TE0725LP TRM

Overview

The Trenz Electronic TE0725LP is a low cost small-sized FPGA module integrating a Xilinx Artix-7 and 32 MByte Flash memory for configuration and operation.

Key Features

• Xilinx Artix-7 XC7A100T FPGA

• 32 MByte QSPI Flash memory

• 2 x 50-pin headers with 2,54mm pitch, ideal for breadboard use

• 92 x GPIOs (42 + 42 + 8)
• 25.000000 MHz system clock
• I²C EEPROM for FPGA bitstream
  

• 3.3V single power supply with on-board voltage regulators

• JTAG/UART connector 

• 1 user LED

• Optional HyperRAM (8 to 32 MByte)
• Commercial temperature grade (Industrial on Request)
• Size 73 x 35 mm

Block Diagram

Figure 1: TE0725LP-01 Block Diagram.

Main Components

Figure 2: TE0725LP-01 FPGA module (Variant TE0725LP-01-100-2D depicted).

1. XMOD header, JB1
2. 14-pin header placeholder for connector, J3
3. Xilinx Artix-7 FPGA, U1
4. 1.8V, 256 MBit (32 MByte) quad SPI serial flash memory, U7
5. Red LED (SYSLED), D2
6. Cypress S26KS512S 512 Mbit (64 MByte) 1.8V HyperFlash™ memory, U4 (optional)
7. Low-power programmable oscillator @25.000000 MHz, U3
8. Low VIN high-efficiency step-down converter (1.5A max.), U5
9. Low VIN high-efficiency step-down converter (1.5A max.), U6 (optional)
10. 50-pin header placeholder for breadboard connector, J1
11. 50-pin header placeholder for breadboard connector, J2
12. Ultra-low supply-current voltage monitor with optional watchdog, U8
13. 128K I²C CMOS serial EEPROM, U2

Initial Delivery State

Table 1: Module initial delivery state of programmable on-board devices.

Boot Process

By default the configuration mode pins of the FPGA are set to QSPI mode, hence the FPGA is configured from serial NOR flash at system start-up. The JTAG interface of the module is provided for storing the initial FPGA configuration data to the QSPI flash memory.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

I/O signals connected to the SoCs I/O bank and B2B connector:

Table x: General overview of PL I/O signals connected to the B2B connectors.

PL I/O-Banks

Table x: General overview of PL I/O-bank signals.

JTAG Interface

JTAG access to the Xilinx Artix-7 device is provided through XMOD header JB1.

Header JB1 (2 x 6 pin) is compatible with XMOD-JTAG adapter TE0790. This adapter can be inserted from top onto the TE0725LP, if JB1 is fitted with male pin header. Optionally JB1 can be fitted with pin header from bottom, in that case the JTAG connector must be on the base board.

XMOD FTDI JTAG-Adapter Header JB1

The JTAG interface of the FPGA can be accessed via XMOD header JB1, so in use with the XMOD-FT2232H adapter-board TE0790 the FPGA can be configured via USB2.0 interface. The TE0790 board provides also an UART interface to the FPGA device which can be accessed by the USB2.0 interface of the adapter-board while the signals between these serial interfaces will be converted.

Following table describes the signals and interfaces of the XMOD header JB1:

Table 6: XMOD header JX1 signals and connections.

When using XMOD FTDI JTAG Adapter TE0790, the adapter-board's VCCIO will be sourced by the FPGA module's supply voltage (1.8V or 3.3V). The adapter board's VCC has to be sourced by the USB Host interface.

For this configuration, set the XMOD DIP-switch as follows in table below:

Table 7: XMOD adapter board DIP-switch positions for voltage configuration.

When using XMOD-JTAG please check its DIP-switch S2 settings to be sure that correct power and I/O reference voltages are set. TE0790 can be in some cases used to power up TE0725LP, however this is not recommended. TE0790-01 can not supply enough power for TE0725LP (LED may blink but the module is not operating properly, especially in case of larger and more sophisticated FPGA designs).

UART Interface

UART interface is available on B2B connector JM2. With the TE0790 XMOD USB2.0 adapter, the UART signals can be converted to USB2.0 interface signals:

Table 10: UART interface signals.

QSPI Interface

The QSPI interface of the FPGA device is routed to and used by the on-module QSPI flash IC U7:

Table 11: QSPI interface signals.

I2C Interface

The I²C interface of the FPGA device is routed to and used by the on-module EEPROM IC U2:

Table 10: I²C interface signals.

On-board Peripherals

Quad SPI Flash Memory

On-module QSPI flash memory (U7) is provided by Micron Serial NOR Flash Memory N25Q256A with 256 Mbit (32 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.

HyperFlash RAM

Configaration EEPROM

Oscillators

On-board LEDs

There is one red LED connected to the FPGA bank 14, pin M16. This LED is user configurable to indicate for example any system status.

Table x: LEDs of the module.

Connectors

All connectors are are for 100mil headers, all connector locations are in 100mil (2.54mm) grid. The module's PCB provides footprints to mount and solder optional (B2B connector) headers, if those are not factory-fitted on module.

Power and Power-On Sequence

To power-up a module, power supply with minimum current capability of 1A is recommended.

Power Supply

TE0725LP needs one single power supply with nominal of 3.3V.

Power Consumption

Table x: General overview of PL I/O signals connected to the B2B connectors.

*TBD - To Be Determined.

Actual power consumption depends on the FPGA design and ambient temperature.

Power-On Sequence

There is no specific or special power-on sequence, single power source is needed as VIN, rest of the sequence is automatic.

Variants Currently In Production

Table x: General overview of PL I/O signals connected to the B2B connectors.

Technical Specifications

Absolute Maximum Ratings

Table x: General overview of PL I/O signals connected to the B2B connectors.

Recommended Operating Conditions

Table x: General overview of PL I/O signals connected to the B2B connectors.

Physical Dimensions

Please note that two different units are used on the figures below, SI system millimeters (mm) and imperial system thousandths of an inch(mil). This is because of the 100mil pin headers used, see also explanation below. To convert mils to millimeters and vice versa use formula 100mil's = 2,54mm.

All 100 mil pin headers are in 100 mil grid, the M3 mounting holes are in 50 mil grid aligned to the centers of the 100mil headers. The module is symmetrical, turning it 180 degrees will keep all I/O and Power pins in both 50 pin headers in compatible places.

Operating Temperature Ranges

Commercial grade modules

All parts conform to at least commercial temperature range of 0°C to +70°C.

Industrial grade modules

All parts are at least industrial temperature range of -40°C to +85°C.

The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Weight

8.5 g Plain module.

Revision History

Hardware Revision History

Table x: General overview of PL I/O signals connected to the B2B connectors.

Hardware revision number is printed on the PCB board together with the module model number separated by the dash.

Document Change History 

Date	Revision	Contributors	Description
Error rendering macro 'page-info' Ambiguous method overloading for method jdk.proxy244.$Proxy3557#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject]		Jan Kumann	Initial version.

Table x: General overview of PL I/O signals connected to the B2B connectors.

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