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Overview

The Trenz Electronic TE0802 is a development board integrating a Xilinx Zynq UltraScale+ . Other assembly options for the FPGA and the memory chips are available. Please contact us for further information.

Refer to http://trenz.org/te0802-info for the current online version of this manual and other available documentation.

Key Features

  • MPSoC:  XCZU2CG - Xilinx Zynq UltraScale+ MPSoC
    • Package: 1SBVA484E
    • Speed Grade: -1 (Slowest)
    • Temperature Grade: Extended (0 to +100 °C)

  • RAM/Storages:
    • SDRAM: LPDDR4 8Gb 256Mx16x 2 
    • SPI Flash 256Mb (32M x 8) 133 MHz
    • EEPROMs 2Kb (256 x 8)
    • EEPROMs 4Kb (512 x 8)
  • Interfaces: 
    • USB JTAG/UART microUSB
    • 1GB Ethernet RJ45
    • USB 3.0 Host (Type A Connector)
    • microSD Card
    • M.2 SSD PCIe
    • 3.5 mm Earphone Jack (PWM Output)
    • Display Port
    • VGA
    • 4 Digit 7-Segment LED Display
    • 8 LEDs
    • 5 User Buttons
    • 8 Bit Slide Switches
    • Reset Button
    • 2x Pmod Connector
  • Power
    • 5 V +/- 10%
    • ~3.5 W
  • Dimension: 100mm x 100mm

Block Diagram


TE0802 Block Diagram

Main Components

TE0802 Main Components (Picture shows Revision 01)
  1. Xilinx Zynq UltraScale+ MPSoc, U14
  2. LPDDR4 SDRAM, U13
  3. M.2 Key M PCIe x1, U5
  4. SPI Flash Memory, U16
  5. EEPROM, U2, U18
  6. Oscillator, U15, U7, U19, U23, U43
  7. Clock Generator, U8
  8. Clock Generator Programming Connector, J14
  9. Grove Connector, J10
  10. Pmod Host Socket, J5...6
  11. Headphone Jack, J12
  12. D-Sub Connector, J7
  13. DisplayPort, J3
  14. RJ45 Socket, J4
  15. Ethernet PHY, U6
  16. USB Type A, J11
  17. USB 2.0 PHY, U22
  18. Micro USB 2.0 Type B, J8
  19. FTDI USB 2.0 to JTAG/UART Converter, U17
  20. microSD Card, J9
  21. Slide Switch, S1
  22. Push Button, BTN1...5
  23. DIP Switch, S7...8
  24. 4 Digit 7-Segment LED Display, D9
  25. 8x LEDs (Red), LED0...7
  26. Power Jack, J13
  27. Overvoltage/Undervoltage/Reverse Supply Protector, U12
  28. Power Management Integrated Circuit (PMIC), U1, U9
  29. Power Good LED (Green), D12

Initial Delivery State

Storage device name

Content

Notes

SPI Flash (U16)

Not programmed


EEPROM (U2)Not programmedExcept Ethernet MAC
EEPROM (U18)Programmed

FTDI Configuration

LPDDR4 SDRAM (U13)Not programmed
Initial Delivery State of Programmable Devices on the Module

Configuration Signals

Bootmode signals must be set through DIP Switch S9. 

MODE Signal State

MODE1

S1-B

MODE0

S1-A

Boot Mode

MODE[2:0]=000

OFFOFF

JTAG

MODE[2:0]=001

OFFONnot supported

MODE[2:0]=010

ONOFFQSPI(32 bit)

MODE[2:0]=011

ONONSD0(2.0)
Boot Process

Reset setting is available through Push Button BTN6.

