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Table of Contents |
Refer to https://wiki.trenz-electronic.de/display/DRAFT/TE0723+TRM for downloadable version of this manual and additional technical documentation of the product. |
The Trenz Electronic TE0723 is a Arduino compatible FPGA module based on the Xilinx Zynq XC7Z010 SoC.
Additional assembly options are available for cost or performance optimization upon request.
Figure 1: TE0723 block diagram.
Figure 2: Main components of the TE0723 module.
High-speed CMOS logic analog multiplexer/demultiplexer, U10
1A PowerSoC DC-DC converter (3.3 V), U20
Storage device name | Content | Notes |
---|---|---|
Quad SPI Flash | Empty |
Table 1: Initial delivery state of programmable devices on the module.
...
List of I/O signals between PS/PL banks and external connectors:
Bank | Type | Connector | Signal Count | Voltage | Notes |
---|---|---|---|---|---|
34 | HR | J1 | 6 | 3.3 | D8 .. 13, SDA, SCL |
34 | HR | J2 | 8 | 3.3 | D2 .. 7, RXD, TXD |
34 | HR | J6 | 8 | 3.3 | PIO01 .. PIO08 |
35 | HR | J4 | 7 | 3.3 | AIN0 .. 5 |
35 | HR | J5 | 1 | 3.3 | ESP_GPIO2 |
500 | MIO | J10 | 6 | 3.3 | SDCARD |
501 | MIO | J5 | 4 | 3.3 | ESP_RXD, ESP_TXD, ESP_GPIO0, MOD_RST |
Table x: .
JTAG access to the Xilinx Zynq XC7Z010 SoC is provided through testpoints TP1-T4.
JTAG Signal | Testpoint |
---|---|
TCK | TP3 |
TDI | TP1 |
TDO | TP2 |
TMS | TP4 |
Table 5: JTAG interface signals.
MIO | Function | Connected To | Notes |
---|---|---|---|
0 | SDCARD | J10-9 | Card detect switch. |
1 | QSPI | U5-1 | SP0-CS |
2 | QSPI | U5-5 | SPI0-DQ0 |
3 | QSPI | U5-2 | SPI0-DQ1 |
4 | QSPI | U5-3 | SPI0-DQ2 |
5 | QSPI | U5-7 | SPI0-DQ3 |
6 | QSPI | U5-6 | SPI0-SCK |
7 | GPIO | U18-27 | USB PHY reset |
9 | LED | D2 | Red LED |
10 | SDCARD | J10-7 | DAT0 |
11 | SDCARD | J10-3 | CMD |
12 | SDCARD | J10-5 | CLK |
13 | SDCARD | J10-8 | DAT1 |
14 | SDCARD | J10-1 | DAT2 |
15 | SDCARD | J10-2 | CD/DAT3 |
28 | USB-OTG | U18-7 | OTG-DATA4 |
29 | USB-OTG | U18-31 | OTG-DIR |
30 | USB-OTG | U18-29 | OTG-STP |
31 | USB-OTG | U18-2 | OTG-NXT |
32 | USB-OTG | U18-3 | OTG-DATA0 |
33 | USB-OTG | U18-4 | OTG-DATA1 |
34 | USB-OTG | U18-5 | OTG-DATA2 |
35 | USB-OTG | U18-6 | OTG-DATA3 |
36 | USB-OTG | U18-1 | OTG-CLK |
37 | USB-OTG | U18-9 | OTG-DATA5 |
38 | USB-OTG | U18-10 | OTG-DATA6 |
39 | USB-OTG | U18-13 | OTG-DATA7 |
48 | ESP | J5-2 | ESP_TXD |
49 | ESP | J5-7 | ESP_RXD |
52 | ESP | J5-6 | MOD_RST |
53 | ESP | J5-3 | ESP_GPIO0 |
I2C interface pins from the Zynq SoC PL bank 34 are connected to the connector J1. There are no on-board I2C slave devices.
Signal | Zynq SoC Pin | Connected To |
---|---|---|
SDA | R13 | J1-9 |
SCL | P13 | J1-10 |
Table x: .
The module has following reference clock signals provided by on-board oscillators:
Source | Signal | Frequency | Destination | Pin Name | Notes |
---|---|---|---|---|---|
U14 | PS_CLK | 52.000000 MHz | U1 | PS_CLK_500 | Zynq SoC PS subsystem main clock. |
U14 | OTG-RCLK | 52.000000 MHz | U18 | REFCLK | USB3320C PHY reference clock. |
U7 | OSCI | 12.000000 MHz | U3 | OSCI | FT2232H oscillator input. |
Table x: Reference clock signals.
There are three LEDs on-board TE0723:
LED | Color | Connected To | Description and Notes |
---|---|---|---|
D2 | Red | MIO9, U1 | User LED. |
D6 | Green | U1, bank 34 pin G14 | FPGA_LED |
D7 | Green | 3.3V | PWR_LED, power-on LED. |
Table x: On-board LEDs.
Single 5V power supply with minimum current capability of 2A for system startup is recommended.
TBD - To Be Determined.
There is no sequence...
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
VIN supply voltage | -0.5 | 3.6 | V | Xilinx datasheet DS187, "Zynq-7000 All Programmable SoC: DC and AC Switching Characteristics". |
Storage temperature | -40 | +85 | °C |
Table x: .
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
Supply voltage | 1.14 | 3.465 | V | Xilinx datasheet DS187, "Zynq-7000 All Programmable SoC: DC and AC Switching Characteristics". |
Table x: .
Assembly variants for higher storage temperature range are available on request. |
Module size: 68.58 mm × 53.34 mm. Please download the assembly diagram for exact numbers.
PCB thickness: 1.6 mm.
Highest part on PCB: approx. 4 mm. Please download the step model for exact numbers.
Please note that two different units are used on the figures below, SI system millimeters (mm) and imperial system thousandths of an inch(mil). To convert mils to millimeters and vice versa use formula 100mil's = 2,54mm.
Figure 3: TE0723 module physical dimensions.
Commercial grade: 0°C to +70°C.
Industrial grade: -40°C to +85°C.
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Date | Revision | Notes | PCN | Documentation Link |
---|---|---|---|---|
2016-07-15 | 03 | Click to see PCN. | TE0723-03 | |
2015-11-06 | 02 | TE0723-02 | ||
01 |
|
Table x: TE0723 hardware revision history.
Hardware revision number is printed on the PCB board together with the module model number separated by the dash.
Date | Revision | Contributors | Description |
---|---|---|---|
Jan Kumann | Initial document. |
Table x: Document change history.