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Table of Contents

Overview


Refer to https://shop.trenz-electronic.de/de/Download/?path=Trenz_Electronic/carrier_boards/TE0703 for downloadable version of this manual and the rest of available documentation.



The Trenz Electronic TE0703 Carrier Board is a base-board for 4x5 SoM's, which exposes the MIO- and the PS/PL-pins of the SoM to accessible connectors and provides a whole range of on-board-components to test and evaluate Trenz Electronic 4x5 SoM's.

See page "4 x 5 cm carriers" to get information about the SoM's supported by the TE0703 Carrier Board.

 

Block Diagram

Main Components

  1. Samtec Razor Beam™ LSHM-150 B2B connector, JB1
  2. Samtec Razor Beam™ LSHM-150 B2B connector, JB2
  3. Samtec Razor Beam™ LSHM-130 B2B connector, JB3
  4. Micro SD card socket with detect switch, J3
  5. LED indicators D1 and D2
  6. Mini-USB type B connector, J4
  7. LED indicators D3 and D4
  8. Configuration DIP switches, S2 (see table under "DIP switches" section)
  9. User push button (Reset), S1
  10. External connector (VG96) placeholder, J1
  11. External connector (VG96) placeholder, J2
  12. VCCIO voltage selection jumper block, J5, J8, J9 and J10 (see "Power and Power-On Sequence" section)
  13. Trxcom 1000Base-T Gigabit RJ45 Magjack, J14
  14. USB type A receptacle, J6 (optional micro USB 2.0 type B receptacle available, J12)
  15. 5V power connector jack, J13

Key Features

Initial Delivery State

Board is shipped in following configuration:

SwitchPositionDescription
S2-1ONMode control MC1.
S2-2ONMode control MC0.

S2-3

ONJTAG enabled for B2B JB1 connector.
S2-4OFFBoot mode set to QSPI.

Different delivery configurations are available upon request.

Signals, Interfaces and Pins

Board to Board (B2B) I/O's

For detailed information about the B2B pin out, please refer to the Master Pin-out Table. 

Micro SD Card Socket

Micro SD card socket is connected to the B2B connector through a Texas Instruments TXS02612 SDIO port expander for voltage translation. The Micro SD card has 3.3V signal voltage level while most 4x5 modules use 1.8V for the SD card interface.

USB JTAG and UART

TE0703 has on-board USB JTAG and UART solution based on UART/FIFO controller from FTDI. FTDI EEPROM is pre-programmed with license code to support Xilinx programming tools.

Do not access the FT2232H EEPROM using FTDI programming tools, doing so will erase normally invisible user EEPROM content and invalidate stored Xilinx JTAG license. Without this license the on-board JTAG will not be accessible any more with any Xilinx tools. Software tools from FTDI website do not warn or ask for confirmation before erasing user EEPROM content.

Ethernet 

On-board Ethernet jack J14 pins are routed to B2B connector JB1. Ethernet jack J14 LEDs PHY_LED1 and PHY_LED2 are both routed to System Controller CPLD bank 1.

USB Interface

TE0703 board has two physical USB sockets:

JTAG Interface

JTAG access to the System Controller CPLD and Xilinx Zynq chip on the SoM is provided via mini-USB JTAG interface (FTDI FT2232H) and controlled by DIP switch S2-3. JTAG signals from System Controller CPLD to the JB2 connector are routed as follows:

JTAG Signal

B2B Connector Pin

TCKJB2-100
TDOJB2-98
TDIJB2-96
TMSJB2-94

LEDs

There are four on-board LEDs:

LEDColorDescription
D1RedFTDI UART receive activity.
D2GreenFTDI UART transmit activity.
D3RedCPLD signal FL_0.
D4GreenCPLD signal FL_1.

LEDs D3 and D4 are also connected to the B2B connector JB2 pins FLED1 and FLED2 respectively and can be controlled by SoM FPGA firmware.

