Table of Contents
Overview
The Trenz Electronic TE0723 is a Arduino compatible Zynq board with numerous on-board peripherals based on the Xilinx Zynq XC7Z010 SoC.
Key Features
- Xilinx Zynq XC7Z010 SoC
- Dual ARM Cortex A9
- 512 MByte DDR3L SDRAM
- 16 MByte quad SPI Flash memory
- Hi-speed USB2.0 ULPI transceiver
- 23 FPGA I/O's available on board-to-board connectors
- Micro SD Card socket with card detect signal
- Micro USB OTG
- On-board USB JTAG and UART
- RGB LED (connected to PL I/O)
- "Done" LED (inverted polarity)
- CERN Open Hardware Licence 1.2
Additional assembly options are available for cost or performance optimization upon request.
Block Diagram
Figure 1: TE0723 block diagram
Main Components
Figure 2: Main components of the TE0723 module
- Xilinx Zynq XC7Z010 SoC, U1
- 4 Gbit DDR3L 256M x 16 SDRAM, U2
- 16 MByte quad SPI Flash memory, U5
High-speed CMOS logic analog multiplexer/demultiplexer, U10
- 1 MHz low-power operational amplifier, U11
- Dual high-speed USB to multipurpose UART/FIFO, U3
- 0.5A dual-channel current-limited power switch, U21
- Low-power programmable oscillator @ 12.000000 MHz, U7
- 2-Kbit Microwire compatible serial EEPROM, U6
- 10-pin header, J1
- 8-pin header, J2
- 10-pin header, J3
- Analog input header, J4
- 2 x 4-pin header, J5
- PMod 2x6 interface header, J6
- USB host mode jumper, J7
- Micro USB 2.0 Type-B receptacle, J8
- Micro USB 2.0 Type-B receptacle, J9
- Micro SD card connector with detect signal, J10
- Analog input select jumper, J11
- 5V supply power input, J12
- Reset switch, S1
- Red LED, D2
- Green LED, D6
- Green LED, D7
- Ultra-low supply-current voltage monitor, U23
1A PowerSoC DC-DC converter (3.3 V), U20
- 1A PowerSoC DC-DC converter (1.8 V, U19
- 1A PowerSoC DC-DC converter (1.35 V), U16
- Hi-speed USB 2.0 ULPI transceiver, U18
- Low-power programmable oscillator @ 52.000000 MHz, U14
- 1A PowerSoC DC-DC converter (1.0 V), U17
- JTAG interface testpoints, TP1-TP4
Initial Delivery State
Storage device name | IC | Content | Notes |
|---|---|---|---|
Quad SPI Flash | U5 | Empty | - |
| Configuration EEPROM | U6 | Pre-Programmed | Xilinx License |
Table 1: Initial delivery state of programmable devices on the module
Boot Process
The 7 boot mode strapping pins (MIO2 ... MIO8) of the Xiliny Zynq Z-7010 device are hardware programmed on the board. They are evaluated by the Zynq device soon after the 'POR_B'.signal is deasserted to begin the boot process (see section "Boot Mode Pin Settings" of Xilinx manual UG585).
The TE0723 Zynq board is hardware programmed to boot initially from the on-board QSPI Flash memory U5. The JTAG interface of the module is provided for storing the data to the QSPI Flash memory through the Zynq device.
