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The Trenz Electronic TE0745 is an industrial-grade SoC module integrating a Xilinx Zynq-7 (Z-7030, Z-7035 or Z-7045), 1 GByte DDR3/L SDRAM, 32 MByte SPI Flash memory for configuration and operation and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking strips.
Industrial-grade Xilinx Zynq-7000 (Z-7030, Z-7035, Z-7045) SoC module
Additional assembly options are available for cost or performance optimization upon request.
Figure 1: TE0745-02 Block Diagram
Figure 2: TE0745-02 SoC module
Storage device name | Content | Notes |
---|---|---|
24AA025E48 EEPROM | User content not programmed | Valid MAC Address from manufacturer. |
SPI Flash OTP Area | Empty, not programmed | Except serial number programmed by flash vendor. |
SPI Flash Quad Enable bit | Programmed | - |
SPI Flash main array | Demo design | - |
eFUSE USER | Not programmed | - |
eFUSE Security | Not programmed | - |
Si5338 OTP NVM | Default settings pre programmed | OTP not reprogrammable after delivery from factory |
Table 1: Initial delivery state
The Board to Board connectors are high-speed hermaphroditic stacking strips and provide a modular interface to the SoC's PL and PS I/O's.
The connector supports single ended and differential signaling as the I/O's are usable as LVDS-pairs.
The I/O signals are routed from the SoC's PL banks as LVDS-pairs to the B2B connectors.
Bank | Type | B2B Connector | I/O Signal Count | LVDS Pairs Count | VCCO Bank Voltage | Notes |
---|---|---|---|---|---|---|
12 | HR | J1 | 50 | 24 | VCCIO_12 pins J1-54, J1-55 | supported voltages from 1.2V to 3.3V |
13 | HR | J1 | 50 | 24 | VCCIO_13 pins J1-112, J1-113 | supported voltages from 1.2V to 3.3V |
33 | HP | J3 | 50 | 24 | VCCIO_33 pins J3-115, J3-120 | supported voltages from 1.2V to 1.8V |
34 | HP | J2 | 50 | 24 | VCCIO_34 pins J2-29, J2-30 | supported voltages from 1.2V to 1.8V |
35 | HP | J2 | 50 | 24 | VCCIO_35 pins J2-87, J2-88 | supported voltages from 1.2V to 1.8V |
500 | MIO | J2 | 5 | - | 1.8V | - |
501 | MIO | J3 | 12 | - | 1.8V | - |
Table 2: B2B connector pin-outs of available PL and PS banks of the SoC module
For detailed information about the pin out, please refer to the Pin-out Table.
The B2B connector J1 and J2 provide also access to the MGT-banks of the SoC module. There are 8 high-speed data lanes (Xilinx GTX transceiver) available composed as differential signaling pairs for both directions (RX/TX).
The MGT-banks have also clock input-pins which are exposed to the B2B connector J3. Following MGT-lanes are available on the B2B connectors:
Bank | Type | B2B Connector | Count of MGT Lanes | Schematic Names / Connector Pins | MGT Bank's Reference Clock Inputs (LVDS pairs) |
---|---|---|---|---|---|
Bank 111 | GTX | J1 | 4 | MGT_RX4_P, MGT_RX4_N, pins J1-23, J1-21 MGT_RX5_P, MGT_RX5_N, pins J1-17, J1-15 MGT_RX6_P, MGT_RX6_N, pins J1-11, J1-9 MGT_RX7_P, MGT_RX7_N, pins J1-3, J1-5 | 1 reference clock signal (MGT_CLK3) from programmable 1 reference clock signal (MGT_CLK2) from B2B connector |
Bank 112 | GTX | J3 | 4 | MGT_RX3_P, MGT_RX3_N, pins J3-68, J3-70 MGT_RX2_P, MGT_RX2_N, pins J3-62, J3-64 MGT_RX1_P, MGT_RX1_N, pins J3-56, J3-58 MGT_RX0_P, MGT_RX0_N, pins J3-50, J3-52 | 1 reference clock signal (MGT_CLK1) from programmable 1 reference clock signal (MGT_CLK0) from B2B connector |
Table 3: B2B connector pin-outs of available MGT lanes of the SoC module
JTAG access is provided through the SoC's PS configuration bank 0 and available on B2B connector J1.
