Notes :

  • only parts of the extract macro will be shown on the internal pages



TE0841-02-xxxxxxxx

1 2

3456

78 9101112131415





16



17







18







Module type

TEBB Mezzanine Module
Module name
0841













Module Revision
01

Revision 1 (initial)

Device name
123456789


US
115253540-60-8595


ABDFGHKLMNPRSTUVUS+
3P5P7P9P10P11P13P15P20P25P27P29P31P33P35P37P

Speed grade

123455











1231L2L2L











Temp range
CEIQ



CommercialExtendedIndustrialAutomotive



DDR memory
-Not present at all
---
0Not populated
-
--
1



2TE0841: 2 GByteIndustrial

8Gbit - K4A8G165WB-BIRC (NRND)

#28375

3TE0841: 2 GByteIndustrial

8Gbit - K4A8G165WC-BITDTCV

#30211

XDDR SODIMM Socket
Flash memory
0Not populated
---
1TE0841: 64MByteIndustrial512Mbit - MT25QU512ABB8E12-0SIT#29292
eMMC 
-TE0841: Not present---
0Not populated-
-
F



Other options (Connectors, custom options)
Module

Variation

Description
AllAStandard height
LLow profile
...Custom assembly variant, look additional table below
Additional options
Blankno extra options
SStarter Kit
KWith Heat spreader

 

Other assembly variations (position 17)

ModuleVariationDescription
TE0841AStandard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903

L

Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125
CB2B connectors: standard profile , FPGA: without encryption module
DB2B connectors: low profile, FPGA: without encryption module
TStandard profile B2B connectors LSHM-150-04.0-H-DV-A-S-K-TR #30488/LSHM-130-04.0-H-DV-A-S-K-TR #30489 (30µ Gold on contact)