Signals, Interfaces and Pins
I/O Signals on Connectors
Overview of the Zynq SoC PS/PL banks I/O signals connected to the external connectors:
| Bank | Type | Connector | I/O Signal Count | Voltage | Notes |
|---|---|---|---|---|---|
| 34 | HR | J1 | 8 | 3.3V | Signal Schematic names: 'SCL', 'SDA', 'D8' ... 'D13'. |
| 34 | HR | J2 | 8 | 3.3V | Signal Schematic names: 'RXD', 'TXD', 'D2' ... 'D7'. |
| 34 | HR | J6 | 8 | 3.3V | Signal Schematic names: 'PIO01' ... 'PIO08'. |
| 34 | HR | J11 | 1 | 3.3V | Signal Schematic name: 'AIN_FPGA'. |
| 35 | HR | J4 | 6 | 3.3V | Signal Schematic names: 'AIN0' ... 'AIN5', usable as differential analog inputs or regular digital I/O's. |
| 35 | HR | J5 | 1 | 3.3V | Connector dedicated to ESP8266 module. |
| 500 | MIO | J10 | 7 | 3.3V | SDIO interface to SD Card socket. |
| 501 | MIO | J5 | 4 | 3.3V | Connector dedicated to ESP8266 module. |
Table 2: Overview of the Zynq SoC's PS/PL banks I/O signals
Zynq SoC I/O Banks
| Bank | Type | VCCIO | I/O Signal Count | Available on Connectors | Notes |
|---|---|---|---|---|---|
| 34 | HR | 3.3V | 44 | 25 | 8 user I/O's on Pmod connector J6, female pin header J1 and J2 each. 1 I/O on pin header J11. |
| 35 | HR | 3.3V | 8 | 7 | 6 user I/O's on female pin header J4, 1 user I/O on female pin header J5. |
| 500 | PS MIO | 3.3V | 15 | - | 6 MIO pins used for QSPI flash memory interface, 7 MIO pins used for SD Card interface, 1 MIO pin connected to red LED D2, 1 MIO pin as reset pin routed to USB PHY U18, 'POR_B'-signal is connected to voltage monitor circuit 23. |
| 501 | PS MIO | 3.3V | 16 | 4 | 12 MIO pins used for USB ULPI interface, 4 MIO pins used for ESP8266 interface header J5. |
| 0 | Config | 3.3V | 4 | - | 4 I/O's are dedicated to JTAG interface. |
Table 3: General overview of Zynq SoC PL/PS I/O bank
USB2 to JTAG/UART Adapter
The TE0723 board is equipped with the FTDI FT2232H USB2 to JTAG/UART adapter controller connected to micro-USB2 connector J9 to provide JTAG and UART access to the Xilinx Zynq XC7Z010 SoC. There is also a 256-byte configuration EEPROM U6 wired to the FT2232H chip via Microwire bus which holds pre-programmed license code to support Xilinx programming tools.
Do not access the FT2232H EEPROM using FTDI programming tools, doing so will erase normally invisible user EEPROM content and invalidate stored Xilinx JTAG license. Without this license the on-board JTAG will not be accessible any more with any Xilinx tools. Software tools from FTDI website do not warn or ask for confirmation before erasing user EEPROM content.
Channel A of the FTDI IC is configured as JTAG interface (MPSSE) connected to the JTAG interface of the Zynq SoC on configuration bank 0:
| Zynq SoC U1 | Signal Schematic Name | FT2232H IC U3 Pin |
|---|---|---|
| Pin G9 | TCK | 12 |
| Pin L7 | TDI | 13 |
| Pin L8 | TDO | 14 |
| Pin L9 | TMS | 15 |
Table 4: JTAG interface signals
14 additional bus lines of Channel B of the FTDI IC are routed to Zynq SoC PL bank 34 and are available to the user. The FTDI chip which converts signals from USB2 to a variety of standard serial and parallel interfaces like UART and user GPIO's in FIFO mode. Refer to the FTDI data sheet to get information about the capacity of the FT2232H IC.
| Zynq SoC U1 | Signal Schematic Name | FT2232H IC U3 Pin |
|---|---|---|
| Bank 34, pin H13 | BDBUS0 | 32 |
| Bank 34, pin H14 | BDBUS1 | 33 |
| Bank 34, pin J15 | BDBUS2 | 34 |
| Bank 34, pin J14 | BDBUS3 | 35 |
| Bank 34, pin K15 | BDBUS4 | 37 |
| Bank 34, pin L15 | BDBUS5 | 38 |
| Bank 34, pin L14 | BDBUS6 | 39 |
| Bank 34, pin M15 | BDBUS7 | 40 |
| Bank 34, pin M14 | BCBUS0 | 42 |
| Bank 34, pin N14 | BCBUS1 | 46 |
| Bank 34, pin P15 | BCBUS2 | 47 |
| Bank 34, pin N13 | BCBUS3 | 48 |
| Bank 34, pin R15 | BCBUS4 | 49 |
| Bank 34, pin P14 | BCBUS7 | 53 |
Table 5: FTDI FT2232H bus line signals
Quad SPI Interface
Quad SPI Flash memory (U5) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500, pins MIO1 ... MIO6.
