Template Revision 2.3

TRM Name always "TE Series Name" +TRM, for example "TE0720 TRM"


<!-- tables have all same width (web max 1200px and pdf full page(640px), flexible width or fix width on menu for single column can be used as before) -->
<style>
.wrapped{
  width: 100% !important;
  max-width: 1200px !important;
 }
</style>


Important General Note:

  • If some section is configurable and depends on Firmware, please refer to the addition page (for example CPLD). If not available, add note, that this part is configurable
  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

    • Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)
      • Figure template:


        Create DrawIO object here: Attention if you copy from other page, objects are only linked.


        image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed



      • Table template:

        • Layout macro can be use for landscape of large tables

      • ExampleComment
        12



    • The anchors of the Scroll Title should be named consistant across TRMs. A incomplete list of examples is given below

      • <type>_<main section>_<name>

        • type: Figure, Table
        • main section:
          • "OV" for Overview
          • "SIP" for Signal Interfaces and Pins,
          • "OBP" for On board Peripherals,
          • "PWR" for Power and Power-On Sequence,
          • "B2B" for Board to Board Connector,
          • "TS" for Technical Specification
          • "VCP" for Variants Currently in Production
          •  "RH" for Revision History
        • name: custom, some fix names, see below
      • Fix names:
        • "Figure_OV_BD" for Block Diagram

        • "Figure_OV_MC" for Main Components

        • "Table_OV_IDS" for Initial Delivery State

        • "Table_PWR_PC" for Power Consumption

        • "Figure_PWR_PD" for Power Distribution
        • "Figure_PWR_PS" for Power Sequence
        • "Figure_PWR_PM" for Power Monitoring
        • "Table_PWR_PR" for Power Rails
        • "Table_PWR_BV" for Bank Voltages
        • "Table_TS_AMR" for Absolute_Maximum_Ratings

        • "Table_TS_ROC" for Recommended_Operating_Conditions

        • "Figure_TS_PD" for Physical_Dimensions
        • "Table_VCP_SO" for TE_Shop_Overview
        • "Table_RH_HRH" for Hardware_Revision_History

        • "Figure_RH_HRN" for Hardware_Revision_Number
        • "Table_RH_DCH" for Document_Change_History
    • Use Anchor in the document: add link macro and add "#<anchorname>
    • Refer to Anchror from external : <page url>#<pagename without space characters>-<anchorname>



-----------------------------------------------------------------------


Note for Download Link of the Scroll ignore macro:


Download PDF version of this document.


Table of Contents

Overview

Notes :

Trenz Electronic TE0728 is an automotive-grade FPGA module integrating a Xilinx Automotive Zynq-7020 FPGA, two 100 Mbit Ethernet transceivers (PHY) , 512 MByte DDR3L SDRAM, 16 MByte Flash memory for configuration and operation, and powerful switching-mode power supplies for all on-board voltages. Numerous configurable I/Os are provided via rugged high-speed strips. 

Within the complete module only Automotive components are installed.

All this in a compact 6 x 6 cm form factor, at the most competitive price.

Refer to TE0728 Resources for the current online version of this manual and other available documentation.

Key Features

    • Note:

Other assembly options for cost or performance optimization plus high volume prices available on request.

Depending on the customer design, additional cooling might be required.

Block Diagram




Main Components

Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below






  1. 512 MByte DDR3 SDRAM, Cypress DDR3 Memory, U1
  2. Xilinx Automotive XA7Z020-1CLG484Q ,U2
  3. 100 MBit Ethernet transceiver  DP83848, U3
  4. 3.5V to 60V step-down converter, Texas Instruments TPS54260-Q1, U4
  5. Standard Clock Oscillators @ 25MHz 3.3V, SiTime SiT1618AA, U5
  6. 1.5 A Low Dropout Linear Regulator, Texas Instruments, TPS74801-Q1, U6
  7. Real Time Clock, Micro Crystal @32.768 MHz, 3.3V, RV-3029-C3, U7
  8. 3.5V to 60V step-down converter, Texas Instruments TPS54260-Q1, U8
  9. 3.5V to 60V step-down converter, Texas Instruments TPS54260-Q1, U9
  10. 100 MBit Ethernet transceiver  DP83848MPHPEP, U10
  11. 64 Kbit I2C EEPROM, 24LC64, U11
  12. Low-Quiescent-Current Proggrammable Delay Supervisory Circuit, Texas Instruments TPS3808G01-Q1, U12
  13. 16 MByte QSPI Nor Flash memory, Cypress S25FL127, U13
  14. Standard Clock Oscillators @ 50MHz 3.3V, SiTime SiT8918AA, U14
  15. Low-Quiescent-Current Priggrammable Delay Supervisory Circuit, Texas Instruments TPS3808G01-Q1, U15
  16. CAN Tranceiver, Texas Instruments SN65HVD230Q1, U16
  17. B2B connector  Samtec Micro Tiger Eye Connector  SEM-140-02-03, JM2
  18. B2B connector  Samtec Micro Tiger Eye Connector  SEM-140-02-03, JM3
  19. B2B connector  Samtec Micro Tiger Eye Connector  SEM-140-02-03, JM1
  20. User LED Green

