Key Features

• SoC/FPGA (UltraScale+ Zynq)
  
  • Package: FFVC1760
  • Device: ZU11, ZU17, ZU19*
  • Engine: EG
  • Speed: -1, -2,-3*, **
  • Temperature: I, E, (Q, M)*, **
• RAM/Storage
  • DDR4  (PS connected)
    • Data width: 72bit with ECC
    • Size: def. 4GB (up to 8GB possible)*
    • Speed:***
  • DDR4  SODIMM  (PL connected)
    • 72-Bit DDR4 with ECC
    • Size: max 16GB*
    • Speed: NA*
  • eMMC
    • Data width: 8Bit
    • size: def. 8GB  (up tp 64 possible)*
  • QSPI boot Flash in dual parallel mode (size depends on assembly version)
    • Data width: 8bit
    • size: def. 128MB (up to 512MB possible)*
  • QDDRII (optional, default not assembled)
    • size:18Mbit*
  • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
• On Board
  
  • SC CPLD and SoC
    
    • MAX10: 10M08
    • 7 Series Zynq: XC7Z010 with 128MB QSPI and 512MB DDR3 (16Bit)
  • PLL SI5345
  • Gigabit ETH PHY (Marvell Alaska 88E1512)
  • USB2 HUB
  • USB2 PHY
• Interface (2 x 400pin COM-HPC connectors)
  
  • PCIe SMB 1x (ZynqMP PS GTR)
  • PCIe up to  48 lane ( 16x GTY(32.75 Gb/s)  and 32x GTH (16.3 Gb/s) )**** 
  • Gbit Ethernet 1x
  • USB2 4x
  • USB3 1x (ZynqMP PS GTR)
  • DDI (DP) 1x (ZynqMP PS GTR)
  • SATA 1x (ZynqMP PS GTR)
  • SPI 1x
  • I2C SMB 1x
  • I2C 3x
  • UART 2x (1x ZynqMP, 1x SC Zynq)
  • GPIO 12x (JTAG over GPIO)
  •  PL HP IOs  x32 (15 diff)  over COM-HPC CSI Interface
• Power
  
  • 12V Main
  • 5V Standby
  • 2.0-3.3V RTC
• Dimension
  • COM-HPC  Client module Size B (120x120mm)
• Notes
  • * depends on assembly version
  • ** not all combinations are possible
  • *** depends on used U+ Zynq and DDR4 combination
  • **** uses is limited by  U+ Zynq specification