JTAG Signal | B2B Connector Pin |
---|---|
TCK | J1-143 |
TDI | J1-142 |
TDO | J1-145 |
TMS | J1-144 |
Table 4: B2B connector pin-out of JTAG interface
Special purpose pins are connected to smaller System Controller CPLD and have following default configuration:
Pin Name | Mode | Function | B2B Connector Pin | Default Configuration | |
---|---|---|---|---|---|
JTAG_EN | Input | JTAG Select | J1-148 |
At normal operation the JTAG-signals will be forwarded to the SoC module. VCCIO: PS_3.3V | |
RST_IN_N | Input | Reset | J2-131 | Low-active Power-On reset pin, controls POR_B-signal (bank 500, pin C23) of Zynq-chip. | |
PS_SRST | Input | Reset | J2-152 | Low-active PS system-reset pin of Zynq-chip. | |
BOOTMODE | Output | Bootmode | J2-133 | Control line which sets in conjunction with signal 'BOOTMODE1' (B2B-pin J2-133) Permanent logic high in standard SC-CPLD firmware. | |
PWR_PL_OK | Input | Power Good | J2-135 | Indicates stable state of PL supply voltage (low-active) after power-up sequence. | |
PWR_PS_OK | Input | Power Good | J2-139 | Indicates stable state of PS supply voltage (low-active) after power-up sequence. | |
EN_PL | Output | Enable-signal | - | Low active Enable-signal for activating PL supply voltage. Permanent logic high in standard SC-CPLD firmware. | |
MIO8 | Input | PS MIO | - | User I/O (pulled-up to PS_1.8V) | |
MIO0 | Input | PS MIO | J2-137 | User I/O | |
RTC_INT | Input | Interrupt-signal | - | Interrupt-signal from on-board RTC | |
LED | Output | LED control | - | Green LED D1, indicates SC-CPLD activy by blinking |
LED | Color | connected to | Description and Notes |
---|---|---|---|
D1 | Green | SC CPLD, bank 3, pin 5 | System main status LED, blinking frequently or at system activity |
D2 | Red | Zynq-Chip (U1), bank 0 (config bank), 'DONE' (pin W9) | Reflects inverted DONE signal. ON when FPGA is not configured, OFF as soon as PL is configured. This LED will not operate if the SC CPLD can not power up the PL supply voltage. |
Table 8: LEDs of the SoC module
The SoC module has the following sources to be provided with extern reference clock signals and on-board clock oscillators:
Clock source | Schematic name | Frequency | Clock input destination | Note |
---|---|---|---|---|
B2B connector J3, pin J3-74/J3-76 | CLKIN_N, CLKIN_P | user | Quad PLL clock Generator U16, pin 1/2 | - |
B2B connector J3, pin J3-75/J3-77 | MGT_CLK0_P, MGT_CLK0_N | user | MGT-bank 112, pin R6/R5 | - |
B2B connector J3, pin J3-81/J3-83 | MGT_CLK2_P, MGT_CLK2_N | user | MGT-bank 111, pin W6/W5 | - |
SiTime SiT8008BI oscillator, U21 | - | 25.000 MHz | Quad PLL clock Generator U16, pin 3 | - |
SiTime SiT8008BI oscillator, U12 | PS_CLK | 33.333 MHz | Bank 500 (MIO0 bank), pin B24 | - |
SiTime SiT8008BI oscillator, U23 | OTG-RCLK | 52.000 MHz | USB 2.0 Transceiver PHY U32, pin 26 | - |
SiTime SiT8008BI oscillator, U9 | ETH_CLKIN | 25.000 MHz | Gbit Ethernet PHY U7, pin 34 | - |
Table 12: Clock sources overview
MIO | Function | Connected to | Notes | MIO | Function | Connected to | Notes | |
---|---|---|---|---|---|---|---|---|
0 | GPIO | J2-137, SC CPLD bank 2, pin 14 | user I/O on B2B | 16..27 | ETH0 | Ethernet PHY U7 | RGMII | |
1 | QSPI0 | QSPI Flash Memory U14, pin C2 | SPI Flash-CS | 28..39 | USB0 | USB PHY U32 | ULPI | |
2 | QSPI0 | QSPI Flash Memory U14, pin D3 | SPI Flash-DQ0 | 40 | GPIO | J2-150 | user I/O on B2B | |
3 | QSPI0 | QSPI Flash Memory U14, pin D2 | SPI Flash-DQ1 | 41 | GPIO | J2-152 | user I/O on B2B | |