Signal

Connected toNote

POR_B

BTN6, Push ButtonConnected to nRESET
Reset Process

Signals, Interfaces and Pins

I/Os on Pin Headers and Connectors

FPGA bank number and number of I/O signals connected to the connectors:

FPGA BankConnector I/O Signal CountVoltage LevelNotes
Bank 503Micro USB, J8 (over FTDI)4 Single Ended3.3 VJTAG
Bank 500Micro USB, J8 (over FTDI)2 Single Ended3.3 VUART
Bank 500Micro SD Card, J97 Single Ended3.3 V
Bank 502ETH RJ45, J4 (over ETH PHY)14 Single Ended1.8 V
Bank 505, 502USB 3.0, J11 (USB2 over USB PHY)2 Differential Pairs, 12 Single Ended-- / 1.8V

Bank 505, 501

SSD M.2, U5

2 Differential Pairs, 5 Single Ended

-- / 3.3 V


Bank 505, 501Display Port Connector, J32 Differential Pairs, 5 Single Ended--/ 3.3 V
Bank 26, 65, 66,D-Sub Host Socket (VGA), J714 Single Ended3.3 V / 1.8 V / 1.8 V
Bank 65Earphone, J123 Single Ended1.8 V
Bank 500Grove Connector, J102 Single Ended3.3 V
Bank 26Pmod Host Socket, J58 Single Ended3.3 V
Bank 26Pmod Host Socket, J6 8 Single Ended3.3 V
General I/O to Pin Header and Connectors Information

Micro SD Card

TE0802 is equipped with a micro SD card connector (J9).

SchematicConnected toNotes
SD_DAT0

MIO 13, FPGA Bank 500


SD_DAT1MIO 14, FPGA Bank 500
SD_DAT2MIO 15, FPGA Bank 500
SD_DAT3MIO 16, FPGA Bank 500
SD_CLKMIO 22, FPGA Bank 500
SD_CMDMIO 21, FPGA Bank 500
SD_CDMIO 24, FPGA Bank 500
Micro SD Card Connector Information

RJ45 Connector

TE0802 is equipped with a RJ45 connector and an Ethernet PHYs. RJ45 connector J4 is connected to Ethernet PHYs U6.

PinSchematicETH PinNotes
2PHY_MDI0_PMDIP[0]
3PHY_MDI0_NMDIN[0]
4PHY_MDI1_PMDIP[1]
5PHY_MDI1_NMDIN[1]
6PHY_MDI2_PMDIP[2]
7PHY_MDI2_NMDIN[2]
8PHY_MDI3_PMDIP[3]
9PHY_MDI3_NMDIN[3]
RJ45 Connector Information

USBs Sockets

TE0802 is equipped with a Micro USB2.0 B connector J8 and a USB3.0 connector J11.

FTDI FT2232 (U17) can be accessed through Micro USB 2.0 B connector (J8) for JTAG (channel A). Channel B is connected to the FPGA and can be used for UART.

USB2.0 PinSchematicConnected toNotes
D-D_N

FTDI, U17


D+D_PFTDI, U17
VbusUSB_VBUSGND
USB2.0 B Socket Information

USB3.0 PinSchematicConnected toNotes
D-USB0_D_NUSB PHY, U22
D+USB0_D_PUSB PHY, U22
StdA_SSRX-USB_RX2_NFPGA Bank 505
StdA_SSRX+USB_RX2_PFPGA Bank 505
StdA_SSTX-USB_TX2_NFPGA Bank 505
StdA_SSTX+USB_TX2_PFPGA Bank 505
VBUSVBUSUSB PHY, U22
USB3.0 A Socket Information

SSD M.2 Connector

TE0802 is equipped with a SSD M.2 connector (U5).

PinSchematicConnected toNotes
PERn0/SATA-B+

SSD_RX3_N

Pin M22, FPGA Bank 505
PERp0/SATA-B-SSD_RX3_PPin M21, FPGA Bank 505
PERn0/SATA-A+

SSD_TXC3_N

Pin K22, FPGA Bank 505
PERp0/SATA-A-SSD_TXC3_PPin M21, FPGA Bank 505
REFCLKN

SSD_RCLK_N

Pin 9, Clock Generator U8
REFCLKPSSD_RCLK_PPin 10, Clock Generator U8
DAS/DSS#SSD_DASMIO35, FPGA Bank 501
DEVSLPSSD_SLEEPMIO32, FPGA Bank 501
PERST#SSD_PERSTnMIO31, FPGA Bank 501
CLKREQ#SSD_CLKRQMIO33, FPGA Bank 501
PEWake#SSD_WAKEMIO34, FPGA Bank 501
SSD M.2 Connector Information

Display Port Connector

TE0802 is equipped with a Display Port connector (J3).