Initial Delivery State

Storage device name

Symbol

Content

Quad SPI Flash

U13

Empty

24xx64U11Not Programmed


Control Signals

  • Overview of Boot Mode, Reset, Enables,


MIO pin

Signal StateBoot Mode

MIO4

Low

QSPI

MIO4HighSD Card


Zynq-7020SoC  includes a reset that is driven by the reset system. Hardware resets are driven by the power-on reset signal (PS_POR_B) and the system reset signal (PS_SRST_B).

Signal

FPGA BankPinB2B

PS_POR_B

500

B5

JM2-9
PS_SRST_B501C9JM2-2


Signals, Interfaces and Pins

Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:


FPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes
13JM148VCCO_13
500JM143.3V
33JM3343.3V
35JM3203.3V
35JM2223.3V
501JM238VMIO1MIO1 VREF is connected to resistor divider to support HSTL18


JTAG Interface

JTAG access to the Xilinx XA7Z020 FPGA through B2B connector JM2.

JTAG Signal

B2B Pin

TMSJM2-12
TDIJM2-10
TDOJM2-8
TCKJM2-6


MIO Pins

MIO PinSchematicNotes
MIO0MIO0RTC interrupt
MIO1SPI_CSSPI Flash
MIO2SPI_DQ0/M0SPI Flash
MIO3SPI_DQ1/M1SPI Flash
MIO4SPI_DQ2/M2SPI Flash
MIO5SPI_DQ3/M3SPI Flash
MIO6SPI_SCK/M4SPI Flash clock
MIO7LED REDLED
MIO8DCAN Transceiver
MIO9RCAN Transceiver
MIO10IO_0JM1-7
MIO11IO_1JM1-9
MIO12IO_2JM1-11
MIO13IO_3JM1-13
MIO14SCLEEPROM
MIO15SDAEEPROM
MIO16-MIO53PS_MIOxxBank 501


UART

There is no fixed mapping for PS7 UART, if needed it can be mapped to free pins from MIO1 Bank or via EMIO to PL pins.

Recommended mapping for primary (console, debug) UART are MIO52, MIO53.

On-board Peripherals

Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


Chip/InterfaceProductNotes
SPI FlashU1316 MByte Flash
EEPROMU1164 Kbit EEPROM
RTCU7Real Time Clock
DDR3 SDRAMU1Volatile Memory
EthernetU3, U10
CAN TransceiverU16
User LEDD4Green LED


Quad SPI Flash Memory

On-board QSPI flash memory is used to store initial FPGA configuration. Datasheet is provided in Texas Instruments. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.

Quad SPI Flash (U7) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500.


MIO PinSchematicPinNotes
MIO1SPI_CSU13-A1
MIO2SPI_DQ0/M0U13-A2
MIO3SPI_DQ1/M1U13-F6
MIO4SPI_DQ2/M2U13-E4
MIO5SPI_DQ3/M3U13-A3
MIO6SPI_SCK/M4U13-A4


RTC 

The RTC has an I2C Bus (2-wire SerialInterface) and offers temperature compensated time. The STC-Smart Temperature Compensation is calibrated in the factory and leads to a very high time-accuracy.

RTC intruppt is connected to MIO0 connected to Bank 500, pin G6.


MIO PinSchematicPinNotes
MIO15SDAU7-5On-board RTC, and EEPROM
MIO14SCLU7-4On-board RTC, and EEPROM


EEPROM

The Microchip Technology Inc. 24xx64 is a 64 Kbit Electrically Erasable PROM. The device is organized as a single block of 8K x 8-bit memory with a 2-wire serial interface. Lowvoltage design permits operation down to 1.7V, with standby and active currents of only 1 μA and 3 mA, respectively. It has been developed for advanced, lowpower applications such as personal communications or data acquisition. The 24xx64 also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 512 Kbits address space.


MIO PinSchematicPinNotes
MIO15SDAU11-3On-board RTC, and EEPROM
MIO14SCLU11-1On-board RTC, and EEPROM


LEDs

SchematicColorConnected toActive LevelIO Standard
D9GreenDONELownot applicable
D8REDMIO7Highnot applicable
D4GreenBank 33 - V18HighLVCMOS33


DDR3 SDRAM

The TE0728 SoM has two 512 MByte volatile DDR3 SDRAM IC for storing user application code and data.

