SoC. If JTAG_EN pin is set to high or left open the JTAG signals are forwarded to the System Controller CPLD. | RST_IN_N | Input | Reset | J2-131 | Low-active Power-On reset pin, controls POR_B-signal (bank 500, pin C23) of Zynq chip. | PS_SRST | Input | Reset | J2-152 | Low-active PS system-reset pin of Zynq chip. | BOOTMODE | Input | Boot mode | J2-133 | Control line which sets in conjunction with signal 'BOOTMODE_1' connected to CPLD(BOOTMODE_1 default high) the boot source of the Zynq chip. See section "Configuration Signals". | PWR_PL_OK | Input | Power good | J2-135 | Indicates stable state of PL supply voltage (low-active) after power-up sequence. | PWR_PS_OK | Input | Power good | J2-139 | Indicates stable state of PS supply voltage (low-active) after power-up sequence. | MIO0 | Input | PS MIO | J2-137 | User I/O also connected to CPLD. |
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JTAG Interface
JTAG interface access is provided through the SoC's PS configuration bank 0, it is connected to B2B connector J1.
JTAG Signal | B2B Connector |
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TMS | J1- 144 | TDI | J1- 142 | TDO | J1- 145 | TCK | J1- 143 | JTAG_EN | J1- 148 |
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I2C Interface
The I2C interface on B2B connector J2 has PS_3.3V as reference voltage and is connected to the Zynq SoC via voltage level translating (3.3V ↔ 1.8V) I2C bus repeater (U17).
Schematic | B2B | Notes |
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I2C_33_SCL | J2-119 | 3.3V reference voltage | I2C_33_SDA | J2-121 | 3.3V reference voltage |
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Following on-module I2C interface are connected to the same I2C bus:
I2C Device | I2C Address | Notes |
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Quad programmable PLL clock generator U16: pins 12 (SCL), 19 (SDA) | 0x70 | - | MAC Address EEPROM U23, pins 1 (SCL), 3 (SDA) | 0x53 | - | SC CPLD U2, bank 2, pins 16 (SDA), 17 (SCL) | User programmable. | - | RTC, U24 | 0x6F | - | RTC RAM, U24 | 0x57 | - |
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I2C bus is accessible from SoC over following MIO:
MIO Pin | Signal Schematic Name | Notes |
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MIO 10 | I2C_SCL | 1.8V reference voltage | MIO 11 | I2C_SDA | 1.8V reference voltage |
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MGT Lanes
Lane | Bank | Type | Signal Name | B2B Pin | Note |
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0 | 112 | GTX | MGT_RX0_P MGT_RX0_N MGT_TX0_P MGT_TX0_N | J3-50 J3-52 J3-51 J3-53 |
| 1 | 112 | GTX | MGT_RX1_P MGT_RX1_N MGT_TX1_P MGT_TX1_N | J3-56 J3-58 J3-57 J3-59 |
| 2 | 112 | GTX | MGT_RX2_P MGT_RX2_N MGT_TX2_P MGT_TX2_N | J3-62 J3-64 J3-63 J3-65 |
| 3 | 112 | GTX | MGT_RX3_P MGT_RX3_N MGT_TX3_P MGT_TX3_N | J3-68 J3-70 J3-69 J3-71 |
| 4 | 111 1) | GTX | MGT_RX4_P MGT_RX4_N MGT_TX4_P MGT_TX4_N | J1-23 J1-21 J1-22 J1-20 |
| 5 | 111 1) | GTX | MGT_RX5_P MGT_RX5_N MGT_TX5_P MGT_TX5_N | J1-17 J1-15 J1-16 J1-14 |
| 6 | 111 1) | GTX | MGT_RX6_P MGT_RX6_N MGT_TX6_P MGT_TX6_N | J1-11 J1-9 J1-10 J1-8 |
| 7 | 111 1) | GTX | MGT_RX7_P MGT_RX7_N MGT_TX7_P MGT_TX7_N | J1-5 J1-3 J1-4 J1-2 |
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1) Note: MGT bank 111 not available at XC7Z030 Zynq SoC.
