Template Revision 2.6
- Module: TRM Name always "TE Series Name" +TRM
Example: "TE0728 TRM" - Carrier: TRM Name usually "TEB Series Name" +TRM
Example: "TEB0728 TRM"
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Table of Contents |
Overview
The Trenz Electronic TEI0015 is an commercial-grade, low cost and small size module integrated with Intel® MAX 10. Intel MAX 10 devices are the ideal solution for system management, I/O expansion, communication control planes, industrial, automotive, and consumer applications.
Refer to http://trenz.org/tei0015-info for the current online version of this manual and other available documentation.
Key Features
Block Diagram
Main Components
Notes : - Picture of the PCB (top and bottom side) with labels of important components
- Add List below
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- SMA Connector, J5...6
- Instrumentation Amplifier, U12- U14
- Series Voltage Reference, U8
- Analog to Digital Convertor, U15- U6
- Voltage Regulator, U10- U13- U16
- Buck Switching Regulator, U11- U4
- Intel® MAX 10, U1
- SDRAM Memory, U2
- SPI Flash Memory, U5
- USP to UART convertor, U3
- User LEDs, D2...9
- 4Kb EEPROM, U9
- Switch, S1...2
- USB port, J9
- Pin Holder (Not assembled), J1...4
Initial Delivery State
Notes : Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture. If there is no components which might have initial data ( possible on carrier) you must keep the table empty |
Storage device name | Content | Notes |
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Quad SPI Flash | Not Programmed |
| I2C Configuration EEPROM | Programmed |
| SDRAM | Not Programmed |
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Configuration Signals
- Overview of Boot Mode, Reset, Enables.
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The FPGA configuration for Intel MAX 10 FPGAs can be stored through JTAG interface either in external configuration device (QSPI flash memory U5) or on the FPGA itself since the Intel MAX 10 FPGA offers non-volatile memory on chip. The FPGA configuration is loaded from the non-volatile memory when the board is powered up.
To configure the FPGA directly, the JTAG interface can be used to configure the FPGA volatile, means the configuration is lost after power off.
Reset process must be done by pressing push button S1.
Signal | Push Button | Pin Header | Note |
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RESET | S1 | J2 | connected to nCONFIG |
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Signals, Interfaces and Pins
Notes : - For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
- For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
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I/Os on Pin Headers and Connectors
FPGA Bank | Connector Designator | I/O Signal Count | Voltage Level | Notes |
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Bank 1A | J1 | 7 | 3.3V | AIN0...6 | Bank 1B | J4 | 5 | 3.3V | JTAG interface | Bank 2 | J1 | 4 | 3.3V | DIO2...5 | Bank 5 | J2 | 9 | 3.3V | DIO6...14 | J1 | 2 | 3.3V | DIO0...1 | Bank 8 | J2 | 1 | 3.3V | RESET |
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JTAG Interface
JTAG access to the TEI0015 SoM through pin header connector J4.
JTAG Signal | Pin Header Connector |
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TMS | J4-6 | TDI | J4-5 | TDO | J4-4 | TCK | J4-3 | JTAG_EN | J4-2 |
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FPGA I/O Banks
you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic. Example: MIO Pin | Connected to | B2B | Notes |
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MIO12...14 | SPI_CS , SPI_DQ0... SPI_DQ3 SPI_SCK | J2 | QSPI |
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FPGA Bank | I/O Signal Count | Connected to | Notes |
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Bank 1A | 7 | 1x14 Pin header, J1 | AIN0...6 | 1 | Jumper, J3 | AIN7 | Bank 1B | 5 | 1x6 Pin header, J4 | JTAG_EN, TDI, TDO, TMS, TCK | Bank 2 | 4 | 1x14 Pin header, J1 | D2...5 |
| 5 | A2D, U15 | ADC_EN, ADC_SDI, ADC_SDO, ADC_SCK, ADC_CNV |
| 1 | 12MHz Oscillator, U7 | CLK12M |
| 2 | Amplifier, U12 | nIAMP_A0, nIAMP_A1 | Bank 3 | 22 | SDRAM, U2 | RAM_ADDR_CMD | Bank 5 | 9 | 1x14 Pin header, J2 | DIO6...14 | 2 | 1x14 Pin header, J1 | DIO0...1 | 1 | D12_R | DIO12 | Bank 6 | 16 | SDRAM, U2 | DQ0...15 | 2 | SDRAM, U2 | DQM0...1 | 1 | D11_R | DIO11 | Bank 8 | 8 | User Red LEDs, D2...9 | LED0...7 |
| 6 | SPI Flash, U5 | F_CS, F_CK, F_DI, F_DO, nSTATUS, DEVCLRn |
| 1 | Red LED, D10 | CONF_DONE |
| 6 | FTDI JTAG/UART Adapter, U3 | BDBUS0...5 |
| 1 | Push Button, S2 | USER_BTN |
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On-board Peripherals
Notes : - add subsection for every component which is important for design, for example:
- Two 100 Mbit Ethernet Transciever PHY
- USB PHY
- Programmable Clock Generator
- Oscillators
- eMMCs
- RTC
- FTDI
- ...