DIP switches

SwitchONOFFNotes
S2-1User configurable, routed to CPLDUser configurable, routed to CPLD 
S2-2User configurable, routed to CPLDUser configurable, routed to CPLD 
S2-3JTAG enabled for B2B connector JB2JTAG enabled for CPLD 
S2-4 Boot from SD CardBoot from QSPI flash on module 

Power

Power supply with minimum current capability of 3A for system startup is recommended.

Power Supply

Single power supply with minimum current capability of 3A at 5V for system startup is recommended.

Power Consumption

Power Input PinMax Current
VIN (power connector jack J13)4A

Typical power consumption for TE0703-05 + TE0715-01 module with SD micro card inserted, Ethernet connected and link up, system booted into Linux prompt and idling is 5V / 0.55A.

Power-On Sequence

It is not allowed to feed any voltage to any external I/O pin before there is no power indication on M3.3VOUT pins. Presence of 3.3V on B2B JB2 connector pins 9 and 11 indicates that module is properly powered up and ready.

If any of the VCCIOA, VCCIOB, VCCIOC or VCCIOD will be powered through external connectors J1 or J2, then corresponding VCCIO jumper should also be removed altogether, see next chapter.

 VCCIO voltage selection jumpers J5, J8, J9 and J10

Refer to the 4x5 Module Integration Guide for VCCIO voltages options.

Jumper J5

1-22-3Voltage

VCCIOA

ONOFF1.8 V
VCCIOAOFFON3.3 V


Jumper J81-22-3Voltage
VCCIOBONOFF1.8 V
VCCIOBOFFON3.3 V


Jumper J91-22-3Voltage
VCCIOCONOFF1.8 V
VCCIOCOFFON3.3 V


Jumper J101-22-3Voltage
VCCIODONOFF1.8 V
VCCIODOFFON3.3 V


Take care of the VCCO voltage ranges of the  particular PL IO-banks (HR, HP) of the mounted SoM, otherwise damages may occur to the FPGA. Therefore, refer to the TRM of the mounted SoM to get the specific information of the voltage ranges.

It is recommended to set and measure the PL IO-bank supply-voltages before mounting of TE 4 x 5 module to avoid failures and damages to the functionality of the mounted SoM.

Board to Board Connectors

Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Reference document

Supply Voltage VCC

-0.33

5.5

V

 
Operating temperature

-40

+125

°C

Lattice Semiconductor MachXO2 family datasheet

Storage temperature

-55

+125

°C

 

Recommended Operating Conditions

Parameter

MinMax

Units

Reference document

Supply voltage VCC

4.75

5.25

V

 
Operating temperature

0

+70

°C

 


Assembly variants for higher storage temperature range are available on request.


Please check components datasheets for complete list of absolute maximum and recommended operating ratings.

Physical Dimensions

 All dimensions are given in millimeters.

 

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Board operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Weight

42g - Plain board.

13g - 2 x VG96 connectors.

Revision History

Hardware Revision History

Date

Revision

Notes

PCN

Documents

2016-09-07

05

Added VCCIO Jumpers

PCN-20161122

TE0703

-

04

Corrected FTDI EEPROM connection

-

TE0703-04

-

03

Added VCCIO strapping resistors

-

 

-

02

First series boards

-

 

-

01

Prototypes

-

 

Hardware revision number is printed on the PCB board next to the module model number separated by the dash.

Document Change History

Date

Revision

Contributors

Description



John Hartfiel
  • add B2B connector section
2017-02-21

v.19


Jan Kumann
  • New block diagram.
2017-02-02

v.16

Jan Kumann
  • New board image with silk screen pin markings for VG96 connectors J1 and J2.
2016-12-22

v.14

Jan Kumann
  • Block diagram added.
2016-12-08
v.10

Jan Kumann

  • Document structure revised.
2016-12-05

v.5

John Hartfiel
  • Corrected Boot Mode table.
2016-09-06

v.1

Jan Kumann, John Hartfiel

  • Initial document.

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