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Table of Contents

Overview

Refer to https://shop.trenz-electronic.de/de/Download/?path=Trenz_Electronic/TE0820 for downloadable version of this manual and additional technical documentation of the product.
 
The Trenz Electronic TE0820 are 4 x 5 standard footprint MPSoC modules integrating a Xilinx Zynq UltraScale+ with up to 4 GByte 32-Bit DDR4 SDRAM, and max. 512 MByte SPI Boot Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking strips.

All this on a tiny footprint, smaller than a credit card, at the most competitive price.

All Trenz Electronic SoMs in 4 x 5 cm form factor are mechanically compatible.

Block Diagram

Main Components

  1. Xilinx Zynq UltraScale+ ZU3EG MPSoC, U1
  2. 4A power system on a chip (PowerSoC) DC-DC converter, U5
  3. 3A High efficiency step-down converter MicroSiP™ with integrated inductor (0.9V), U9
  4. 3A High efficiency step-down converter MicroSiP™ with integrated inductor (1.8V), U13

  5. 3A PFET load switch with configurable slew rate, fast transient isolation and hysteresis control, Q1

  6. Ultralow supply-current voltage monitor with optional watchdog, U19
  7. Marvell Alaska 88E1512 integrated 10/100/1000 Mbps energy efficient ethernet transceiver, U8
  8. Low power programmable oscillator @ 12.000000 MHz, U11
  9. Miniature traceability S/N pad for low-cost, unique product identification
  10. 3A High efficiency step-down converter MicroSiP™ with integrated inductor (2.5V), U4
  11. 4 Gbit (256 x 16) DDR4 SDRAM, U3
  12. 4 Gbit (256 x 16) DDR4 SDRAM, U2
  13. 3A High efficiency step-down converter MicroSiP™ with integrated inductor (1.2V), U15
  14. 1.8V, 256 Mbit multiple I/O serial flash memory, U17
  15. 1.8V, 256 Mbit multiple I/O serial flash memory, U7
  16. Low power programmable oscillator @ 33.333333 MHz, U32
  17. 3A High efficiency step-down converter MicroSiP™ with integrated inductor (0.85V), U12
  18. 350 mA, ultra-low VIN, RF low-dropout linear regulator with bias pin, U23
  19. 3A High efficiency step-down converter MicroSiP™ with integrated inductor (1.8V), U20
  20. B2B connector Samtec Razor Beam™ LSHM-150, JM2
  21. 2A peak sink / source DDR termination regulator with VTTREF buffered reference for DDR2, DDR3, DDR3L, and DDR4, U16
  22. Low power programmable oscillator @ 52.000000 MHz, U14
  23. Highly integrated full featured hi-speed USB 2.0 ULPI   transceiver, U18
  24. B2B connector Samtec Razor Beam™ LSHM-130, JM3
  25.  I2C programmable, any  frequency , any output  quad clock generator, U10
  26. B2B connector Samtec Razor Beam™ LSHM-150, JM1
  27. Lattice Semiconductor MachXO2 System Controller CPLD, U21
  28. 4 GByte eMMC memory, U6

Key features

Initial delivery state

Signals Interfaces and Pins

Board to Board (B2B) I/Os

I/O signals connected to the MPSoC's I/O bank and B2B connector:

BankType

B2B

Connector

I/O Signal

Count

VoltageNotes

64

HP

JM2

48

User

Max voltage 1.8V.

64

HP

JM2

2

User

Max voltage 1.8V.
65

HP

JM2

18

User

Max voltage 1.8V.

65

HP

JM3

12

User

Max voltage 1.8V.

66

HP

JM1

48

User

Max voltage 1.8V.

501

MIO

JM1

6

1.8V

-

505

GTR

JM3

4 lanes

N/A

-

505

GTR CLK

JM3

2 differential inputs

N/A

-

For detailed information about the pin out, please refer to the Pin-out Table.

JTAG Interface

System Controller I/O Pins

On-board LEDs

Default MIO Mapping

Gigabit Ethernet

USB Interface

I2C Interface

Boot Modes

On-board Peripherals

Processing System (PS) Peripherals

Clocking

Power and Power-on sequence

Power Supply

Power-on sequence

Power Rails

Bank Voltages

Board to Board Connectors

Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Notes

Reference document

VIN supply voltage

-0.1

3.6

V

  
I/O Bank supply voltage-0.53.6V Xilinx document DS181
I/O input voltage for FPGA I/O banks-0.4VCCO_X+0.55V Xilinx document DS181
GT Transceiver-0.51.26V Xilinx document DS181

Voltage on module JTAG pins

-0.4

VCCO_0+0.55

V

VCCO_0 is 1.8V or 3.3V nominalXilinx document DS181

Storage temperature

-40

+85

°C

  

Recommended Operating Conditions

ParameterMinMaxUnitsNotesReference document
VIN supply voltage3.1353.45V  
IO Bank supply voltage for I/O banks1.143.465V Xilinx document DS181
I/O input voltage for I/O banks-0.20VCCO + 0.20V Xilinx document DS181
Voltage on module JTAG pins3.1353.465VFor a module variant with
3.3V CONFIG Bank option		Xilinx document DS181
Please check Xilinx datasheet DS181 for complete list of absolute maximum and recommended operating ratings for the Artix-7.

Physical Dimensions

All dimensions are shown in mm. Additional sketches, drawings and schematics can be found here.

Top View, Mounting HolesBottom View, Samtec Connectors

Operating Temperature Ranges

Commercial grade modules

All parts are at least commercial temperature range of 0 °C to +70 °C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Industrial grade modules

All parts are at least industrial temperature range of -40 °C to +85 °C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Weight

VariantWeight in gNote
2IC68.3Plain Module

Revision History

Hardware Revision History

DateRevision

Notes

PCN LinkDocumentation Link
2016-12-2301- TE0820-01

Hardware revision number is printed on the PCB board next to the module model number separated by the dash.

 

Document Change History

Date

Revision

Authors

Description

2017-05-10
Jan KumannInitial version.

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