- DIP-Switches
- Buttons
- LEDs
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Notes : In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection |
Chip/Interface | Designator | Notes |
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Quad SPI Flash Memory
Notes : Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options. |
MIO Pin | Schematic | U?? Pin | Notes |
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RTC
MIO Pin | Schematic | U? Pin | Notes |
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MIO Pin | I2C Address | Designator | Notes |
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EEPROM
MIO Pin | Schematic | U?? Pin | Notes |
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MIO Pin | I2C Address | Designator | Notes |
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LEDs
Schematic | Color | Connected to | Active Level | Note |
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DDR3 SDRAM
Notes : Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3) |
The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.
- Part number:
- Supply voltage:
- Speed:
- NOR Flash
- Temperature:
Ethernet
Bank | Signal Name | ETH1 | ETH2 | Signal Description |
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CAN Transceiver
Bank | Schematic | U?? Pin | Notes |
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| D-Tx |
| Driver Input |
| R-Rx |
| Reciever Output |
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Clock Sources
Designator | Description | Frequency | Note |
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| MHz |
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| MHz |
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| KHz |
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Power and Power-On Sequence
In 'Power and Power-on Sequence' section there are three important digrams which must be drawn: - Power on-sequence
- Power distribution
- Voltage monitoring circuit
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Power Supply
Power supply with minimum current capability of xx A for system startup is recommended.
Power Consumption
Power Input Pin | Typical Current |
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VIN | TBD* |
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* TBD - To Be Determined
Power Distribution Dependencies
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Power-On Sequence
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Voltage Monitor Circuit
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Power Rails
Power Rail Name | B2B Connector JM1 Pin | B2B Connector JM2 Pin | B2B Connector JM3 Pin | Direction | Notes |
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Bank Voltages
Board to Board Connectors
- This section is optional and only for modules.
use "include page" macro and link to the general B2B connector page of the module series, For example: 6 x 6 SoM LSHM B2B Connectors
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? x ? modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.
3 x REF-??????? (compatible to ????????), (?? pins, ?? per row)
Operating Temperature: -??°C ~ ??°C
Current Rating: ??A per ContactNumber of Positions: ??
Number of Rows: ??
Technical Specifications
Absolute Maximum Ratings
Symbols | Description | Min | Max | Unit |
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Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Parameter | Min | Max | Units | Reference Document |
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| V | See ???? datasheets. |
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| V | See Xilinx ???? datasheet. |
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| V | See Xilinx ???? datasheet. |
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| V | See Xilinx ???? datasheet. |
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| V | See Xilinx ???? datasheet. |
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| V | See Xilinx ???? datasheet. |
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| V | See Xilinx ???? datasheet. |
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| °C | See Xilinx ???? datasheet. |
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| °C | See Xilinx ???? datasheet. |
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Physical Dimensions
PCB thickness: ?? mm.
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Currently Offered Variants
Revision History
Hardware Revision History
List of online PCN ...Link
Document Change History
- Note this list must be only updated, if the document is online on public doc!
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Date | Revision | Contributor | Description |
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Disclaimer