| Zynq SoC U1 Pin | Signal Schematic Name | Flash memory U5 Pin |
|---|---|---|
| Bank 500, pin MIO1 | SPI0_CS | 1 |
| Bank 500, pin MIO2 | SPI0_DQ0/MIO2 | 5 |
| Bank 500, pin MIO3 | SPI0_DQ1/MIO3 | 2 |
| Bank 500, pin MIO4 | SPI0_DQ2/MIO4 | 3 |
| Bank 500, pin MIO5 | SPI0_DQ3/MIO5 | 7 |
| Bank 500, pin MIO6 | SPI0_SCK | 6 |
Table 6: Quad SPI interface signals
SD Card Interface
TE0723 module has on-board 3.3V SD Card socket (J10) with card detect switch wired to the SoC PS MIO bank 500.
| Zynq SoC U1 Pin | Signal Schematic Name | Connected to |
|---|---|---|
| Bank 500, pin MIO0 | Card detect switch | J10-9 |
| Bank 500, pin MIO10 | DAT0 | J10-7 |
| Bank 500, pin MIO11 | CMD | J10-3 |
| Bank 500, pin MIO12 | CLK | J10-5 |
| Bank 500, pin MIO13 | DAT1 | J10-8 |
| Bank 500, pin MIO14 | DAT3 | J10-1 |
| Bank 500, pin MIO15 | CD/DAT3 | J10-2 |
Table 7: SD Card socket signals
USB2 Interface
High-speed USB2 interface is provided by USB3320 from Microchip (U18). The USB2 PHY is connected via ULPI interface to the Zynq SoC PS USB0, bank 501 and pins MIO28 ... MIO39.
The USB2 interface is accessible through the micro-USB2 B connector J8 and enables device, host or OTG modes. For host mode, the on-board USB2 interface provides the USB-VBUS supply voltage with nominal 4.75V to 5.25V on micro-USB2 connector pin J8-1. To configure host mode on this interface, the board has to be supplied with 5V through pin header J12 or with the USB-VBUS supply voltage of micro-USB2 connector J9, which is connected to the FTDI FT2232H chip.
The USB-VBUS supply voltage enabling the host mode on USB2 interface J8 is switched by the on-board power distribution switch AP2152SG-13 from Diodes Incorporated. The voltage is switched on with the signal 'VBUS_V_EN' which is controlled by the USB2 PHY U18. If the output load exceeds the current-limit threshold, the AP2152SG-13 limits the output current and pulls the over-current low-active logic output signal 'USB_OC' low, which is routed to the Zynq PL bank 35, pin F15.
An extra 100µF decoupling capacitor (in addition to 4.7µF) can be activated on-board to stabilize the USB-VBUS host supply voltage furthermore. This can be done by fitting and closing jumper J7, fitting 0-Ohm-resistor R53 or MOSFET transistor Q1. The transistor Q1 allows to enable and disable this 100µF extra capacitor by the signal 'HOST_MODE_EN' routed to the Zynq PL bank 34, pin L13.
Following table shows the signal assignment of the USB PHY U18 with the Zynq PS MIO bank 501:
| Zynq SoC U1 Pin | Signal Schematic Name | USB2 PHY U18 Pin |
|---|---|---|
| Bank 501, pin MIO28 | OTG-DATA4 | 7 |
| Bank 501, pin MIO29 | OTG-DIR | 31 |
| Bank 501, pin MIO30 | OTG-STP | 29 |
| Bank 501, pin MIO31 | OTG-NXT | 2 |
| Bank 501, pin MIO32 | OTG-DATA0 | 3 |
| Bank 501, pin MIO33 | OTG-DATA1 | 4 |
| Bank 501, pin MIO34 | OTG-DATA2 | 5 |
| Bank 501, pin MIO35 | OTG-DATA3 | 6 |
| Bank 501, pin MIO36 | OTG-CLK | 1 |
| Bank 501, pin MIO37 | OTG-DATA5 | 9 |
| Bank 501, pin MIO38 | OTG-DATA6 | 10 |
| Bank 501, pin MIO39 | OTG-DATA7 | 13 |
Table 8: USB interface signals
ESP8266 Wi-Fi Interface
Interface for the ESP8266 Wi-Fi module is provided through connector J5.
