Products Affected

This change affects all Trenz Electronic TE0808 SoMs of revsion 04: TE0808-04-*.

Revision 04 is still continued. See Production Shipment Schedule below for further details.

Changes

#1 Revised PL_VCCINT power supply.

Type: PCB change

Reason: Improve design for higher core utilization.

Impact: Up to 30 A PL core current possible.

#2 Added signal BG1, revised routing and placement of DDR4

Type: Schematic change

Reason: Add support of new packages of DDP DDR4 ICs.

Impact: DDP DDR4 now supported.

#3 R5 value changed to 49.9 Ohm and connected to VCCO

Type: Schematic change

Reason: Xilinx recommondation UG583.

Impact: R5 pulled up to VCCO_PSDDR.

#4 Added test points

Type: Schematic change

Reason: Improve factory testability.

Impact: Automatic testing possible.

#5 Added MAC EEPROM U4 and I²C pullups

Type: Schematic change

Reason: Improve interchangeability with TE0803 series.

Impact: User EEPROM accesible via PLL I²C bus.

#6 Revised FPGA location

Type: PCB change

Reason: Improve Layout and support for small BGA cooler with BGA frame clips.

Impact: Package placed 1.5 mm closer to connector J3.

Note: Due to the changes above the height profile of the module is changed. Using TE0808-05 board as a replacement or in system designed for TE0808-04, review and adaption of mechanics e.g. cooling solutions have to be done.

Method of Identification

The revision number is printed in the top side of the PCB.

Production Shipment Schedule

The new revison 05 is available from Juli 2020. Revision 04 is still continued. For new designs revison 05 should be used. It is recommended to switch to the new revision when possible. 

This PCN follows JEDEC Standard J-STD-046.