4 | QSPI0 | QSPI Flash Memory U14, pin C4 | SPI Flash-DQ2 | 42 | GPIO | J2-154 | user I/O on B2B | |
5 | QSPI0 | QSPI Flash Memory U14, pin D4 | SPI Flash-DQ3 | 43 | GPIO | J2-156 | user I/O on B2B | |
6 | QSPI0 | QSPI Flash Memory U14, pin B2 | SPI Flash-SCK | 44 | GPIO | J2-158 | user I/O on B2B | |
7 | GPIO | USB PHY U32, pin 27 | Low active USB PHY Reset (pulled-up to PS_1.8V) | 45 | GPIO | J2-160 | user I/O on B2B | |
8 | GPIO | SC CPLD bank 2, pin 13 | user I/O (pulled-up to PS_1.8V) | 46 | GPIO | J2-145 | user I/O on B2B | |
9 | GPIO | Ethernet PHY U7, pin 16 | Ethernet PHY Reset | 47 | GPIO | J2-147 | user I/O on B2B | |
10 | I²C | SCL-line I²C-interface | 1.8V ref. voltage | 48 | GPIO | J2-149 | user I/O on B2B | |
11 | I²C | SDA-line I²C-interface | 1.8V ref. voltage | 49 | GPIO | J2-151 | user I/O on B2B | |
12 | GPIO | J2-123 | user I/O on B2B | 50 | GPIO | J2-153 | user I/O on B2B | |
13 | GPIO | J2-125 | user I/O on B2B | 51 | GPIO | J2-155 | user I/O on B2B | |
14 | GPIO | J2-127 | user I/O on B2B | 52 | ETH0 | USB PHY U32, pin 7 | MDC | |
15 | GPIO | J2-129 | user I/O on B2B | 53 | ETH0 | USB PHY U32, pin 8 | MDIO |
Table 5: Default MIO Mapping
On board Gigabit Ethernet PHY is provided with Marvell Alaska 88E1512 IC. The Ethernet PHY RGMII Interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from an on-board 25MHz oscillator (U9), the 125MHz output clock is available on B2B connector J2, pin J2-150.
PHY Pin | ZYNQ PS | B2B | Notes |
---|---|---|---|
MDC/MDIO | MIO52, MIO53 | - | - |
PHY LEDs | - | PHY_LED0: J2-144 | - |
PHY_LED2 / INTn: | - | J2-148 | low active interrupt line |
PHY_CLK125M | - | J2-150 | 125 MHz Ethernet PHY clock out |
CONFIG | - | - | permanent high (PS_1.8V) |
RESETn | MIO9 | - | low active reset line |
RGMII | MIO16..MIO27 | - | Reduced Gigabit Media Independent Interface |
SGMII | - | - | Serial Gigabit Media Independent Interface |
MDI | - | PHY_MDI0: J2-120 / J2-122 PHY_MDI1: J2-126 / J2-128 PHY_MDI2: J2-132 / J2-134 PHY_MDI3: J2-138 / J2-140 | Media Independent Interface |
Table 6: Ethernet PHY interface connections
USB PHY is provided by USB3320 from Microchip. The ULPI interface is connected to the Zynq PS USB0. The I/O Voltage is fixed at 1.8V. The reference clock input of the PHY is supplied from an on-board 25 MHz oscillator (U15).
PHY Pin | ZYNQ Pin | B2B Name | Notes |
---|---|---|---|
ULPI | MIO28..39 | - | Zynq USB0 MIO pins are connected to the PHY |
REFCLK | - | - | 52MHz from on board oscillator (U33) |
REFSEL[0..2] | - | - | all pins set to GND selects the external reference clock frequency @52MHz |
RESETB | MIO7 | - | low-active reset line |
CLKOUT | MIO36 | - | set to high (1.8V level (VDDIO)) to select reference clock operation mode |
DP, DM | - | OTG_D_P, OTG_D_N, pin J2-149 / J2-151 | USB data lines |
CPEN | - | VBUS_V_EN, pin J2-141 | External USB power switch active high enable signal |
VBUS | - | USB_VBUS, pin J2-145 | Connect to USB VBUS via a series of resistors, see reference schematics |
ID | - | OTG_ID, pin J2-143 | For an A-Device connect to ground, for a B-Device left floating |
Table 7: USB PHY interface connections
The schematics for the USB connector and required components is different depending on the USB usage. USB standard A or B connectors can be used for Host or Device modes. A Mini USB connector can be used for USB Device mode. A USB Micro connector can be used for Device mode, OTG Mode or Host Mode.
