Products Affected

This change affects all Trenz Electronic TE0841 SoMs: TE0841-01*.

Changes

#1 Change SPI Flash from N25Q256A11E1240E to N25Q512A11G1240E

Type: BOM change

Reason: N25Q256A11E1240E became obsolete, the replacement part is not available for purchase. This is only an interim solution, because N25Q512A11G1240E is also obsolete already. It will be changed after the replacement parts will be available.

Impact: size changed from 256 MBit to 512 MBit per chip. JEDEC ID changed from BB19h to BB20h, both with manufacturer ID 20h.

Method of identification

Locate Flash on backside of PCB:

#2 Change of DDR4 from NT5AD256M16B2-GN to K4A8G165WB-BIRC

Type: BOM change

Reason: NT5AD256M16B2-GN will be obsolete, doubles the DDR size, industrial temperature grade of DDR.

Impact: new DDR timing and size need to be considered in customer design.

#3 Fixed sense connection on DCDC

Type: Layout change

Reason: Sense connection was not optimal, voltage drop under high load was too high.

Impact: None

#4 Added support for 16 GBIT DDR4 chips

Type: Layout change

Reason: Add support for higher memory capacity.

Impact: None

#5 Added strong pull-down to EN_PL

Type: Layout change

Reason: Improved reliability.

Impact: None

#6 Added additional testpoints for I2C bus

Type: Layout change

Reason: Improved testing capability.

Impact: None

#7 Added additional MEMS oscillator (25MHz)

Type: Layout change

Reason: Improved usabilty.

Impact: None

#8 Changed pull-up on PG_DDR from VIN to 3.3VIN

Type: Layout change

Reason: Error correction.

Impact: None

#9 Added pull-down to EN_DDR

Type: Layout change

Reason: Error correction.

Impact: None

Production Shipment Schedule

From May 2018, after old stock is gone.