SchematicCorresponding SignalsConnected toNotes
DP_TX_L0_P/NDP0_TX_P/NPin A19/A20, FPGA Bank 505
DP_TX_L1_P/NDP1_TX_P/NPin C19/C20, FPGA Bank 505
DP_TX_AUX_P/NDP_AUX_TX/RXMIO27, MIO30, FPGA Bank 501
Display Port Socket Information

D-Sub Connector

TE0802 is equipped with a D-Sub connector (J7).

SchematicCorresponding SignalsConnected toNotes
VGA_REDVGA_R0...3Bank 65Red Channel
VGA_GREENVGA_G0...3Bank 65Green Channel
VGA_BLUEVGA_B0...3Bank 66Blue Channel
VGA_RGB_HSYNCVGA_HSBank 26Horizontal Sync
VGA_RGB_VSYNCVGA_VSBank 26Vertical Sync
D-Sub Connector Information

Headphone Connector

TE0802 is equipped with a headphone connector (J12).

SchematicConnected toNotes
JACKSNSPin F3, FPGA Bank 65
PWM_RPin F4, FPGA Bank 65
PWM_LPin E3, FPGA Bank 65
Headphone Connector Information

Grove Connector

TE0802 is equipped with a grove connector (J10).

SchematicConnected toNotes
Grove_SCL0MIO18, FPGA Bank 500
Grove_SDA0MIO19, FPGA Bank 500
Grove Connector Information

Pmod Sockets

TE0802 has 2 Pmod 2x6 host sockets which are connected to the FPGA.

DesignatorSignalsConnected to Notes
J5PMOD_A0...7Bank 26
J6PMOD_B0...7Bank 26
Pmod SMD Host Socket Information

Test Points

Test Point

SignalsNotes
TP1+1.1V_LPDDR4
TP2+1.8V_MGTRAVTT
TP3+1.8V_PL
TP4FT_B_TX
TP5DP_TX_PWR
TP6GND
TP7GND
TP8PMIC2_SDA
TP9PMIC2_TP
TP10ONKEY2
TP11PMIC2_SCL
TP12DP_TX_HPD
TP13DP_TX_PWR
TP14INT_SCL1
TP15INT_SDA1
TP16FT_B_RX
TP17CLOCKDIST_OE
TP18+0.85V_VCCINT
TP19+3.3V
TP20+1.8V_PS
TP21ERR_STATUS
TP22+1.2V_PSPLL
TP23GND
TP24GND
TP25PMIC1_SCA
TP26PMIC1_SDA
TP27ONKEY1
TP28PMIC1_TP
TP29POR_B
TP30PSBATT
TP31SRST_B
TP32DONE
TP33INIT_B
TP34VBUS
TP35USB_VBUS
TP36PROG_B
TP37ERR_OUT
Test Points Information

On-board Peripherals

Chip/InterfaceDesignatorNotes
Quad SPI Flash MemoryU16
LPDDR4 SDRAMU13
EEPROMU2, U18
USB ULPI PHYU22
Ethernet PHYU6
FTDI FT2232HU17
Clock GeneratorU8
OscillatorsU7, U15, U19, U23, U43
7-Segment DisplayD9
User LEDLED0...7
Push ButtonBTN1...5
DIP SwitchS1, S7...8
On-board Peripherals

Quad SPI Flash Memory

he TE0802 evaluation board has  one single QSPI flash connected as x4. Flash size depends on the assembly option, default 32MB

MIO PinSchematicU16 PinNotes
MIO0MIO0B2SPI_CLK
MIO1MIO1D2SPI_DQ1
MIO2MIO2C4SPI_DQ2
MIO3MIO3D4SPI_DQ3
MIO4MIO4D3SPI_DQ0
MIO5MIO5C2SPI_CS
Quad SPI Interface MIOs and Pins

LPDDR4 SDRAM

The TE0802 evaluation board has 1 GByte volatile LPDDR4 SDRAM IC (U13) for storing user application code and data. The details depends on the assembly option.

