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Overview

The Trenz Electronic AMB0010 is a commercial grade baseboard for Andromeda modules.

Refer to http://trenz.org/amb0010-info for the current online version of this manual and other available documentation.

Key Features

  • Module
    • Andromeda modules (like AM0010, ...)
  • On Board
    • 2 x B2B connector (ADF6)
    • Clock Buffer
    • Oscillator
  • Interface
    • RJ45 LAN Socket
    • XMOD
    • UART Header
    • I2C Header
    • 4 x User DIP Switch
    • 4 x User LED
    • Micro SD Card Socket with ESD protection
    • USB Connector
    • Loopbacks for GTHs, IOs, GPIOs
  • Power
    • 12 V Input Supply Voltage
  • Dimension
    • 128 mm x 106 mm

Block Diagram

AMB0010 block diagram

Main Components

AMB0010 main components
  1. B2B Connector (ADF6), JB5, JB6
  2. Power Jack, J1
  3. Push Button, S1, S3, S4
  4. DIP Switch, S2, S5
  5. LED, D3...9
  6. Pin Header, J8, J19
  7. ESD Protection, U13
  8. Micro SD Socket, J13
  9. XMOD Connector, JB1
  10. RJ45 LAN Socket, J11
  11. USB Socket, J12

Initial Delivery State

Storage device name

Content

Notes

-

-

-

Initial delivery state of programmable devices on the module

Signals, Interfaces and Pins

Connectors

Connector TypeDesignatorInterfaceIO CNTNotes
B2BJB5HP104 SE / 48 DIFFLoopbacked.
B2BJB5MGT PL4 x MGT (RX/TX)Loopbacked.
B2BJB5MGT PL2 x MGT CLK
B2BJB5HD24 SE / 12 DIFFLoopbacked.
B2BJB6HP52 SE / 24 DIFFLoopbacked.
B2BJB6MGT PS4 x MGT (RX/TX)Not connected.
B2BJB6MGT PS2 x MGT CLK
B2BJB6HD24 SE / 12 DIFFLoopbacked.
B2BJB6MIO2 x I2C
B2BJB6MIO2 x UART
B2BJB6MIO2 x PERSTLoopbacked.
B2BJB6MIOSDIO
B2BJB6MIOJTAG
B2BJB6MIO4 x GPIOLoopbacked.
B2BJB6ETH

B2BJB6USB

RJ45J11ETH

XMODJB1JTAGJTAG
XMODJB1UARTUART
Pin HeaderJ8UARTUART
Pin HeaderJ19I2CI2C
Power JackJ1PWRPWR
SD Card SocketJ13SDIOSDIO
USB SocketJ12USBUSB
Board Connectors


Test Points

Test PointSignalNotes1)
TP1+12.0V_input
TP2+12.0V_input
TP3V_MOD1OUT
TP4V_MOD1OUT
TP5Carrier_+3V3OUT
TP6Carrier_+3V3OUT
TP7Carrier_+1V8OUT
TP8Carrier_+1V8OUT
TP9Module_+3.3VConnected to JB6, U4 - IN
TP10Module_+3.3VConnected to JB6, U4 - IN
TP11Module_+1.8VConnected to JB5, JB6 - IN
TP12Module_+1.8VConnected to JB5, JB6 - IN
TP13PWR_ENJB6, S4 - PWR_EN is pulled-up in module AM0010 to 3.3 V.
TP14PWR_ENJB6, S4 - PWR_EN is pulled-up in module AM0010 to 3.3 V.
TP15Carrier_USB+5V
TP16Carrier_USB+5V
TP17PG_Carrier_+1V8Connected to U2, U3, U4, U5, U6, U7, U12
TP18PG_Carrier_+1V8Connected to U2, U3, U4, U5, U6, U7, U12
TP19Carrier_PGConnected to U3, U6, T7 (LED D5)
TP20Carrier_PGConnected to U3, U6, T7 (LED D5)
TP21PG_Carrier_USB+5VConnected to U7, U12
TP22PG_Carrier_USB+5VConnected to U7, U12
TP23PWR_GOODConnected to JB6, U4 - IN (M2C), pulled-up in module AM0010 to 3.3 V.
TP24PWR_GOODConnected to JB6, U4 - IN (M2C), pulled-up in module AM0010 to 3.3 V.
TP25USB-VBUS
TP26USB-VBUS
TP27IO_X0_D12_PConnected to JB6
TP28IO_X0_D12_PConnected to JB6
TP29M_SDAConnected to JB6
TP30M_SDAConnected to JB6
TP31M_SCLConnected to JB6
TP32M_SCLConnected to JB6
TP33RST_M2C#Connected to JB6
TP34RST_M2C#Connected to JB6
TP35U_INTConnected to JB6
TP36U_INTConnected to JB6
TP37PS_POR#Connected to JB6, S3 - PS_POR# is pulled up in module AM0010 to Carrier_+3V3 (V_IO_CFG).
TP38PS_POR#Connected to JB6, S3 - PS_POR# is pulled up in module AM0010 to Carrier_+3V3 (V_IO_CFG).
TP39PS_SRST#Connected to JB6, S1 - PS_SRST# is pulled up in module AM0010 to Carrier_+3V3 (V_IO_CFG).
TP40PS_SRST#Connected to JB6, S1 - PS_SRST# is pulled up in module AM0010 to Carrier_+3V3 (V_IO_CFG).
TP41DX_PConnected to JB6
TP42DX_PConnected to JB6
TP43DX_NConnected to JB6
TP44DX_NConnected to JB6
TP45M_INTConnected to JB6
TP46M_INTConnected to JB6

