5.2 x 7.6 cm UltraSoM+ modules use four Samtec AcceleRate HD High-Density Slim Body Arrays on bottom side.
- 4x ADM6-60-01.5-L-4-2 (240 pins, 60 per row)
- Mates with ADF6-60-01.5-L-4-2
5.2 x 7.6 cm UltraSoM+ carrier use four Samtec AcceleRate HD High-Density Slim Body Arrays on top side.
- 4x ADF6-60-03.5-L-4-2 (160-pins)
- Mates with ADM6-60-01.5-L-4-2
Features
- Board-to-Board Connector 240-pins, 60 contacts per row
- 0.025" (0.635 mm) pitch
- Data Rate: max 56 Gbps
- Mates with: ADM6/APF6
- Insulator Material: LCP, Black
- Contact Material: Copper Alloy
- Plating: Au or Sn over 50 µ" (1.27 µm) N
- Operating Temperature Range: -55 ºC to +125 ºC
- PCIe 5.0 capable: Yes
- Lead-Free Solderable: Yes
- RoHS Compliant: Yes
Connector Stacking height
When using the standard type on baseboard and module, the mating height is 5 mm.
Other mating heights are possible by using connectors with a different height:
| Order number | REF number | Samtec Number | Type | Contribution to stacking height | Comment |
|---|---|---|---|---|---|
| 30095 | REF-30095 | ADM6-60-01.5-L-4-2 | Module connector | 1.5 mm | Standard connector used on modules |
| 31137 | REF-31137 | ADF6-60-03.5-L-4-2 | Baseboard connector | 3.5 mm | Standard connector used on carrier |
Connectors.
Connector Speed Ratings
The AcceleRate HD High-Density connector speed rating depends on the stacking height; please see the following table:
| Stacking height | Speed rating |
|---|---|
| 5 mm | 10/ 25/ 56 Gbps |
Speed rating.
Speed rating.
Current Rating
Current rating of Samtec AcceleRate HD High-Density B2B connectors is 1.34 A per pin (4 pins powered)
Connector Mechanical Ratings
- Shock: 100G, 6 ms Sine
- Vibration: 7.5G random, 2 hours per axis, 3 axes total
Manufacturer Documentation
Overview
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