  • Part number: IS43LQ32256A-062BLI
  • Supply voltage: 1.06 -1.17 V
  • Speed: 1600 MHz 
  • Temperature: -40 to +85 C

EEPROM


MIO PinSchematicU2 PinNotes
MIO8Int_SCL1SCL
MIO9Int_SDA1SDA
I2C FPGA EEPROM Interface MIOs and Pins

TypeI2C AddressDesignatorNotes
4AA025E48T-I/OT0x50U2EEPROM with MAC
I2C Address for FPGA EEPROM

PinSchematicU18 PinNotes
CSEECS1FTDI
CLKEECLK2FTDI
DIN/DOEEDATA3/4FTDI
I2C FTDI EEPROM Interface Pins

USB ULPI PHY

The TE802 is equipped with a USB ULPI PHY. 

USB PHY PinSignal Schematic NamesConnected toNote

DATA0

USB0_DATA0

MIO56, FPGA Bank 502
DATA1USB0_DATA1MIO57, FPGA Bank 502
DATA2USB0_DATA2MIO54, FPGA Bank 502
DATA3USB0_DATA3MIO59, FPGA Bank 502
DATA4USB0_DATA4MIO60, FPGA Bank 502
DATA5USB0_DATA5MIO61, FPGA Bank 502
DATA6USB0_DATA6MIO62, FPGA Bank 502
DATA7USB0_DATA7MIO63, FPGA Bank 502
DIRUSB0_DIRMIO53, FPGA Bank 502
NXTUSB0_NXPMIO55, FPGA Bank 502
STPUSB0_STPMIO58, FPGA Bank 502
RESETBUSB0_RST_NMIO38, FPGA Bank 501
CPENUSB0_VBUS_ENPin 1, U21 (Current-limited Power Switch)
VBUSVBUS

Pin 8, U21 (Current-limited Power Switch).

Pin 1, J11 (USB Connector)


IDUSB0_IDPulled-down to GND
DPUSB0_D_PPin 3, J11 (USB Connector)
DMUSB0_D_NPin 2, J11 (USB Connector)
REFCLKUSB0_RCLKPin 3, U23 (Oscillator)
CLKOUTUSB0_CLKMIO52, FPGA Bank 502
USB ULPI PHY Connections and Pins

Ethernet PHY

The TE0802 is equipped with an Ethernet PHY (U6) which is connected to RJ45 (J4) connector. 

Ethernet PHY PinSignal Schematic NamesETHNote
TXD0ETH_TXD0MIO65, FPGA Bank 502
TXD1ETH_TXD1MIO66, FPGA Bank 502
TXD2ETH_TXD2MIO67, FPGA Bank 502
TXD3ETH_TXD3MIO68, FPGA Bank 502
TX_CTRLETH_TXCTLMIO69, FPGA Bank 502
TX_CLKETH_CLKMIO64, FPGA Bank 502
MDIOETH_MDIOMIO77, FPGA Bank 502Pulled-up to +1.8V_PS.
MDCETH_MDCMIO76, FPGA Bank 502
MDIP[0]

PHY_MDI0_P

Pin2, J4 (RJ45)
MDIN[0]PHY_MDI0_NPin3, J4 (RJ45)
MDIP[1]

PHY_MDI1_P

Pin4, J4 (RJ45)
MDIN[1]PHY_MDI1_NPin5, J4 (RJ45)
MDIP[2]

PHY_MDI2_P

Pin6, J4 (RJ45)
MDIN[2]PHY_MDI2_NPin7, J4 (RJ45)
MDIP[3]

PHY_MDI3_P

Pin8, J4 (RJ45)
MDIN[3]PHY_MDI3_NPin9, J4 (RJ45)
LED[0]PHY_LED0LED, J4 (RJ45)
LED[1]PHY_LED1LED, J4 (RJ45)
CONFIG--Pulled-up to +1.8V_PS.
XTAL_INETH_XTAL_INPin 3, U7 (Oscillator)
RESETnETH_RSTMIO37, FPGA Bank 501Pulled-up to +1.8V_PS.
RX_CLKETH_RXCKMIO70, FPGA Bank 502
RX_CTRLETH_RXCTLMIO75, FPGA Bank 502
RXD[0]ETH_RXD0MIO71, FPGA Bank 502
RXD[1]ETH_RXD1MIO72, FPGA Bank 502
RXD[2]ETH_RXD2MIO73, FPGA Bank 502
RXD[3]ETH_RXD3MIO74, FPGA Bank 502
Ethernet PHY Connections and Pins

FTDI FT2232H

The FTDI chip U17 converts signals from USB 2.0 to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet for more information about the capacity of the FT2232H chip.
Channel A of FTDI FT2232H chip is used in MPPSE mode for JTAG. Channel B is used in UART mode.

