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7.5 x 10 cm modules use four Samtec AcceleRate HD High-Density on the bottom side.

  • 4 x ADM6-60-01.5-L-4-2 (compatible to ADF6-60-01.5-L-4-2), (240 pins, "60" per row)
Features
  • Board-to-Board Connector 240-pins, 60 contacts per row
  • .025" (0.635 mm) pitch
  • Data Rate: max 56 Gbps 
  • Mates with: ADM6/APF6
  • Insulator Material: LCP, Black
  • Contact Material:  Copper Alloy
  • Plating: Au or Sn over 50 µ" (1.27 µm) N
  • Operating Temperature Range: -55 ºC to +125 ºC
  • • PCIe 5.0 capable: Yes
  • Lead-Free Solderable: Yes
  • RoHS Compliant: Yes
Connector Mating height

When using the same type on baseboard, the mating height is 5mm. Other mating heights are possible by using connectors with a different height

Order numberConnector on baseboardcompatible toMating height
?????REF-?????ADM6-60-01.5-L-4-25 mm
ADF6-60-01.5-L-4-25 mm
Connectors.

The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The  AcceleRate HD High-Density  connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
5 mm 10/ 25/ 56 Gbps
Speed rating.
Current Rating

Current rating of  Samtec AcceleRate HD High-Density B2B connectors is 1.34 A per pin (4 pins powered)

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total


Manufacturer Documentation



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