MIO Pins
you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic. Example: MIO Pin | Connected to | B2B | Notes |
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MIO12...14 | SPI_CS , SPI_DQ0... SPI_DQ3 SPI_SCK | J2 | QSPI |
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MIO Pin | Connected to | B2B | Notes |
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MIO0 | CPLD and B2B J2-137 | J2 | Configurable, def. used for SD CD | MIO1...6 | SPI_CS , SPI_DQ0... SPI_DQ3, SPI_SCK | - | QSPI Flash | MIO7 | USB_RESET_N | - | 10k pullup to PS_1.8V | MIO8 | Used for CPLD Status | - | 10k pullup to PS_1.8V | MIO9 | ETH_PHY_RST_N | - | ETH PHY | MIO10....11 | SCL/SDA | - | I2C | MIO12...13 | - | J2 | Configurable, def GPIO | MIO14...15 | UART |
| Configurable, def. used for UART | MIO16...27 | ETH_TXCK, ETH_TXD0..3, ETH_TXCTL ETH_RXCK, ETH_RXD0..3, ETH_RXCTL | - | Ethernet Signals | MIO28...39 | OTG_DATA4, OTG_DIR, OTG_STP, OTG_NXT, OTG_DATA0...3, OTG_CLK, OTG_DATA5...7 | - | USB | MIO40...45 | MIO40..45 | J3 | Configurable, def. used for SD | MIO46...50 | - | J3 | GPIO | MIO51 | I2C Reset | J3 | Configurable, def. used for I2C Reset | MIO52 | PHY_MDC | J3 | ETH PHY | MIO53 | PHY_MDIO | J3 | ETH PHY |
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On-board Peripherals
Notes : - add subsection for every component which is important for design, for example:
- Two 100 Mbit Ethernet Transciever PHY
- USB PHY
- Programmable Clock Generator
- Oscillators
- eMMCs
- RTC
- FTDI
- ...
- DIP-Switches
- Buttons
- LEDs
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Notes : In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection |
Quad SPI Flash Memory
Notes : Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options. |
On-board QSPI flash memory (U14) on the TE0745-02 is provided by Micron Serial NOR Flash Memory 256/512 Mbit (32/64 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used. Quad SPI Flash (U14) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500, pins MIO1 ... MIO6.
MIO Pin | Schematic | Notes |
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MIO1 | SPI-CS |
| MIO2 | SPI-DQ0/M0 |
| MIO3 | SPI-DQ1/M1 |
| MIO4 | SPI-DQ2/M2 |
| MIO5 | SPI-DQ3/M3 |
| MIO6 | SPI-SCK/M4 |
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DDR3 SDRAM
The TE0745 SoM has two volatile Intelligent Memory 512 MByte DDR3L-1600 SDRAM IC for storing user application code and data.
- Part number: IM4G16D3FABG-125I
- Supply voltage: 1.5V
- Organization: 256M x 16 bits
DDR3 SDRAM can be varied on demand for other assembly options. DDR3 can have density of maximum 512MB due to available addressing. The maximum possible speed for DDR3 SDRAM is 1600 Mb/s.
RTC
An temperature compensated is used as Real Time Clock (U24). Battery voltage must be supplied to the clock from the base board via pin 'VBAT_IN' (J1-146). Battery backed registers can be accessed over I2C bus at slave address mentioned in the table below. General purpose RAM of the RTC can be accessed at I2C slave address 0x57. RTC IC is supported by Linux so it can be used as hwclock device.
The interrupt line 'RTC_INT' of the RTC is connected to System Controller CPLD bank 3 pin 4.
Schematic | B2B | I2C Address | Designator | Notes |
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I2C_33_SCL | J2-119 | 0x6F | U24 |
| I2C_33_SDA | J2-121 |
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Programmable PLL Clock
There is a Silicon Labs I2C programmable quad PLL clock generator (U16) on-board. It's output frequencies can be programmed by using the I2C-bus with address 0x70.
A 25.00 MHz (U21) oscillator is connected to pin 3 (IN3) and is used to generate the output clocks.
Once running, the frequency and other parameters can be changed by programming the device using the I2C-bus connected between the Zynq module (master) and reference clock signal generator (slave).
