<!--
Template Revision 1.64
(HTML comments will be not displayed in the document, no need to remove them. For Template/Skeleton changes, increase Template Revision number. So we can check faster, if the TRM style is up to date).
-->

Overview

Refer to https://wiki.trenz-electronic.de/display/DRAFT/TE0723+TRM for downloadable version of this manual and additional technical documentation of the product.
 

Key Features

• Xilinx Zynq XC7Z010 SoC
• Dual ARM Cortex A9
• 512 MByte DDR3L SDRAM
• 16 MByte quad SPI Flash memory
• Hi-speed USB2.0 ULPI transceiver
• 23 FPGA I/O's available on board-to-board connectors
• Micro SD Card socket with card detect signal
• Micro USB OTG
• On-board USB JTAG and UART
• RGB LED (connected to PL I/O)
• "Done" LED (inverted polarity)
• CERN Open Hardware Licence 1.2

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Figure 1: TE0723 block diagram.

Main Components

Figure 2: Main components of the TE0723 module.

1. Xilinx Zynq XC7Z010 SoC, U1
2. 4 Gbit DDR3L 256M x 16 SDRAM, U2
3. 16 MByte quad SPI Flash memory, U5

4. High-speed CMOS logic analog multiplexer/demultiplexer, U10

5. 1 MHz low-power operational amplifier, U11
6. Dual high-speed USB to multipurpose UART/FIFO, U3
7. 0.5A dual-channel current-limited power switch, U21
8. Low-power programmable oscillator @ 12.000000 MHz, U7
9. 2-Kbit Microwire compatible serial EEPROM, U6
10. 10-pin header, J1
11. 8-pin header, J2
12. 10-pin header, J3
13. Analog input header, J4
14. 2 x 4-pin header, J5
15. PMod 2x6 interface header, J6
16. USB host mode jumper, J7
17. Micro USB 2.0 Type-B receptacle, J8
18. Micro USB 2.0 Type-B receptacle, J9
19. Micro SD card connector with detect signal, J10
20. Analog input select jumper, J11
21. 5V supply power input, J12
22. Reset switch, S1
23. Red LED, D2
24. Green LED, D6
25. Green LED, D7
26. Ultra-low supply-current voltage monitor, U23

27. 1A PowerSoC DC-DC converter (3.3 V), U20

28. 1A PowerSoC DC-DC converter (1.8 V, U19
29. 1A PowerSoC DC-DC converter (1.35 V), U16
30. Hi-speed USB 2.0 ULPI transceiver, U18
31. Low-power programmable oscillator @ 52.000000 MHz, U14
32. 1A PowerSoC DC-DC converter (1.0 V), U17
33. JTAG interface testpoints, TP1-TP4

Initial Delivery State

Table 1: Initial delivery state of programmable devices on the module.

Boot Process

The 7 boot mode strapping pins on the TE0723 module are set to boot the system from quad SPI Flash only. For additional information refer to the TE0723 schematic and Xilinx UG585 Zynq-7000 All Programmable SoC Technical Reference Manual section "Boot Mode Pin Settings".

You may also refer to this TE0723 reference design for some Boot Process tips.

Signals, Interfaces and Pins

I/O Signals

Overview of the Zynq SoC's PS/PL banks I/O signals connected to the external connectors:

Table 2: Overview of the Zynq SoC's PS/PL banks I/O signals.

JTAG Interface

JTAG access to the Xilinx Zynq XC7Z010 SoC is provided through FTDI USB/UART FIFO bridge connected to the J9 Micro USB connector.

Quad SPI Interface

Quad SPI Flash (U5) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500, pins MIO1 ... MIO6.

Table 3: Quad SPI interface signals and connections.

SD Card Interface

TE0723 module has on-board 3.3V SD Card socket (J10) with card detect switch wired to the SoC PS MIO bank 500.

Table 4: SD card socket signals.

USB Interface

Table 5: USB interface.

ESP Wi-Fi Interface

Interface for the ESP8266 Wi-Fi module is provided through connector J5.