The I²C-interface on the B2B-connector J2 with the pins J2-119 (I2C_33_SCL) and J2-121 (I2C_33_SDA) is operating with the reference voltage PS_3.3V.
Except the RTC, the remaining component's I²C-interfaces are operating with the reference voltage PS_1.8V (voltage level shifting 3.3V ↔ 1.8V via I²C bus repeater U17).
I2C addresses for on-board devices are listed in the table below:
I2C Device | I2C Address | Notes |
---|---|---|
Zynq-chip U1, bank 500 (PS MIO), pins MIO10 (SCL), MIO11 (SDA) | user programmable | configured as I2C by default |
Quad programmable PLL clock generator U16: pins 12 (SCL), 19 (SDA) | 0x70 | - |
MAC Address EEPROM U23, pins 1 (SCL), 3 (SDA) | 0x53 | - |
SC CPLD U2, bank 2, pins 16 (SDA), 17 (SCL) | user programmable | - |
RTC, U24 | 0x6F | - |
RTC RAM, U24 | 0x57 | - |
The Zynq-module TE0745 supports different boot modes which are configurable by the control line 'BOOTMODE' and 'BOOTMODE_1'. The line 'BOOTMODE' is available on B2B connector pin J2-133, the line 'BOOTMODE_1' is connected to the System Controller CPLD on bank 1, pin 21.
The current boot mode will be set by the MIO-pins MIO3...MIO5. The control line 'BOOTMODE' is connected to the 'MIO4' pin, 'BOOTMODE_1' to 'MIO5'.
Following table describes how to set the control lines to configure the desired boot mode:
Boot Mode | MIO5 (BOOTMODE_1) | MIO4 (BOOTMODE) | MIO3 | Note |
---|---|---|---|---|
JTAG | 0 | 0 | 0 | - |
NOR | 0 | 0 | 1 | MIO3 pin is shared with QSPI Flash Memory (QSPI-DQ1) |
NAND | 0 | 1 | 0 | - |
QSPI Flash Memory | 1 | 0 | 0 | standard mode in current configuration |
SD-Card | 1 | 1 | 0 | SD-Card on base board necessary |
Table 9: Selectable boot modes
Name | IC | ID | PS7 | MIO | Notes |
---|---|---|---|---|---|
SPI Flash | S25FL256SAGBHI20 | U14 | QSPI0 | MIO1..MIO6 | - |
A Microchip 24AA025E48 EEPROM (U23) is used which contains a globally unique 48-bit node address, that is compatible with EUI-48(TM) and EUI-64(TM) specification. The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use. It is accessible through the I²C slave address 0x53.
An temperature compensated Intersil ISL12020M is used as Real Time Clock (U24). Battery voltage must be supplied to the clock from the base board via pin 'VBAT_IN' (J1-146). Battery backed registers can be accessed over I²C bus at slave address 0x6F. General purpose RAM of the RTC can be accessed at I²C slave address 0x57. RTC IC is supported by Linux so it can be used as hwclock device. The interrupt line 'RTC_INT' of the RTC is connected to System Controller CPLD on bank 3, pin 4.
There is a Silicon Labs I²C programmable quad PLL clock generator Si5338A (U16) on-board. It's output frequencies can be programmed by using the I²C-bus with address 0x70.
A 25 MHz (U21) oscillator is connected to pin 3 (IN3) and is used to generate the output clocks.
Once running, the frequency and other parameters can be changed by programming the device using the I²C-bus connected between the Zynq-module (master) and reference clock signal generator (slave).