| Zynq SoC U1 Pin | Signal Schematic Name | Connected to |
|---|---|---|
| Bank 501, pin MIO48 | ESP_TXD | J5-2 |
| Bank 501, pin MIO49 | ESP_RXD | J5-7 |
| Bank 501, pin MIO52 | MOD_RST | J5-6 |
| Bank 501, pin MIO53 | ESP_GPIO0 | J5-3 |
| Bank 35, pin G15 | ESP_GPIO2 | J5-5 |
Table 9: ESP8266 Wi-Fi module interface
I²C Interface
I2C interface pins SCL and SDA from the Zynq SoC PL bank 34 are connected to the connector J1. There are no on-board I²C slave devices. The two I²C bus lines 'SDA' and 'SCL' can be optionally pulled up to 3.3V on-board by fitting the 0-Ohm-resistors R35 ('SDA') and R42 ('SCL').
| Zynq SoC U1 Pin | Signal Schematic Name | Connected to |
|---|---|---|
| R13 | SDA | J1-9 |
| P13 | SCL | J1-10 |
Table 10: Zynq SoC I2C interface
Analog Input Interface
The TE0723 board provides up to 7 muxed analog input pins to the XADC unit of the Zynq device. 6 pins are exposed to female pin header J4, 1 to male pin header J11. The pins are muxed by the TI High Speed CMOS 8-Channel Analog Multiplexer CD74HC4051 (U10). There is between the analog output of the multiplexer IC and the differential analog input of the Zynq device an operational amplifier (U11) configured in voltage-follower circuit transforming the single analog output signal of the multiplexer IC to the differential analog signal, which is connected to the differential XADC input pins of the Zynq device, pin G7, H7.
The analog input channels can be selected by the pins 'AMUX_SO', 'AMUX_S1' and 'AMUX_S2', which are connected to the Zynq PL bank 34, pin G12, H12, G11:
| Analog Input Channel | [AMUX_S2:AMUX_S1:AMUX_S0] | Connector pin | Note |
|---|---|---|---|
| AIN0 | 000 | J4-1 | - |
| AIN1 | 001 | J4-2 | - |
| AIN2 | 010 | J4-3 | - |
| AIN3 | 011 | J4-4 | - |
| AIN4 | 100 | J4-5 | - |
| AIN5 | 101 | J4-6 | - |
| AIN6 | 110 | J11-1 | - |
| VIN_SENSE | 111 | - | half divided 5V input supply voltage |
Table 11: Selecting multiplexer analog input channels
Another feature of the analog interface capacities of the XADC units of the Zynq device are the Auxiliary Analog Inputs of the Zynq device's PL bank 35 (see Xilinx document UG480, section 'Auxiliary Analog Inputs'). With 6 pins of female pin header J4 3 analog differential pairs can be created:
| Analog differential Input Pin Pair | Connector pin | Signal Schematic Name | Note |
|---|---|---|---|
| IO_L1P_T0_AD0P_35, pin F12 IO_L1N_T0_AD0N_35, pin E13 | J4-3 J4-1 | AIN2 AIN0 | I/O's also usable in digital mode |
IO_L2P_T0_AD8P_35, pin F11 | J4-4 J4-2 | AIN3 AIN1 | I/O's also usable in digital mode |
IO_L3P_T0_DQS_AD1P_35, pin F13 | J4-6 J4-5 | AIN5 AIN4 | I/O's also usable in digital mode |
Table 12: Auxiliary Analog Inputs of the Zynq device
Note: These 6 auxiliary analog inputs pins are analog inputs are shared with PL bank pins and can be used as regular digital I/O's.
On-board Peripherals
DDR Memory
TE0723 module has up to 512-MBytes of DDR3L SDRAM arranged into 32-bit wide memory bus providing total of 1 GBytes of on-board RAM. Different memory sizes are available optionally.
Quad SPI Flash Memory
On-board quad SPI Flash memory S25FL127S (U5) is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application storage. All four SPI data lines are connected to the Zynq SoC's PS, allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the bus width and clock frequency used.
FTDI FT2232H IC
The FTDI chip U3 converts signals from USB2.0 to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity of the FT2232H chip.
FTDI FT2232H chip is used in MPPSE mode for JTAG, 14 I/O's of Channel B are routed to PL bank 34 of the Zynq SoC and are usable for example as UART interface.
The configuration of FTDI FT2232H chip is stored with Xllinx License on EEPROM U6. Please note the warning in section "USB2 to JTAG/UART Adapter" to not overwrite or delete the Xilinx License on the EEPROM U6.
