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View all SoM | Module Series | Form Factor | Key Features |
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| TEM0005 | 3.1 x 5.6 | MicroSemi SmartFusion2 with ...
| | TE0722 - DIPFORTy | 1.8 x 5.1 cm | | | TEI0001 - MAX1000 | 2.5 x 6.1 cm | | | TEI0003 - CYC1000 | 2.5 x 6.1 cm | | | TEL0001 - LXO2000 | 2.5 x 6.1 cm | | | TEM0001 - SFM2000 | 2.5 x 6.1 cm | MicroSemi SmartFusion2 with ... | | TEI0010 - AnalogMax | 2.5 x 6.1 cm | | | TEC0117 - LittleBee | 2.5 x 6.1 cm | | | TEI0015 - AnalogMAX DAQ1 | 2.5 x 8.65 cm | | | TEI0016 - AnalogMAX DAQ2 | 2.5 x 8.65 cm | | | TEI0023 - AnalogMAX DAQ3 | 2.5 x 8.65 cm | | | TE0890 - S7 Mini | 2.7 x 5.2 cm | Xilinx Spartan 7 with ... | | TE0876 - IceZero | 3.05 x 6.5cm | | | TE0727 - ZynqBerryZero | 3.05 x 6.5cm | | | TE0725 | 3.5 x 7.3 cm | | | TE0725LP | 3.5 x 7.3 cm | | | TEM0008 | 3.8 x 5.6 cm | Microsemi Polarfire with ... | | TE0714 | 4 x 3 cm | | | TE0600 | 4 x 5 cm | Xilinx Spartan 6 with ... | | TE0710 | 4 x 5 cm | | | TE0711 | 4 x 5 cm | | | TE0712 | 4 x 5 cm | | | TE0713 | 4 x 5 cm | | | TE0715 | 4 x 5 cm | | | TE0720 - GigaZee | 4 x 5 cm | | | TE0741 | 4 x 5 cm | | | TE0820 | 4 x 5 cm | | | TE0821 | 4 x 5 cm | | | TE0823 | 4 x 5 cm | | | TE0841 | 4 x 5 cm | | | TEM0007 | 4 x 5 cm | MIcroSemi PolarFire with ... | | TE0724 | 4 x 6 cm | | | TE0729 | 5.2 x 7.6 cm | | | TE0745 | 5.2 x 7.6 cm | | | TE0803 - UltraSoM+ | 5.2 x 7.6 cm | | | TE0807 - UltraSoM+ | 5.2 x 7.6 cm | | | TE0808 - UltraSoM+ | 5.2 x 7.6 cm | | | TE0716 | 5.5 x 6.5 cm | | | TE0728 | 6 x 6 cm | | | TEI0006 | 6 x 8 cm | Intel Cyclone 10 with ... | | TE0835 | 6.5 x 9 cm | Xilinx UltraScale+ Zynq RFSoC with ... | | TE0782 | 8.5 x 8.5 cm | | | TE0783 | 8.5 x 8.5 cm | | | TE0784 | 8.5 x 8.5 cm | | | TE0723 - ArduZynq | like Arduino Board | | | TE0726 - ZynqBerry | like RPI2 Board | | | TEM0002 - SmartBerry | like RPI2 Board | MicroSemi SmartFusion2 with ...
| | TE0887 - icoBoard | 5.7 x 6.5 cm | | | TEI0180 | COM-HPC Server Size D 16 x 16 cm | | | TE0830 | COM-HPC Client Size B 12 x 12 cm | Xilinx ZynqMP with ... - SoC/FPGA (UltraScale+ Zynq)
- Package: FFVC1760
- Device: ZU11, ZU17, ZU19*
- Engine: EG
- Speed: -1, -2,-3*, **
- Temperature: I, E, (Q, M)*, **
- RAM/Storage
- DDR4 (PS connected)
- Data width: 72bit with ECC
- Size: def. 4GB (up to 8GB possible)*
- Speed:***
- DDR4 SODIMM (PL connected)
- 72-Bit DDR4 with ECC
- Size: max 16GB*
- Speed: NA*
- eMMC
- Data width: 8Bit
- size: def. 8GB (up tp 64 possible)*
- QSPI boot Flash in dual parallel mode (size depends on assembly version)
- Data width: 8bit
- size: def. 128MB (up to 512MB possible)*
- QDDRII (optional, default not assembled)
- MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
- On Board
- SC CPLD ans SoC
- MAX10: 10M08
- 7 Series Zynq: XC7Z010 with 128MB QSPI and 512MB DDR3 (16Bit)
- PLL SI5345
- Gigabit ETH PHY (Marvell Alaska 88E1512)
- USB2 HUB
- USB2 PHY
- Interface (2 x 400pin COM-HPC connectors)
- PCIe SMB 1x (ZynqMP PS GTR)
- PCIe up to 48 lane ( 16x GTY(32.75 Gb/s) and 32x GTH (16.3 Gb/s) )****
- Gbit Ethernet 1x
- USB2 4x
- USB3 1x (ZynqMP PS GTR)
- DDI (DP) 1x (ZynqMP PS GTR)
- SATA 1x (ZynqMP PS GTR)
- SPI 1x
- I2C SMB 1x
- I2C 3x
- UART 2x (1x ZynqMP, 1x SC Zynq)
- GPIO 12x (JTAG over GPIO)
- PL HP IOs x32 (15 diff) over COM-HPC CSI Interface
- Power
- 12V Main
- 5V Standby
- 2.0-3.3V RTC
- Dimension
- COM-HPC Client module Size B (120x120mm)
- Notes
- * depends on assembly version
- ** not all combinations are possible
- *** depends on used U+ Zynq and DDR4 combination
- **** uses is limited by U+ Zynq specification
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| TEC0850 | Xilinx UltraScale+ Zynq with ... |
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