U16 Pin
| Signal Name / Description
| Connected To | Direction | Default | Note |
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IN1 | CLKIN_P | B2B, J3-76 | Input |
| Reference input clock from base board. | IN2 | CLKIN_N | B2B, J3-74 | Input |
| IN3 | Reference input clock. | Oscillator U21, pin 3 | Input |
| 25.000000 MHz oscillator, Si8008BI. | IN4 | - | GND | Input |
| I2C slave device address LSB (0x70 default address). | IN5 | - | Not connected. | Input |
| Not used. | IN6 | - | GND | Input |
| Not used. | CLK0A | MGT_CLK1_P | Zynq Soc U1, pin U6 | Output | Not programmed | MGT bank 112 reference clock. | CLK0B | MGT_CLK1_N | Zynq Soc U1, pin U5 | Output | Not programmed | CLK1A | CLK1_P | B2B, J3-80 | Output | Not programmed | Reference clock output to base board. | CLK1B | CLK1_N | B2B, J3-82 | Output | Not programmed | CLK2A | CLK2_P | B2B, J3-86 | Output | Not programmed | Reference clock output to base board. | CLK2B | CLK2_P | B2B, J3-88 | Output | Not programmed | CLK3A | MGT_CLK3_P | Zynq Soc U1, pin AA6 | Output | Not programmed | MGT bank 111 reference clock. | CLK3B | MGT_CLK3_N | Zynq Soc U1, pin AA6 | Output | Not programmed |
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System Controller CPLD
The System Controller CPLD (U2) is central system management unit where essential control signals are logically linked by the implemented logic in CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. Interfaces like JTAG and I2C between the on-board peripherals and to the FPGA-module are by-passed, forwarded and controlled by the System Controller CPLD.
Other tasks of the System Controller CPLD are the monitoring of the power-on sequence and to display the programming state of the FPGA module.
For current CPLD Firmware description, check TE0745 CPLD
USB ULPI PHY
Hi-speed USB ULPI PHY (U32) is provided on the board. The ULPI interface is connected to the Zynq PS USB0 via MIO28..39, bank 501 (see also section). The I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.00 MHz oscillator (U33).
MAC Address EEPROM
A serial EEPROM (U23) contains a globally unique 48-bit node address, which is compatible with EUI-48(TM) specification. The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use.
EEPROM
Schematic | MIO | I2C Address | Designator | Notes |
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I2C_SCL | MIO10 | 0x53 | U23 |
| I2C_SDA | MIO11 |
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Ethernet PHY
On-board Gigabit Ethernet PHY (U7) is provided on the board. The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from an on-board 25.00 MHz oscillator (U9), the 125MHz output clock signal CLK_125MHZ is connected to the pin J2-150 of B2B connector J2.
Schematic | B2B | Notes |
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PHY_MDIO | - | Connected to MIO52 | PHY_MDIO0+/ MDIO0- | J2-120/122 |
| PHY_MDIO1+/ MDIO1- | J2-126/128 |
| PHY_MDIO2+/ MDIO2- | J2-132/134 |
| PHY_MDIO3+/ MDIO3- | J2-138/140 |
| PHY_LED1 | J2-144 |
| PHY_LED2 | J2-146 |
| PHY_LED3 | J2-148 |
| PHY_CLK125M | J2-150 |
| PHY_MDC | - | Connected to MIO53 |
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LEDs
Schematic | Color | Connected to | Active level | Note | Note |
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D1 | Green | System Controller CPLD (bank 3, pin 5) | High | System main status LED, blinking indicates system activity |
| D2 | Red | Zynq chip, bank 0 (config bank), 'DONE' pin | Low | Reflects inverted DONE signal. ON when FPGA is not configured, OFF as soon as PL is configured. This LED remains OFF if System Controller CPLD can not power up the PL supply voltage. |
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Clock Sources
Designator | Schematic Name | Frequency | Note |
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U21 | - | 25.00 MHz | Quad PLL clock generator U16, pin 3 | U12 | PS_CLK | 33.33 MHz | Bank 500 (MIO0 bank), pin B24 | U33 | OTG-RCLK | 52.00 MHz | USB 2.0 transceiver PHY U32, pin 26 | U9 | ETH_CLKIN | 25.00 MHz | Gigabit Ethernet PHY U7, pin 34 |
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Power and Power-On Sequence
Power Supply
Power supply with minimum current capability of 3.0 A for system startup is recommended.
Power Consumption
The maximum power consumption of a module mainly depends on the design which is running on the FPGA.
