Table of Contents |
Overview
Refer to https://shop.trenz-electronic.de/de/Download/?path=Trenz_Electronic/TE0820 for downloadable version of this manual and additional technical documentation of the product.
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The Trenz Electronic TE0820 are 4 x 5 standard footprint MPSoC modules integrating a Xilinx Zynq UltraScale+ with up to 4 GByte 32-Bit DDR4 SDRAM, and max. 512 MByte SPI Boot Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking strips.All this on a tiny footprint, smaller than a credit card, at the most competitive price.
All Trenz Electronic SoMs in 4 x 5 cm form factor are mechanically compatible.
Block Diagram
Main Components
- Xilinx Zynq UltraScale+ ZU3EG MPSoC, U1
- 4A power system on a chip (PowerSoC) DC-DC converter, U5
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (0.9V), U9
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (1.8V), U13
3A PFET load switch with configurable slew rate, fast transient isolation and hysteresis control, Q1
- Ultralow supply-current voltage monitor with optional watchdog, U19
Marvell Alaska 88E1512 integrated 10/100/1000 Mbps energy efficient ethernet transceiver, U8
- Low power programmable oscillator @ 12.000000 MHz, U11
- Miniature traceability S/N pad for low-cost, unique product identification
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (2.5V), U4
- 4 Gbit (256 x 16) DDR4 SDRAM, U3
- 4 Gbit (256 x 16) DDR4 SDRAM, U2
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (1.2V), U15
- 1.8V, 256 Mbit multiple I/O serial flash memory, U17
- 1.8V, 256 Mbit multiple I/O serial flash memory, U7
- Low power programmable oscillator @ 33.333333 MHz, U32
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (0.85V), U12
- 350 mA, ultra-low VIN, RF low-dropout linear regulator with bias pin, U23
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (1.8V), U20
- B2B connector Samtec Razor Beam™ LSHM-150, JM2
- 2A peak sink / source DDR termination regulator with VTTREF buffered reference for DDR2, DDR3, DDR3L, and DDR4, U16
- Low power programmable oscillator @ 52.000000 MHz, U14
- Highly integrated full featured hi-speed USB 2.0 ULPI transceiver, U18
- B2B connector Samtec Razor Beam™ LSHM-130, JM3
- I2C programmable, any frequency , any output quad clock generator, U10
- B2B connector Samtec Razor Beam™ LSHM-150, JM1
- Lattice Semiconductor MachXO2 System Controller CPLD, U21
- eMMC memory, U6
Key features (preliminary)
- Xilinx Zynq UltraScale+ MPSoC 784 pin package (ZU3EG, option ZU5EV)
- Memory:
- 32-Bit DDR4 - 4 GByte max
- SPI Boot Flash dual parallel - 512 MByte max
- 4 GByte eMMC (up to 64 GByte)
- B2B connectors:
Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips
- 14 x MIO, 132 I/O's x HP (3 banks)
- Serial transceiver: PS GTR 4
- GT Reference clock input
- PLL for GT Clocks (optional external reference)
- 1 GBit Ethernet PHY
- USB 2.0 OTG PHY
- Real Time Clock
- Size: 40 x 50 mm
- All power supplies on board.
Technical Specifications
Absolute Maximum Ratings
Parameter | Min | Max | Units | Notes | Reference document |
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VIN supply voltage | -0.1 | 3.6 | V | | |
I/O Bank supply voltage | -0.5 | 3.6 | V | | Xilinx document DS181 |
I/O input voltage for FPGA I/O banks | -0.4 | VCCO_X+0.55 | V | | Xilinx document DS181 |
GT Transceiver | -0.5 | 1.26 | V | | Xilinx document DS181 |
Voltage on module JTAG pins | -0.4 | VCCO_0+0.55 | V | VCCO_0 is 1.8V or 3.3V nominal | Xilinx document DS181 |
Storage temperature | -40 | +85 | °C | | |
Recommended Operating Conditions
Parameter | Min | Max | Units | Notes | Reference document |
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VIN supply voltage | 3.135 | 3.45 | V | | |
IO Bank supply voltage for I/O banks | 1.14 | 3.465 | V | | Xilinx document DS181 |
I/O input voltage for I/O banks | -0.20 | VCCO + 0.20 | V | | Xilinx document DS181 |
Voltage on module JTAG pins | 3.135 | 3.465 | V | For a module variant with 3.3V CONFIG Bank option | Xilinx document DS181 |
Please check Xilinx datasheet DS181 for complete list of absolute maximum and recommended operating ratings for the Artix-7. |
Physical Dimensions
Module size: 40 mm × 30 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8 mm
PCB thickness: 1.6 mm
Highest part on PCB: approximately 2.5 mm. Please download the step model for exact numbers.
All dimensions are shown in mm. Additional sketches, drawings and schematics can be found here.
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Top View, Mounting Holes | Bottom View, Samtec Connectors |
Operating Temperature Ranges
Commercial grade modules
All parts are at least commercial temperature range of 0 °C to +70 °C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
Industrial grade modules
All parts are at least industrial temperature range of -40 °C to +85 °C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
Weight
Variant | Weight in g | Note |
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2IC6 | 8.3 | Plain Module |
Revision History
Hardware Revision History
Date | Revision | Notes | PCN Link | Documentation Link |
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2016-12-23 | 01 | - | | TE0820-01 |
Hardware revision number is printed on the PCB board next to the module model number separated by the dash.
Document Change History
Date | Revision | Authors | Description |
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2017-05-10 | | Jan Kumann | Initial version. |
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