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Overview

The Trenz Electronic TEI0003 is a low cost small-sized FPGA module integrating a Intel Cyclone 10LP 10CL025 FPGA SoC and 2 MByte serial memory for configuration and operation.

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Refer to http://trenz.org/cyc1000-info for the current online version of this manual and other available documentation.

Key Features

• Intel Cyclone 10LP 10CL025 FPGA SoC

• 8 MByte SDRAM

• 2 MByte serial configuration memory

• ST Microelectronics LIS3DH MEMS digital output motion sensor
  
• JTAG and UART over Micro USB2 connector
• 1x6 pin header for JTAG access to FPGA SoC
• 1x PMOD header providing 8 GPIOs

• 2x 14-pin headers (2,54 mm pitch) providing 23 GPIOs

• 1x 3-pin header providing 2 GPIOs

• 8x user LEDs

• 1x user push button
• 3.3V single power supply with on-board voltage regulators
• Size: 61.5 x 25 mm
  
  

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Main Components

1. Intel Cyclone 10LP 10CL025 FPGA SoC, U1
2. Winbond W9864G6JT 8 Mbyte SDRAM 166MHz, U2
3. Intel EPCQ16ASI8N 2 MByte serial configuration memory, U5
4. ST Microelectronics LIS3DH MEMS digital output motion sensor, U4
5. FTDI USB2 to JTAG/UART adapter, U3
6. Configuration EEPROM for FTDI chip, U9
7. 12.0000 MHz oscillator, U7
8. 8x red user LEDs, D2 ... D9
9. Red LED (Conf. DONE), D10
10. Green LED (indicating supply voltage), D1
11. Push button (user), S2
12. Push button (reset), S1
13. Micro USB2 B socket (receptacle), J9
14. 1x14 pin header (2.54mm pitch), J2
15. 1x6 pin header (2.54mm pitch), J4
16. 2x6 Pmod connector, J6
17. 3-pin header (2.54mm pitch), J3
18. 1x14 pin header (2.54mm pitch), J1

Initial Delivery State

Table 1: Initial delivery state of programmable devices on the module

Boot Process

By default the configuration mode pins of the FPGA are set to load the FPGA design from the serial configuration memory, hence the FPGA is configured from serial configuration memory at system start-up. The JTAG interface of the module is provided for storing the initial FPGA configuration data to the serial configuration memory.

Signals, Interfaces and Pins

I/Os on Pin Headers and Connectors

I/O signals of the FPGA SoC's I/O banks connected to the board's pin headers and connectors:

Table 2: General overview of single ended I/O signals connected to pin headers and connectors

FPGA I/O banks

Table 3: General overview of FPGA I/O banks

JTAG Interface

Primary JTAG access to the FPGA SoC device U1 is provided through Micro USB2 B connector J9. The JTAG interface is created by the FTDI FT2232H USB2 to JTAG/UART adapter IC U3. 

Optionally 1x6 male pin header J4 can be fitted on board for access to the JTAG interface on board. The pin assignment of header J4 is shown on table below:

Table 4: optional JTAG pin header

On-board Peripherals

Serial Configuration Memory

On-board serial configuration memory (U5) is provided by Intel EPCQ16ASI8N with 16 MBit (2 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration via JTAG interface. The memory is connected to FPGA bank 1 via active serial (AS) x1 interface.

SDRAM

The FPGA module is equipped with a Winbond W9864G6JT 64 MBit (8 MByte) SDRAM chip U2. This SDRAM chip is connected to the FPGA bank 7 and 8 via 16-bit memory interface with 166MHz clock frequency and CL3 CAS latency.

FTDI FT2232H IC

The FTDI chip U3 converts signals from USB2.0 to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity of the FT2232H chip.
FTDI FT2232H chip is used in MPPSE mode for JTAG, 2 I/O's of channel A and 6 I/O's of Channel B are routed to FPGA bank 3 of the FPGA SoC and are usable for example as GPIOs, UART or other standard interfaces.

The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U9.

Motion Sensor

On the TEI0003 FPGA board there is a digital output 3-axis motion sensor present. The motion is provided by ST Microelectronics 

System Clock Oscillator

The FPGA SoC module has following reference clocking signals provided by on-board oscillators:

Table 5: Clock sources overview

On-board LEDs

There are 10 LEDs fitted on the FPGA module board. The LEDs are user configurable to indicate for example any system status.

Table 6: LEDs of the module

Push Buttons

The FPGA module is equipped with two push buttons S1 and S2:

Table 7: Push buttons of the module

Connectors

All connectors are are for 100mil headers, all connector locations are in 100mil (2.54mm) grid. The module's PCB provides footprints to mount and solder optional pin headers, if those are not factory-fitted on module.

Power and Power-On Sequence

To power-up a module, power supply with minimum current capability of 1A is recommended.

Power Supply

The FPGA module can be power-supplied through Micro USB2 connector J9 with supply voltage 'USB-VBUS' or alternative through pin header J2 with supply voltage 'VIN'.

The TEM0001 module needs one single power supply of 5.0V nominal.

There are following dependencies how the initial voltage of the extern power supply is distributed to the on-board DCDC converters:

Figure 3: Power Distribution Diagram

Power Consumption

Table 9: Module power consumption

*TBD - To Be Determined.

Actual power consumption depends on the FPGA design and ambient temperature.

Power-On Sequence

There is no specific or special power-on sequence, just one single power source is needed.

Technical Specifications

Absolute Maximum Ratings

Table 10: Absolute maximum ratings

Recommended Operating Conditions

Table 11: Recommended operating conditions

Physical Dimensions

Please note that two different units are used on the figures below, SI system millimeters (mm) and imperial system thousandths of an inch(mil). This is because of the 100mil pin headers used, see also explanation below. To convert mils to millimeters and vice versa use formula 100mil's = 2,54mm.

• Board size: PCB 25mm × 61,5mm. Notice that some parts the are hanging slightly over the edge of the PCB like the the Micro USB2 B connector, which determine the total physical dimensions of the carrier board. Please download the assembly diagram for exact numbers.

• PCB thickness: ca. 1.65mm

• Highest part on the PCB without fitted headers and connectors is the Micro USB2 B connector, which has an approximately hight of 3 mm. Please download the step model for exact numbers.

Figure 4: Module physical dimensions drawing

Revision History

Hardware Revision History

Table 12: Module hardware revision history

Hardware revision number is printed on the PCB board together with the module model number separated by the dash.

Figure 5: Module hardware revision number

Document Change History

Date	Revision	Contributors	Description
		Ali Naseri	First TRM release

Table 13: Document change history

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