Power Input Pin | Typical Current |
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PL_VIN | TBD* | PS_VIN | TBD* | PS_3.3V | TBD* |
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* TBD - To Be Determined
For the lowest power consumption and highest efficiency of on board DC-DC regulators it is recommended to powering the module from one single 3.3V supply. All input power supplies have a nominal value of 3.3V. Although the input power supplies can be powered up in any order, it is recommended to power them up simultaneously.
The on-board voltages of the TE0745 SoC module will be powered-up in order of a determined sequence after the external voltages 'PL_VIN', 'PS_VIN' and 'PS_3.3V' are available. All those power-rails can be powered up, with 3.3V power sources, also shared.
To avoid any damage to the module, check for stabilized on-board voltages should be carried out(i.e. power good and enable signals) before powering up any SoC's I/O bank voltages VCCO_x. All I/Os should be tri-stated during power-on sequence. |
Core voltages and main supply voltages have to reach stable state and their "Power Good"-signals have to be asserted before other voltages like PL bank's I/O voltages can be powered up.
It is important that all baseboard I/Os are tri-stated at power-on until the "Power Good"-signals 'PWR_PS_OK' (J2-139) and 'PWR_PL_OK' (J2-135) are high, meaning that all on-module voltages have become stable and module is properly powered up.
Power Distribution Dependencies
Current rating of Samtec Razor Beam LP Terminal/Socket Strip ST5/SS5 B2B connectors is 1.5 A per pin (1 pin powered per row). |
Power-On Sequence
The TE0745 SoM meets the recommended criteria to power up the Xilinx Zynq MPSoC properly by keeping a specific sequence of enabling the on-board DCDC converters dedicated to the particular functional units of the Zynq chip and powering up the on-board voltages.
Following diagram clarifies the sequence of enabling the particular on-board voltages, which will power-up in descending order as listed in the blocks of the diagram:
The Enable-Signal 'EN_PL' is permanently logic high in standard SC-CPLD firmware. The "Power Good"-signals 'PWR_PS_OK' and 'PWR_PL_OK' (latter low-active, extern pull-up needed) are available B2B-connector J2 (pins J2-139, J2-135) and on the SC-CPLD.
Voltage Monitor Circuit
The voltages 'VCCPINT' and 'PS_1.8V' are monitored by the voltage monitor circuit U41, which generates the POR_B reset signal at Power-On. A manual reset is also possible by driving the MR-pin (available on J2-131 or SC-CPLD) to GND. Leave this pin unconnected or connect to VDD (PS_1.8V) when unused.
Power Rails
Power Rail Name | B2B Connector JM1 Pin | B2B Connector JM2 Pin | B2B Connector JM3 Pin | Direction | Notes |
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PL_VIN | 147, 149, 151, 153, 155, 157, 159 | - | - | Input | module supply voltage | PS_VIN | - | 154, 156, 158 | - | Input | module supply voltage | PS_3.3V | - | 160 | - | Input | module supply voltage | VCCIO12 | 54, 55 | - | - | Input | high range bank I/O voltage | VCCIO13 | 112, 113 | - | - | Input | high range bank I/O voltage | VCCIO33 | - | - | 115, 120 | Input | high performance bank I/O voltage | VCCIO34 | - | 29, 30 | - | Input | high performance bank I/O voltage | VCCIO35 | - | 87, 88 | - | Input | high performance bank I/O voltage | VBAT_IN | 146 | - | - | Input | RTC (battery-backed) supply voltage | PS_1.8V | - | 130 | - | Output | internal 1.8V voltage level (Process System) | PL_1.8V | - | - | 84,85 | Output | internal 1.8V voltage level (FPGA) |
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Bank Voltages
| Schematic Name | | Notes |
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0 (config) | VCCIO_0 | PL_1.8V, if R67 is equipped PS_1.8V, if R68 is equipped | - | 500 (MIO0) | PS_1.8V | 1.8V | - | 501 (MIO1) | PS_1.8V | 1.8V | - | 502 (DDR3) | 1.35V | 1.35V | - | 12 HR | VCCIO_12 | User | HR: 1.2V to 3.3V | 13 HR | VCCIO_13 | User | HR: 1.2V to 3.3V
| 33 HP | VCCIO_33 | User | HP: 1.2V to 1.8V |
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Board to Board Connectors
- This section is optional and only for modules.
