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Table of Contents |
Overview
The Trenz Electronic TEBA0714 is a carrier for Trenz Electronic module TE0714 which is an industrial grade module integrated with Xilinx Artix 7.
Refer to http://trenz.org/teba0714-info for the current online version of this manual and other available documentation.
Key Features
Note: 'description: Important components and connector or other Features of the module → please sort and indicate assembly options Key Features' must be split into 6 main groups: - FPGA/Module
- Package:
- Speed:
- Temperature:
- RAM/Storage
- On Board
- Interface
- E.g. ETH, USB, B2B, Display port
- Power
- E.g. Input supply voltage
- Dimension
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- Module:
- Trenz TE0714 Module
- Temperature: -40 to +85 °C
- On Board:
- 2 x User LEDs (Red, Green)
- 1 x DONE LED (Red)
- Interface:
- 2 x Pin-Header 50 (FPGA Bank I/Os and Power)
- 2x Samtec 100 Pin LSHM Series Connectors
- 2 x Pin-Header for FPGA Bank Power
- 1 x XMOD (TE0790) Pin-Header
- 1 x Pin-Header 16 Pol. (JTAG, MGT-CLK, Boot Mode, XADC, I/O's)
- 1 x Pin-Header 10 Pol. (Ein-/ und Ausgänge)
- 1 x SFP+ Connectors
- Power:
- Dimension: 30 mm x 40 mm
Block Diagram
Main Components
Notes : - Picture of the PCB (top and bottom side) with labels of important components
- Add List below
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- SMT pin header, J26
- SMT pin header, J27
- Board to Board (B2B) Connector, JM1
- Board to Board (B2B) Connectorr, JM2
- XMOD header, JX1
- Voltage Regulator, U1
- User Red LED, D2
- User Green LED, D1 (Red)
- SFP+ Connector, J1
- User Red LED, D3
- 50-pin header solder pad, J20
- 16-pin header solder pad, J3,
- 10-pin header solder pad, J4
- 50-pin header solder pad, J17
Initial Delivery State
Notes : Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture. If there is no components which might have initial data ( possible on carrier) you must keep the table empty |
- VCCIO voltage selection jumpers are all set to 1.8 V.
- Pin headers (not soldered to the board, but included in the package as separate component)
Storage device name | Content | Notes |
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--- | --- | --- |
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Configuration Signals
- Overview of Boot Mode, Reset, Enables.
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Signal | MODE Signal State | Boot Mode | Note |
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BOOTMODE | high or open | Master SPI, x4 Mode |
| low or ground
| Slave Selects MAP |
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Signal | B2B | Signal State | Note |
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PROG_B | JM1-94 | Active Low | Clear FPGA configuration (falling edge) and initiate a new configuration sequenz (next rising edge). |
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Signals, Interfaces and Pins
Notes : - For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
- For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
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Board to Board (B2B) I/Os
FPGA bank number and number of I/O signals connected to the B2B connector:
B2B Connector | Interface | Number of I/O | Notes |
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JM1
| User I/O | 52 Single ended, 27 Differential | - | MGT lanes | 4 Differential, 2 lanes |
| MGT reference clock input | 2 Single ended, 1 Differential |
| JTAG | 4 Single ended |
| SoM control signals | 2 Single ended | 'PROG_B', 'DONE' | JM2 | User I/O | 36 Single ended or 18 differential | - | SFP+ Interface control signals | 8 Single ended |
| QSPI interface | 6 Single ended |
| UART interface | 2 Single ended |
| User LEDs | 2 Single ended | Red, Green | SoM control signals | 1 Single ended | 'BOOTMODE' |
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JTAG Interface BAse
JTAG access to the mounted SoM is provided through B2B connector JM1 and JM2 and is also routed to the XMOD JTAG/UART header JX1.
