All TE USB FX2 modules feature the same Cypress EZ-USB FX2LP USB 2.0 microcontroller and high speed USB peripheral controller.
Generation 2 and generation 3 technology stacks share the same hardware.

TE0300 Series

FPGA:

Xilinx ï»¿Spartan-3E (1200, 1600)

Baseboards:

ï»¿TE0303: Prototyping Baseboard for Trenz Electronic TE0300 and TE0630 Micromodules
TE0304: Application Baseboard for Trenz Electronic TE0300 and TE0630 Micromodules

Documentation:

Reference designs using Xilinx ISE 13.3 and Xilinx EDK 13.3:

TE0320 Series

FPGA:

Xilinx Spartan-3A DSP (1800, 3400)

Baseboards:

TE0323 Prototyping Baseboard for Trenz Electronic TE0320 Micromodules

Documentation:

Reference design using Xilinx ISE 13.3and Xilinx EDK 13.3:

TE0630 Series

FPGA:

Xilinx Spartan-6 LX (45, 75, 100, 150)

Documentation:

Baseboards:

TE0303 Prototyping Baseboard for Trenz Electronic TE0300 and TE0630 Micromodules
TE0304 Application Baseboard for Trenz Electronic TE0300 and TE0630 Micromodules

Documentation:

http://www.trenz-electronic.de/download/d0/Trenz_Electronic/d1/TE0630_series.html

Reference designs using Xilinx ISE 13.2 and Xilinx EDK 13.2:

Difference Between TE0300 and TE0320/TE0630

The amount of data that the user can transfer in each packet (PacketSize) depends on the Trenz Electronic USB FX2 module used:

TE0300: PacketSize ≤ 51,200 bytes;
TE0320, TE0630: PacketSize ≤ 102,400 bytes.

If the user wishes to transfer data or files larger than the above sizes, he/she must decompose them into smaller packets before transfer and recompose them after transfer.