 Configuration of the DDR3 memory controller in the FPGA should be done using the MIG tool in the Xilinx Vivado Design Suite IP catalog.

Ethernet

There are two 100 MBit Extreme Temperature Ethernet provided by Texas Instrument on the board. Datasheet is provided TI website. Both PHY's are connected with all I/O Pins to FPGA Bank 34 (VCCIO = 3.3V). PHY Clock 25 MHz source is provided from MEMS Oscillator. There is no sharing of signals for the two PHY's.

PUDC pin is connected with pull-up to 3.3V those pre-configuration pull-ups are disabled by default. Strapping resistor exist to change the PUDC mode.

Both PHY's must be operated in MII Mode, other modes are not supported. It is possible to use PS ENET0 or ENET1 via EMIO routing or Ethernet IP Cores implemented in PL Fabric.


SchematicETH1ETH2PullupNotes
CTREFJ3-57J3-25
Magnetics center tap voltage
TD+J3-58J3-28on-board
TD-J3-56J3-26on-board
RD+J3-52J3-22on-board
RD-J3-50J3-20on-board
LED1J3-55J3-23on-board
LED2J3-53J3-21on-board
LED3J3-51J3-19on-board
POWERDOWN/INTL21R20on-chipIt is recommended to configure FPGA I/O as input with Pullup or as output driving 1 if Interrupt not used.
RESET_NM15R16on-chipIt is recommended to configure FPGA I/O as input with Pullup or as output (active low PHY Reset).



It is recommended to add IOB TRUE constraint for the MII Interface pins.

When connecting the PHY's to Zynq PS ETH0, ETH1 EMIO GMII Interfaces it is recommended to use GMII to MII Wrap IP Core. This IP core maps the EMIO GMII to external MII Interface.

CAN Transceiver

Controller Area Network (CAN) transceivers are designed for use with the Texas Instruments TMS320Lx240x 3.3-V DSPs with CAN controllers. The datasheet is available in TI website. Each CAN transceiver is designed to provide differential transmit capability to the bus and differential receive capability to a CAN controller at speeds up to 1 Mbps. 


MIO PinSchematicPinNotes
MIO8DU16-1
MIO9RU16-4


Low Quiescent Current Programmable Delay Supervisory Circuit

The microprocessor supervisory circuits monitor system voltages from 0.4 V to 5 V, asserting an open-drain RESET signal when the SENSE voltage drops below a preset threshold or when the manual reset (MR) pin drops to a logic low. The RESET output remains low for the user adjustable delay time after the SENSE voltage and MR return above their thresholds. Datasheet is available in Texas Instruments website.


Low Dropout Linear Regulator

The low-dropout (LDO)  provides an easy-to-use robust power management  solution for a wide variety of applications. User programmable soft-start minimizes stress on the input power source by reducing capacitive inrush current on start-up. The soft-start is monotonic and well- suited for powering many different types of Monitoring or Provides a Sequencing Signal processors and ASICs. The enable input and power for Other Supplies good output allow easy sequencing with external regulators. This complete flexibility permits the user to configure a solution that meets the sequencing Voltage Startup requirements of FPGAs, DSPs, and other applications with special start-up requirements.

Clock Sources

ICDescriptionFrequencyUsed as
U14MEMS Oscillator50 MHzPS PLL clock
U5MEMS Oscillator25 MHzEthernet PHY Clock
U7RTC (internal oscillator)32.768 KHzUsed by RTC, CLKOUT of RTC not connected


Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 3.5 A for system startup is recommended.

Power Consumption

Power Input PinTypical Current
VINTBD*



* TBD - To Be Determined

Power on Sequence


The PS and PL power supplies are fully independent. PS power supplies (VCCPINT, VCCPAUX, VCCPLL, VCCO_DDR, VCCO_MIO0, and VCCO_MIO1) can be powered before or after any PL power supplies. The PS and PL power regions are isolated to prevent damage. The recommended power-on sequence is VCCPINT, then VCCPAUX and VCCPLL together, then the PS VCCO supplies (VCCO_MIO0, VCCO_MIO1, and VCCO_DDR) to achieve minimum current draw and ensure that the I/Os are 3-stated at power-on. The PS_POR_B input is required to be asserted to GND during the power-on sequence until VCCPINT, VCCPAUX and VCCO_MIO0 have reached minimum operating levels to ensure PS eFUSE integrity.