use "include page" macro and link to the general B2B connector page of the module series, For example: 6 x 6 SoM LSHM B2B Connectors
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Technical Specifications
Absolute Maximum Ratings
Symbols | Description | Min | Max | Unit |
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PL_VIN | -0.3 | 5 | V | TI TPS720 data sheet | PS_VIN | -0.3 | 7 | V | TI TPS82085 data sheet | PS_3.3V | 3.135 | 3.465 | V | 3.3V nominal ± 5%
| VBAT supply voltage | -1 | 6.0 | V | ISL12020MIRZ data sheet | PL IO bank supply voltage for HR I/O banks (VCCO) | -0.5 | 3.6 | V | - | PL IO bank supply voltage for HP I/O banks (VCCO) | -0.5 | 2.0 | V | - | I/O input voltage for HR I/O banks | -0.4 | VCCO_X+0.55 | V | - | I/O input voltage for HP I/O banks | -0.55 | VCCO_X+0.55 | V | - | GT receiver (RXP/RXN) and transmitter (TXP/TXN) | -0.5 | 1.26 | V | - | Voltage on module JTAG pins | -0.3 | 3.6 | V | MachX02 Family data sheet | Storage temperature | -40 | +128 | °C | Limits of ISL12020MIRZ RTC chip. | Storage temperature without the ISL12020MIRZ | -55 | +100 | °C | Limits of DDR3 memory chip. |
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Attention: PS_3.3V is directly connected to numerous on-board peripherals as supply and I/O voltage.
Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Parameter | Min | Max | Units | Reference Document |
|
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PL_VIN | 3.2 | 4.5 | V | - | TI TPS720 data sheet | PS_VIN | 3.135 | 3.6 | V | - | CPLD data sheets | PS_3.3V | 3.135 | 3.465 | V | - | 3.3V nominal ± 5% | VBAT_IN supply voltage | 2.7 | 5.5 | V | - | ISL12020MIRZ data sheet | PL I/O bank supply voltage for HR I/O banks (VCCO) | 1.14 | 3.465 | V | - | Xilinx datasheet DS191 | PL I/O bank supply voltage for HP I/O banks (VCCO) | 1.14 | 1.89 | V | - | Xilinx datasheet DS191 | I/O input voltage for HR I/O banks | -0.20 | VCCO_X+0.20 | V | - | Xilinx datasheet DS191 | I/O input voltage for HP I/O banks | -0.20 | VCCO_X+0.20 | V | - | Xilinx datasheet DS191 | GT receiver (RXP/RXN) and transmitter (TXP/TXN) | (*) | (*) | V | (*) Check datasheet | Xilinx datasheet DS191 | Voltage on Module JTAG pins | 3.135 | 3.6 | V | JTAG signals forwarded to Zynq module config bank 0 | MachX02 Family Data Sheet | Recommended Operating Temperatur | -40 | +85 | °C |
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The module operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Physical Dimensions
Module size: 52 mm × 76 mm. Please download the assembly diagram for exact numbers
Mating height with standard connectors: 4mm
PCB thickness: 1.6mm
Highest part on PCB: approx. 3mm. Please download the step model for exact numbers
Currently Offered Variants
Revision History
Hardware Revision History
Product changes can be seen in TE0745 Product Change Notifications page.
Date | Revision | Changes | Documentation Link |
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2016-11-02 | 02 | - MAC EEPROM Address patch fixed on PCB
| REV02 | 2016-05-12 | 01 | | REV01 |
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Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Document Change History
- Note this list must be only updated, if the document is online on public doc!
- It's semi automatically, so do following
Add new row below first Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template - Metadata is only used of compatibility of older exports
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Date | Revision | Contributor | Description |
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| | | - Corrected limits for operating conditions of PL/PS_VIN
- Corrected MIO section (UARt)
| | v.102 | Martin Rohrmüller | - Corrected key features power supply voltage
| | v.98 | John Hartfiel | - typographical correction
- block diagram correction
| | v.94 | John Hartfiel | | 2019-11-19 | v.93 | John Hartfiel | | 2019-10-10 | v.92 | Pedram Babakhani | document style update - description bug fix
| 2019-03-01 | v.83 | | | 2018-04-11 | v.81 | John Hartfiel | | 2017-11-14 | v.80 | John Hartfiel | | 2017-11-13 | v.79 | Ali Naseri, Jan Kumann, John Hartfiel | | -- | all | | |
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