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.
Test Points Information

On-board Peripherals

Chip/InterfaceDesignatorConnected ToNotes

Oscillator

U10U11100 MHz

Clock Buffer

U11JB5

RJ45 LAN Socket

J11JB6

XMOD

JB1JB6

Pin Header

J8JB6
Pin HeaderJ19JB6

Power Jack

J1

Micro SD Card Socket

J13JB6 via U13

USB Socket

J12JB6 via L7
On board peripherals

Configuration and System Control Signals

Connector.Pin

Signal Name

Direction1)Description
JB6.A59V_BATOUTInput voltage for VCC_PSBATT 2) 3).
JB6.B58RST_M2C#INModule reset for peripheral reset
JB6.C53DONEINSignal PS_DONE.
JB6.C54 / JB6.C55 / JB6.C56 / JB6.C57MODE0...3OUTBoot mode selection. Consider possible module boot modes.
JB6.C58PS_SRST#OUTFPGA system reset 2) 3).
JB6.C59PS_POR#OUTPower-on-reset status 2) 3).
JB6.D56 / JB6.D57DX_P / DX_NOUTTemperature sensing diode pin
JB6.D58PWR_ENOUT

Power Enable 2) 3). Controlled module internally. Can be used to delay power on sequencing or disable power. Tie only to GND or leave floating.

JB6.D59PWR_GOODINPower good status
J6.D51 / J6.D52 / J6.D54 / J6.D55TDI/TCK/TDO/TMSSignal-dependent

JTAG configuration and debugging interface 2) 3).
JTAG reference voltage: 3.3 V

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.

2) See UG1085 for additional information.

3) Consider modules input voltage range.

Controller signal.

Power and Power-On Sequence


Power Rails

Power Rail Name/ Schematic NameConnector + PinDirection1)Notes
V_MOD1

JB5.A7 / JB5.A15 / JB5.A47 / JB5.A55 / JB5.B5 / JB5.B11 / JB5.B17 / JB5.B45 / JB5.B51 / JB5.B57 / JB6.C5 / JB6.C11 / JB6.C17 / JB6.D7 / JB6.D15

OUT
Module_+1.8VJ5.C7 / J5.C15 / J6.B7 / J6.B15IN
Carrier_+1V8JB5.D3 / JB5.D17 / JB5.D43 /
JB5.D57 / JB6.A3 / JB6.A17 / JB6.A59
OUT
Carrier_+3V3JB5.D40 / JB6.B35 / JB6.C52 / JB1.5 / JB1.6 / J8.1 / J19.1OUT
Module_+3.3VJB6.B59IN
+12.0V_inputJ1.1IN

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.
Module power rails.

Recommended Power up Sequencing (preliminary)

SequenceNet nameRecommended Voltage RangePull-up/downDescriptionNotes
0---Configuration signal setup.See Configuration and System Control Signals.
1 1)V_BAT3.3 V-Battery connection.Battery Power Domain usage. When not used, tie to GND.
2V_MOD112 V-Main Power supply.

Main module power supply. 3 A recommended. Power consumption depends mainly on design and cooling solution.

3 1)PWR_EN-

PU 2), 3.3 V

Power release.

Controlled module internally. Can be used to delay power on sequencing or disable power. Tie only to GND or leave floating.

4PWR_GOOD-

PU 2), 3.3 V

Power good status.Module power on sequencing finished. Periphery and variable bank voltages can be enabled on carrier.
5 1)3.3V / 1.8V--

Module generated output voltages.