Si5338A (U13) input | signal schematic name | Note |
---|---|---|
IN1/IN2 | CLKIN_P, CLKIN_N | reference clock signal from B2B connector J3, pin J3-74/J3-76 (base board decoupling capacitors and termination resistor necessary) |
IN3 | reference clock signal from oscillator SiTime SiT8008BI (U21) | 25.000 MHz fixed frequency |
IN4/IN6 | pins put to GND | LSB (pin 'IN4') of the default I²C-adress 0x70 not activated |
IN5 | not connected | - |
Si5338A (U13) output | signal schematic name | Note |
CLK0 A/B | MGTCLK1_P, MGTCLK1_N | reference clock signal to MGT-bank 112, pin U6/U5 (100 nF decoupling capacitors) |
CLK1 A/B | CLK1_P, CLK1_N | clock signal routed to B2B connector, pin J3-80/J3-82 |
CLK2 A/B | CLK2_P, CLK2_N | clock signal routed to B2B connector, pin J3-86/J3-88 |
CLK3 A/B | MGTCLK3_P, MGTCLK3_N | reference clock signal to MGT-bank 111, pin AA6/AA5 (100 nF decoupling capacitors) |
Table 13: Pin description of PLL clock generator Si5338A
Power supply with minimum current capability of 3A for system startup is recommended.
Power Consumption
Power Input Pin | Max Current |
---|---|
PL_VIN | TBD* |
PS_VIN | TBD* |
PS_3.3V | TBD* |
Table 14: Maximum current of power supplies. *to be determined soon with reference design setup.
For the lowest power consumption and highest efficiency of on board DC/DC regulators it is recommended to powering the module from one single 3.3V supply. All input power supplies have a nominal value of 3.3V. Although the input power supplies can be powered up in any order, it is recommended to power them up simultaneously.
The on-board voltages of the TE0745 SoC module will be powered-up in order of a determined sequence after the external voltages 'PL_VIN', 'PS_VIN' and 'PS_3.3V' are available.
To avoid any demages to the SoC module, check for stabilized on-board voltages in steady state before powering up the SoC's I/O bank voltages VCCO_x. |
Core voltages and main supply voltages have to reach stable state and their "Power Good"-signals have to be asserted before other voltages like PL bank's I/O voltages can be powered up.
It is important that all baseboard I/Os are 3-stated at power-on until the "Power Good"-signals 'PWR_PS_OK' (J2-139) and 'PWR_PL_OK' (J2-135) are high, meaning that all on-module voltages have become stable and module is properly powered up.
Following diagram clarifies the sequence of enabling the particular on-board voltages:
Figure 3: Power-up sequence diagram
See Xilinx datasheet DS191 for additional information. User should also check related base board documentation when intending base board design for TE0745 module.
Voltages on B2B | B2B J1 Pin | B2B J2 Pin | B2B J3 Pin | Input/ | Note |
---|---|---|---|---|---|
PL_VIN | 147, 149, 151, 153, | - | - | Input | supply voltage |
PS_VIN | - | 154, 156, 158 | - | Input | supply voltage |
PS_3.3V | - | 160 | - | Input | supply voltage |
VCCIO12 | 54, 55 | - | - | Input | high range bank I/O voltage |
VCCIO13 | 112, 113 | - | - | Input | high range bank I/O voltage |
VCCIO33 | - | - | 115, 120 | Input | high performance bank I/O voltage |
VCCIO34 | 29, 30 | - | Input | high performance bank I/O voltage | |
VCCIO35 | 87, 88 | - | Input | high performance bank I/O voltage | |
VBAT_IN | 146 | - | - | Input | RTC (battery-backed) supply voltage |
PS_1.8V | - | 130 | - | Output | internal 1.8V voltage level (Process System supply) |
Table 15: Power rails of the SoC module on accessible connectors
Bank | Schematic Name | Voltage | Voltage Range |
---|---|---|---|
0 (config) | VCCIO_0 | PL_1.8V if R67 is equipped | - |
500 (MIO0) | PS_1.8V | 1.8V | - |
501 (MIO1) | PS_1.8V | 1.8V | - |
502 (DDR3) | 1.35V | 1.35V | - |