PWR_PS.png


Power Distribution Dependencies



TE0728_PWR_PD.png



The PS and PL power supplies are fully independent. PS power supplies (VCCPINT, VCCPAUX, VCCPLL, VCCO_DDR, VCCO_MIO0, and VCCO_MIO1) can be powered before or after any PL power supplies. The PS and PL power regions are isolated to prevent damage. The recommended power-on sequence is VCCPINT, then VCCPAUX and VCCPLL together, then the PS VCCO supplies (VCCO_MIO0, VCCO_MIO1, and VCCO_DDR) to achieve minimum current draw and ensure that the I/Os are 3-stated at power-on. The PS_POR_B input is required to be asserted to GND during the power-on sequence until VCCPINT, VCCPAUX and VCCO_MIO0 have reached minimum operating levels to ensure PS eFUSE integrity.

Voltage Monitor Circuit


Power Rails


B2B Name

B2B

JM1 Pin

B2B

JM2 Pin

B2B

JM3 Pin

DirectionNotes
VIN1,3--InputSupply voltage from carrier board.
VCCO_1339--I/O
VBATT-1-OutputRTC Supply voltage
3.3V192, 425,57OutputInternal 3.3V voltage level.

1.8V

-5-OutputInternal 1.8V voltage level.


Bank Voltages

Bank          

Schematic Name

Voltage

Notes
500VCCO_MIO0_5003.3V
501

VCCO_MIO1_500

3.3V
502VCCO_DDR_5021.5V
13 HRVCCO_13 3.3VSupplied by the carrier board. JM1
33 HRVCCO_333.3VSupplied by carrier board. JM3
34 HRVCCO_343.3V


35 HRVCCO_353.3V

Supplied by the carrier board. JM2,JM3


Board to Board Connectors

  • This section is optional and only for modules.
  • use "include page" macro and link to the general B2B connector page of the module series, for example: 4 x 5 SoM LSHM B2B Connectors

6 x 6 modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.

Technical Specifications

Absolute Maximum Ratings

Processing System(PS)


SymbolsDescriptionMinMaxUnit
VCCPINTPS internal logic supply voltage-0.51.1V
VCCPAUXPS auxiliary supply voltage-0.52.0V
VCCPLLPS PLL supply-0.52.0V
VCCO_DDRPS DDR I/O supply voltage-0.52.0V
VPREFPS input reference voltage-0.52.0V
VCCO_MIO0PS MIO I/O supply voltage for HR I/O banks-0.53.6V
VCCO_MIO1PS MIO I/O supply voltage for HR I/O banks1.713.45V



Programmable Logic(PL)


SymbolsDescriptionMinMaxUnit
VCCINTPL internal logic supply voltage-0.51.1V
VCCPAUXPL auxiliary supply voltage-0.52.0V
VCCPLLPL PLL supply-0.51.1V
VPREFPL input reference voltage-0.52.0V
VCCOPL supply voltage for HR I/O banks-0.53.6V
VINI/O input voltage for HR I/O banks1.713.45V



Recommended Operating Conditions



ParameterMinMaxUnitsReference Document
VIN supply voltage3.560VTPS54260-Q1 datasheets.
Supply voltage for PS MIO banks1.713.465VSee Xilinx DS187 datasheet.
I/O input voltage for PS MIO banks-0.2VCCO_MIO + 0.20VSee Xilinx DS187 datasheet.
Supply voltage for PS DDR1.141.89VSee Xilinx DS187 datasheet.
I/O input voltage for PS DDR-0.20VCCO_DDR + 0.20VSee Xilinx DS187 datasheet.
Supply voltage for HR I/Os banks1.143.465VSee Xilinx DS187 datasheet.
I/O input voltage for HR I/O banks-0.20VCCIO + 0.20VSee Xilinx DS187 datasheet.
Storage Temperature-65150°CSee Xilinx DS187 datasheet.
CAN Transceiver Temperature-40125°CSee Texas Instrument sn65hvd230q-q1 datasheet.
SPI Flash Memory-4085°CSee Cypress S25FL127S datasheet.
DDR3 SDRAM Temperature-4095°C

See Nanya NT5CC256M16CP-DIA datasheet.


Temprature range: -40°C to +125°C.

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Physical Dimensions




Variants Currently In Production


Trenz shop TE0728 overview page
English pageGerman page


Revision History

Hardware Revision History

DateRevisionNotePCNDocumentation Link
-01Prototypes--






Hardware revision number is printed on the PCB board next to the module model number separated by the dash.

Document Change History

  • Note this list must be only updated, if the document is online on public doc!
  • It's semi automatically, so do following
    • Add new row below first

    • Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

    • Metadata is only used of compatibility of older exports


DateRevisionContributorDescription


  • change list

--

all

  • --


Disclaimer