Notes :

  • only parts of the extract macro will be shown on the internal pages



TE0741-03-xxxxxx-x
1 2

3456

78 9101112131415





16



1718

Module type

Additional options. Not available in TE0725LP
TEBB Mezzanine Module
no extra options
Module nameSStarter Kit

0710

071107120713071407250725LP**
KHeat spreader
Module RevisionOther options (Connectors, custom options)
01

Revision 1 (initial)

AStandard height
Device nameLLow profile
12345678Artix...Custom variation, look additional info
A12A15A25A35A50A75A100A200

ABDFGHK
KintexeMMC (). Field not present in TE0725LP
K70K160K325K355K410K420K480
-Not present at all ()

Speed grade

0Not populated
12345









F


1231L2L









G


FPGA Temperature range (Tstg abs =  -65..150°C)H


CEIQK


Commercial (Tj = 0..85°C)Extended (Tj = 0..100°C)Industrial (Tj = -40..100°C)Automotive (Tj = -40..125°C)Flash memory ()
DDR memory ()0Not populatedTE #
-Not present at all
1256MbitS25FL256SAGBHI20#25945
0Not populated--
2128MbitIS25LP128F-JBLE#29438
1



3


XSODIMMSocket

4


  •  TE0725LP is exception. Positions after LP shifted right on two positions. Therefore positions 16 (eMMC) and 18 (Reserve) excluded


Other assembly variations (position 17)

Module
Description
TE0714

AStandard profile LSHM-150-04.0-L-DV-A-S-K-TR
LLow profile LSHM-150-02.5-L-DV-A-S-K-TR
DStandard profile, U7 (SPI-FLASH) IS25LP128F-JBLE,  U2 (MGT CLOCK) DSC1123CI2-156.2500, R21-R22 not fitted, R27 fitted (VCCIO supply from carrier board)
TE0725LP


T1.8V variant, connectors soldered (old variant D)

U

1.8V variant, connectors not mounted (old variant L)
H3.3V variant, HyperFlash S26KS512SDPBHI020 #28925

Other assembly variations (position 18)

Module
Description
TE0741FStandard profile, FPGA - FFG676 package