Microwire Serial EEPROM
There is a 2-Kbit (128 x 16-bit organization) Microwire compatible serial EEPROM 93AA56B (U6) connected to the FTDI FT2232H dual high-speed USB2 to multipurpose UART/FIFO (U3). This external EEPROM allows each of the FTDI FT2232H chip’s channels to be independently configured as a serial UART (RS232 mode), parallel FIFO (245) mode or fast serial (optical isolation). The external EEPROM can also be used to customize the USB VID, PID, serial number, product description strings and power descriptor value of the FT2232H for OEM applications. Other parameters controlled by the EEPROM include remote wake up, soft pull down on power-off and I/O pin drive strength.
High-speed USB2 ULPI PHY
Hi-speed USB2 ULPI PHY (U18) is provided with USB3320 from Microchip. The ULPI interface is connected to the Zynq SoC's PS USB0 via MIO28..39, bank 501 (see also section). The I/O voltage is fixed at 3.3V and PHY reference clock input is supplied from the on-board 52.000000 MHz oscillator (U14).
Oscillators
The module has following reference clock signals provided by on-board oscillators:
| Source | Signal | Frequency | Destination | Pin Name | Notes |
|---|---|---|---|---|---|
| U14 | PS_CLK | 52.000000 MHz | U1 | PS_CLK_500 | Zynq SoC PS subsystem main clock. |
| U14 | OTG-RCLK | 52.000000 MHz | U18 | REFCLK | USB3320C PHY reference clock. |
| U7 | OSCI | 12.000000 MHz | U3 | OSCI | FT2232H oscillator input. |
Table 13: Reference clock signals
On-board LEDs
There are three LEDs on-board TE0723:
| LED | Color | Connected to | Description and Notes |
|---|---|---|---|
| D2 | Red | Zynq PS bank 500, pin MIO9 | User LED. |
| D6 | Green | Zynq PL bank 34, pin G14 | User LED. |
| D7 | Green | 3.3V | Indicating 3.3V voltage level. |
Table 14: On-board LEDs
Push Buttons
The TE0723 board is equipped with one push buttons S1:
| Button | Signal Schematic Name | Connected to | Notes |
|---|---|---|---|
| S1 | NRST | Voltage Monitor Circuit, U23 | Triggers system reset. |
Table 15: Push buttons of the module
Power and Power-On Sequence
To power-up a module, power supply with minimum current capability of 1A is recommended.
Power Supply
5V power can be supplied by the external power supply through connector J12 or via USB connection to the host system through USB connector J8 or J9. Minimum current capability of 1A for external power supply is recommended.
Following diagram shows the dependencies of the power supply:
Figure 3: Module power supply dependencies
Power Consumption
Power consumption is to be determined by the user and depends on SoC's FPGA design and connected hardware.
| Board Variant | FPGA | Design | Typical Power, 25°C ambient |
|---|---|---|---|
| TE0723-02 | XC7Z010-1CLG225C | Not configured | TBD* |
| TE0723-03M | XC7Z010-1CLG225C | Not configured | TBD* |
| TE0723-03-07S-1C | XC7Z007S-1CLG225C | Not configured | TBD* |
Table 16: Module power consumption
Power-On Sequence
There is no specific power-on sequence, system will power-up automatically when 5V is present either through J8, J9 or J12.
Voltage Monitor Circuit
The voltages 1.0V (core voltage) and 3.3V are monitored by the voltage monitor circuit U23, which generates the POR_B reset signal at power-on. A manual reset is also possible by driving the connector pin J3-3 ('EXT_RST') to GND (leave this pin unconnected or connect to VDD (3.3V) when unused) or press switch button S1, which is assigned to the signal 'NRST'.