XMOD Header Pin | B2B Connector | Connected to | Note |
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A | JM2-97 | B14_L25 | UART Transfer | B | JM2-99 | B14_L0 | UART Receive | E | JM2-100 | BOOTMODE |
| G | JM1-94 | PROG_B |
| C | JM1-90 | TCK |
| D | JM1-86 | TDI |
| F | JM1-88 | TDO |
| H | JM1-92 | TMS |
| 3.3V | JM1-97,99 | 3.3V |
| VIO | JM2-53 | V_CFG |
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SFP+ Connector
Pin | Connected to | Notes |
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VCCR | 3.3V |
| VCCT | 3.3V |
| VREF | GND |
| TD+/TD- | MGT TX | MGT Lane | RD+/RD- | MGT RX | MGT Lane | TX/FAULT | SFP0_TX_FAUL | SFP_CTRL | TX/DISABLE | SFP0_TX_DIS | SFP_CTRL | MOD-DEF2 | SFP0_SDA | SFP_CTRL | MOD-DEF1 | SFP0_SCL | SFP_CTRL | MOD-DEF0 | SFP0_MT_DEF0 | SFP_CTRL | RS0/RS1 | SFP0_RS0_1 | SFP_CTRL | LOS | SFP0_LOS | SFP_CTRL |
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SMT Pin Header
There are two SMT Pin Headers, J25-J26.
SMT Pin Header | Pin | Connected to | Notes |
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J26
| 1,3,5 | VCCIO34 |
| 2 | 1.8V |
| 4 | 2.5V |
| 6 | 3.3V_OUT |
| J27
| 1,3,5 | V_CFG |
| 2 | 1.8V |
| 4 | V_CFG0 |
| 6 | 3.3V_OUT |
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On-board Peripherals
Notes : - add subsection for every component which is important for design, for example:
- Two 100 Mbit Ethernet Transciever PHY
- USB PHY
- Programmable Clock Generator
- Oscillators
- eMMCs
- RTC
- FTDI
- ...
- DIP-Switches
- Buttons
- LEDs
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Notes : In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection |
Chip/Interface | Designator | Notes |
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LEDs | D1...3 |
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LEDs
Designator | Color | Connected to | Active Level | Note |
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D1 | Green | GLED | Active Low |
| D2 | Red | RLED | Active High |
| D3 | Red | DONE | Active High |
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Power and Power-On Sequence
In 'Power and Power-on Sequence' section there are three important digrams which must be drawn: - Power on-sequence
- Power distribution
- Voltage monitoring circuit
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Power Supply
Power supply with minimum current capability of 3A for system startup is recommended.
The on-board voltages of the carrier board will be powered up with an external power-supply with nominal voltage of 3.3V.
Power Consumption
Power Input Pin | Typical Current |
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VIN | 3.3V |
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* TBD - To Be Determined
Power Distribution Dependencies
Power-On Sequence
Power Rails
Power Rail Name | B2B Connector JM1 Pin | B2B Connector JM2 Pin | Direction | Notes |
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3.3V | 99,97 | - | Input |
| 1.8V | - | 18 | Input |
| 3.3V_OUT | 83 | 54 | Output |
| VCCIO34 | 61 | - | Input |
| V_CFG0 | 53 | - | Input |
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Board to Board Connectors
- This section is optional and only for modules.
use "include page" macro and link to the general B2B connector page of the module series, For example: 6 x 6 SoM LSHM B2B Connectors
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TEBA0714 carrier use two Samtec Razor Beam LSHM Connectors on the bottom side.
Technical Specifications
Absolute Maximum Ratings
Symbols | Description | Min | Max | Unit |
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VIN | Input Supply Voltage | -0.3 | 6 | V | T_STR | Storage Temperature | -40 | 85 | °C |
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Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Parameter | Min | Max | Units | Reference Document |
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VIN | 3.135 | 3.465 | V | 3.3V Nominal Power Supply | T_OPR | -40 | 85 | °C |
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Physical Dimensions
PCB thickness: 1.64 mm.
Currently Offered Variants
Revision History
Hardware Revision History
Date | Revision | Changes | Documentation Link |
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2016-06-15 | 01 | Initial Release | REV01 |
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Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Document Change History
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Add new row below first Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template - Metadata is only used of compatibility of older exports
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Date | Revision | Contributor | Description |
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Disclaimer