Table 6: ESP8266 Wi-Fi module interface.

I2C Interface

I²C interface pins SCL and SDA from the Zynq SoC PL bank 34 are connected to the connector J1. There are no on-board I2C slave devices.

Table 7: Zynq SoC I²C interface.

On-board Peripherals

DDR Memory

TE0723 module has up to 512-MBytes of DDR3L SDRAM arranged into 32-bit wide memory bus providing total of 1 GBytes of on-board RAM. Different memory sizes are available optionally.

Quad SPI Flash Memory

On-board quad SPI Flash memory S25FL127S (U5) is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application storage. All four SPI data lines are connected to the Zynq SoC's PS, allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the bus width and clock frequency used.

Dual High-speed USB to Multipurpose UART/FIFO

FT2232H...

High-speed USB ULPI PHY

Hi-speed USB ULPI PHY (U18) is provided with USB3320 from Microchip. The ULPI interface is connected to the Zynq SoC's PS USB0 via MIO28..39, bank 501 (see also section). The I/O voltage is fixed at 3.3V and PHY reference clock input is supplied from the on-board 52.000000 MHz oscillator (U14).

Microwire Serial EEPROM

There is a 2-Kbit (128 x 16-bit organization) Microwire compatible serial EEPROM 93AA56B (U6) connected to the FTDI FT2232H dual high-speed USB to multipurpose UART/FIFO (U3). This external EEPROM allows each of the FTDI FT2232H chip’s channels to be independently configured as a serial UART (RS232 mode), parallel FIFO (245) mode or fast serial (optical isolation). The external EEPROM can also be used to customize the USB VID, PID, serial number, product description strings and power descriptor value of the FT2232H for OEM applications. Other parameters controlled by the EEPROM include remote wake up, soft pull down on power-off and I/O pin drive strength.

High-Speed Analog Multiplexer

TE0723 module has a on-board TI CD74HC4051 high-speed CMOS logic analog multiplexer (U10) with 8 analog inputs from connectors J4 and J11, and single analog output connected to the operational amplifier (see next section).

Low-power Operational Amplifier

8-input analog multiplexer output is connected to the on-board Microchip Technology MCP6001 operational amplifier (U11). Amplifier output is connected to the Zynq SoC's PS bank 0, XADC dedicated differential analog input pins VP_0 and VN_0.

Oscillators

The module has following reference clock signals provided by on-board oscillators:

Table 8: Reference clock signals.

On-board LEDs

There are three LEDs on-board TE0723:

Table 9: On-board LEDs.

Power and Power-On Sequence

Power Supply

5V power can be supplied by the external power supply through connector J12 or via USB connection to the host system through USB connector J8 or J9. Minimum current capability of 1A for external power supply is recommended.

Power Consumption

Power consumption is to be determined by the user and depends on SoC's FPGA design and connected hardware.

Power-On Sequence

There is no specific power-on sequence, system will power-up automatically when 5V is present either through J8, J9 or J12.

Variants Currently in Production

Table 10: Module variants.

Technical Specifications

Absolute Maximum Ratings

Table 11: TE0723 module absolute maximum ratings.

Recommended Operating Conditions

Table 12: TE0723 module recommended operating conditions.

Physical Dimensions

• Module size: 68.58 mm × 53.34 mm.  Please download the assembly diagram for exact numbers.

• PCB thickness: 1.6 mm.

• Highest part on PCB: approx. 4 mm. Please download the step model for exact numbers.

Please note that two different units are used on the figures below, SI system millimeters (mm) and imperial system thousandths of an inch(mil). To convert mils to millimeters and vice versa use formula 100mil's = 2,54mm.

Figure 3: TE0723 module physical dimensions.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Revision History

Hardware Revision History

Table 13: TE0723 hardware revision history.

Hardware revision number is printed on the PCB board together with the module model number separated by the dash.

Document Change History

Date	Revision	Contributors	Description
		Jan Kumann	Initial document.

Table 14: Document change history.

Disclaimer