12 HR | VCCIO_12 | User | HR: 1.2V to 3.3V |
13 HR | VCCIO_13 | User | HR: 1.2V to 3.3V |
33 HP | VCCIO_33 | User | HP: 1.2V to 1.8V |
34 HP | VCCIO_34 | User | HP: 1.2V to 1.8V |
35 HP | VCCIO_35 | User | HP: 1.2V to 1.8V |
Table 16: Range of SoC module's bank voltages
Module Variant | Zynq SoC | SoC Junction Temperature | Operating Temperature Range |
---|---|---|---|
TE0745-02-30-1I | XC7Z030-1FBG676I | –40°C to +100°C | Industrial |
TE0745-02-35-1C | XC7Z035-1FBG676C | 0°C to +85°C | Commercial |
TE0745-02-45-1C | XC7Z045-1FBG676C | 0°C to +85°C | Commercial |
TE0745-02-45-2I | XC7Z045-2FBG676I | –40°C to +100°C | Industrial |
Parameter | Min | Max | Units | Notes |
---|---|---|---|---|
PL_VIN | -0.3 | 5 | V | TI TPS720 data sheet |
PS_VIN | -0.3 | 7 | V | TI TPS82085 data sheet |
PS_3.3V | 3.135 | 3.465 | V | 3.3V nominal ± 5% Attention: PS_3.3V is directly connected to numerous |
VBAT supply voltage | -1 | 6.0 | V | ISL12020MIRZ data sheet |
PL IO bank supply voltage for HR I/O banks (VCCO) | -0.5 | 3.6 | V | - |
PL IO bank supply voltage for HP | -0.5 | 2.0 | V | - |
I/O input voltage for HR I/O banks | -0.4 | VCCO_X+0.55 | V | - |
I/O input voltage for HP I/O banks | -0.55 | VCCO_X+0.55 | V | - |
GT receiver (RXP/RXN) and transmitter (TXP/TXN) | -0.5 | 1.26 | V | - |
Voltage on module JTAG pins | -0.3 | 3.6 | V | MachX02 Family data sheet |
Storage temperature | -40 | +85 | °C | limited from ISL12020MIRZ |
Storage temperature without the ISL12020MIRZ | -55 | +100 | °C | limit of DDR3 |
Assembly variants for higher storage temperature range are available on request. |
Parameter | Min | Max | Units | Notes | Reference Document |
---|---|---|---|---|---|
PL_VIN | 3.3 | 4.5 | V | - | TI TPS720 data sheet |
PS_VIN | 3.3 | 6.0 | V | - | TI TPS82085 data sheet |
PS_3.3V | 3.135 | 3.465 | V | - | 3.3V nominal ± 5% |
VBAT_IN supply voltage | 2.7 | 5.5 | V | - | ISL12020MIRZ data sheet |
PL I/O bank supply voltage for HR | 1.14 | 3.465 | V | - | Xilinx datasheet DS191 |
PL I/O bank supply voltage for HP | 1.14 | 1.89 | V | - | Xilinx datasheet DS191 |
I/O input voltage for HR I/O banks | -0.20 | VCCO_X+0.20 | V | - | Xilinx datasheet DS191 |
I/O input voltage for HP I/O banks | -0.20 | VCCO_X+0.20 | V | - | Xilinx datasheet DS191 |
GT receiver (RXP/RXN) and transmitter (TXP/TXN) | (*) | (*) | V | (*) Check datasheet | Xilinx datasheet DS191 |
Voltage on Module JTAG pins | 3.135 | 3.6 | V | JTAG-signals forwarded to Zynq-module config bank 0 | MachX02 Family Data Sheet |
Please check Xilinx datasheet DS191 (for XC7Z030) for complete list of absolute maximum and recommended operating ratings. |
Module size: 52 mm × 76 mm. Please download the assembly diagram for exact numbers
Mating height with standard connectors: 4mm
PCB thickness: 1.6mm
Highest part on PCB: approx. 3mm. Please download the step model for exact numbers
All dimensions are given in millimeters.
Figure 4: Physical dimensions of the TE0745 SoC module
Commercial grade: 0°C to +70°C.
Industrial grade: -40°C to +85°C.
The module operating temperature range depends also on customer design and cooling solution. Please contact us for options.
24 g - Plain module
Date | Revision | Notes | Link to PCN | Documentation Link |
---|---|---|---|---|
2016-10-11 | 02 | Production release | TE0745-02 | |
2016-04-18 | 01 | Prototypes | TE0745-01 |
Hardware revision number is written on the PCB board together with the module model number separated by the dash.
Figure 5: TE0745 SoC module revision number
Date | Revision | Contributors | Description |
---|---|---|---|
2017-03-31 | Ali Naseri, Jan Kumann | first TRM release | |
2017-02-05 | V1
| Jan Kumann | Initial document. |