Voltages are available after PWR_GOOD deassertion.

These voltages can be used

  • to supply bank voltages,
  • to supply periphery and/or
  • as power good signal to enable external power regulators.

Important: Consider maximum power consumption.

5

V_IO_W01 / V_IO_W45 / V_IO_X01 / V_IO_W3 /  V_IO_X3 / V_IO_CFG

3)-Module bank voltages.Enable bank voltages after PWR_GOOD deassertion.
6 1)---Reset handling.

RST_M2C# delivers external periphery reset. See Configuration and System Control Signals.

1) (optional)

2) (on module)

3) See DS925 for additional information.

Baseboard Design Hints

Board to Board Connectors

The Andromeda modules use Samtec AcceleRate HD High-Density on bottom side.
  • ADM6-60-01.5-L-4-2 (compatible to ADF6-60-03.5-L-4-2), (240 pins, "60" per row)

The Andromeda carriers use Samtec AcceleRate HD High-Density on top side.

  • ADF6-60-03.5-L-4-2 (compatible to ADF6-60-01.5-L-4-2), (240 pins, "60" per row)
Features
  • Board-to-Board Connector 240-pins, 60 contacts per row
  • 0.025" (0.635 mm) pitch
  • Data Rate: max 56 Gbps 
  • Mates with: ADM6/APF6
  • Insulator Material: LCP, Black
  • Contact Material:  Copper Alloy
  • Plating: Au or Sn over 50 µ" (1.27 µm) N
  • Operating Temperature Range: -55 ºC to +125 ºC
  • PCIe 5.0 capable: Yes
  • Lead-Free Solderable: Yes
  • RoHS Compliant: Yes
Connector Mating height

When using the same type on baseboard, the mating height is 5mm. Other mating heights are possible by using connectors with a different height

Order numberConnector on baseboardcompatible toMating height
30095REF-30095ADM6-60-01.5-L-4-25 mm
31137REF-31137ADF6-60-03.5-L-4-25 mm
Connectors.

The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The  AcceleRate HD High-Density  connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
5 mm 10/ 25/ 56 Gbps
Speed rating.
Current Rating

Current rating of  Samtec AcceleRate HD High-Density B2B connectors is 1.34 A per pin (4 pins powered)

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total


Manufacturer Documentation

  File Modified
PDF File 20200225_hsc_adm6-xx-01p5-xxx-4-a_adf6-xx-03p5-xxx-4-a.pdf 04 03, 2022 by ED
PDF File adf6.pdf 04 03, 2022 by ED
PDF File adm6.pdf 04 03, 2022 by ED
PDF File adm6-xxx-xx.x-xxx-4-x-x-xr-mkt.pdf 04 03, 2022 by ED
PDF File adm6-xxx-xx.x-xxx-x-x-x-footprint.pdf 04 03, 2022 by ED



Technical Specifications

Absolute Maximum Ratings

Power Rail Name/ Schematic NameDescriptionMinMaxUnit
+12.0V_inputPower Supply11.013.0V
Module_+3.3VInput from Module3.3153.465V
Module_+1.8VInput from Module1.711.89V
Absolute maximum ratings

Recommended Operating Conditions

This TRM is generic for all variants. Temperature range can be differ depending on the assembly version.  Voltage range is mostly the same during variants (exceptions are possible, depending on custom request)

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

  • Variants of modules are described here: Article Number Information
  • Modules with commercial temperature grade are equipped with components that cover at least the range of 0°C to 75°C
  • Modules with extended temperature grade are equipped with components that cover at least the range of 0°C to 85°C
  • Modules with industrial temperature grade are equipped with components that cover at least the range of -40°C to 85°C
  • The actual operating temperature range will depend on the FPGA / SoC design / usage and cooling and other variables.


Power Rail Name/ Schematic NameMinTypicalMaxUnitsReference Document
+12.0V_input11.012.013.0VSee LTC4365ITS8 datasheets.
Module_+3.3V3.3153.33.465V
Module_+1.8V1.711.81.89V
Recommended operating conditions.

Physical Dimensions

  • Module size: 128 mm × 106 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 5 mm.

PCB thickness: 1.6 mm.

Physical Dimension

Currently Offered Variants 

Trenz shop AMB0010 overview page
English pageGerman page
Trenz Electronic Shop Overview

Revision History

Hardware Revision History

Board hardware revision number.


DateRevisionChangesDocumentation Link
-REV01Initial Revision
Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Document Change History

DateRevisionContributorDescription

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  • Initial Document

--

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Document change history.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.


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