Figure 4: Voltage monitor circuit
Power Rails
The voltage direction of the power rails is directed at on-board connectors' view:
| Main Power Pins Designator | VCC / VCCIO | Direction | Pins | Notes |
|---|---|---|---|---|
| J12 | 5V | In | 1 | 5V power supply pin header. |
| J3 | 3.3V | Out | 2, 4 | On-board 3.3V voltage level available. |
| 5V | In / Out | 5 | On-board 5.0V voltage level available or supply pin. |
Table 17: Main power pin header description
| I/O pin header | VCC / VCCIO | Direction | Pins | Notes |
|---|---|---|---|---|
| J5 | 3.3V | Out | 4, 8 | I/O header VCCIO. |
| J6 | 3.3V | Out | 6, 12 | I/O header VCCIO. |
Table 18: Power pin description of I/O pin header
| Peripheral Socket Designator | VCC / VCCIO | Direction | Pins | Notes |
|---|---|---|---|---|
| J8 / J9 | USB-VBUS | In / Out | 1 | Direction depends on USB2 mode. |
| J10 | 3.3V | Out | 4 | MikroSD Card socket VDD. |
Table 19: Power pin description of peripheral connector
Bank Voltages
Bank | Bank I/O Voltage VCCO | Voltage Range |
|---|---|---|
| 0 (config) | 3.3V | fixed |
| 500 (MIO) | 3.3V | fixed |
| 501 (MIO) | 3.3V | fixed |
| 34 (HR) | 3.3V | fixed |
| 35 (HR) | 3.3V | fixed |
Table 20: Board bank voltages
Variants Currently in Production
| Board Variant | Xilinx Zynq SoC | DDR3L SDRAM | ARM Cores | PL Cells | LUTs | Flip-Flops | Block RAM | DSP Slices | Zynq SoC Operating Temp. | Temp. Range |
|---|---|---|---|---|---|---|---|---|---|---|
| TE0723-02 | XC7Z010-1CLG225C | 128 MBytes | Dual-core | 28K | 17,6K | 35,2K | 2.1 MBytes | 80 | 0°C to +85°C | Commercial |
| TE0723-03M | XC7Z010-1CLG225C | 512 MBytes | Dual-core | 28K | 17,6K | 35,2K | 2.1 MBytes | 80 | 0°C to +85°C | Commercial |
| TE0723-03-07S-1C | XC7Z007S-1CLG225C | 512 MBytes | Single-core | 23K | 14,4K | 28,8K | 1.8 MBytes | 66 | 0°C to +85°C | Commercial |
Table 21: Board variants
Technical Specifications
Absolute Maximum Rating
Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
5V power supply voltage | 4.75 | 5.25 | V | USB2.0 VBUS voltage specification |
| HR PL I/O banks input voltage (VCCIO single ended) | -0.4 | VCCO + 0.55 | V | Xilinx datasheet DS187 (VCCO 3.3V nominal) |
| PS MIO I/O banks input voltage (VCCIO single ended) | -0.4 | VCCO + 0.55 | V | Xilinx datasheet DS187 (VCCO 3.3V nominal) |
| Analog Multiplexer IC pins input voltage | 0 | 3.3V | V | TI CDx4HC405x data sheet |
Storage temperature | -40 | +85 | °C | WL-SMCW SMD LED data sheet |
Table 22: Board absolute maximum ratings
Recommended Operating Conditions
| Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
| 5V power supply voltage | 4.75 | 5.25 | V | USB2.0 VBUS voltage specification |
| HR PL I/O banks input voltage (VCCIO single ended) | -0.20 | VCCO + 0.20 | V | Xilinx datasheet DS187 (VCCO 3.3V nominal) |
| PS MIO I/O banks input voltage (VCCIO single ended) | -0.20 | VCCO + 0.20 | V | Xilinx datasheet DS187 (VCCO 3.3V nominal) |
| Analog Multiplexer IC pins input voltage | 0 | 3.3V | V | TI CDx4HC405x data sheet |
Operating Temperature Commercial | 0 | +85 | °C | Xilinx datasheet DS190 |
Table 23: Board recommended operating conditions
Please check Xilinx datasheet DS187 for complete list of absolute maximum and recommended operating ratings for the Zynq-7 device.
Physical Dimensions
Module size: 68.58 mm × 53.34 mm. Please download the assembly diagram for exact numbers.
PCB thickness: 1.6 mm.
Highest part on PCB: approx. 4 mm. Please download the step model for exact numbers.
Please note that two different units are used on the figures below, SI system millimeters (mm) and imperial system thousandths of an inch(mil). To convert mils to millimeters and vice versa use formula 100mil's = 2,54mm.
Figure 5: Board physical dimensions
Revision History
Hardware Revision History
| Date | Revision | Notes | PCN | Documentation Link |
|---|---|---|---|---|
| 2016-07-15 | 03 | Refer to Changes list in Schematic for further details in changes to REV02 | - | TE0723-03 |
2015-11-06 | 02 | Second Production Release | - | TE0723-02 |
| - | 01 | First Production Release | - | - |
Table 24: Board hardware revision history
Hardware revision number is printed on the PCB board together with the module model number separated by the dash.
Figure 6: TE0723 board hardware revision number
Document Change History
Date | Revision | Contributors | Description |
|---|---|---|---|
Ali Naseri, |
|
Table 25: Document change history.
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WEEE
Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.
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