The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U18.

FTDI Chip PinSignal Schematic NameConnected toNotes
ADBUS0TCKPin H13, FPGA Bank 503JTAG Interface
ADBUS1TDIPin H12, FPGA Bank 503JTAG Interface
ADBUS2TDOPin J13, FPGA Bank 503JTAG Interface
ADBUS3TMS

Pin J12, FPGA Bank 503

JTAG Interface

BDBUS0FT_B_TXMIO10, FPGA Bank 500UART
BDBUS1FT_B_RXMIO11, FPGA Bank 500UART
EECSEECSPin 1, U18 (EEPROM)
EECLKEECLKPin 2, U18 (EEPROM)
EEDATAEEDATAPin 3/4, U18 (EEPROM)
OSCI-Pin 3, U19 (Oscillator)
DMD_NPin 2, J8 (Micro USB 2.0)
DPD_PPin 3, J8 (Micro USB 2.0)
FTDI Chip Interfaces and Pins

Clock Generator

The TE0802 is equipped with a clock generator (U8). 

Clock Generator PinSignal Schematic NamesConnected toNote
REFP-Pin 3, U43 (Oscillator)
REFSELREFSEL-Pulled-up to +3.3V.
RESETN/SYNCCLK_GEN_RESETPin B5, FPGA Bank 26Pulled-up to +3.3V.
EEPROMSELEEPROMSEL-Pulled-up to +3.3V.
SDA/GPIO2CLK_GEN_SDA

- (Default)

MIO9, FPGA Bank 500 (R185/196 required)

Pin 2, J14 (Pin Header required)

Pulled-up to +3.3V. (Default)

Pulled-up to +3.3V.

Pulled-up to +3.3V.

SCL/GPIO3CLK_GEN_SCL

- (Default)

MIO8, FPGA Bank 500 (R185/196 required)

Pin 3, J14 (Pin Header required)

Pulled-up to +3.3V. (Default)

Pulled-up to +3.3V.

Pulled-up to +3.3V.

OE/GPIO4--Pulled-up to +3.3V.

Y1P

CLK_Y1_P / CLK_DP_PPin G19, FPGA Bank 50527 MHz
Y1NCLK_Y1_N / CLK_DP_NPin G20, FPGA Bank 50527 MHz

Y2P

CLK_Y2_P / CLK_USB_PPin J19, FPGA Bank 50526 MHz
Y2NCLK_Y2_N / CLK_USB_NPin J20, FPGA Bank 50526 MHz

Y3P

CLK_Y3_P / CLK_PCIe_PPin L19, FPGA Bank 505100 MHz
Y3NCLK_Y3_N / CLK_PCIe_NPin L20, FPGA Bank 505100 MHz

Y4P

CLK_Y4_P / SSD_RCLK_PPin 55, U5 (M.2)100 MHz
Y4NCLK_Y4_N / SSD_RCLK_NPin 53, U5 (M.2)100 MHz
Clock Generator Connections and Pins

Clock Sources

DesignatorSignal Schematic NamesConnected toDescriptionFrequencyNote
U7ETH_XTAL_INPin 34, U6 (Ethernet PHY)Clock for Ethernet25 MHz
U15PS_CLKPin H14, FPGA Bank 503Clock for FPGA33 MHz
U23USB_CLK / USB0_RCLKPin 26, U22 (USB PHY)Clock for USB52 MHz
U43-Pin 5, U8 (Clock Generator)Clock for Clock Generator25 MHz
Oscillators

7-Segment Display

The TE0802 has a 4-Digit-7-Segment LED display.

PinSchematicConnected to Notes
A/L1CA / SEG_CAPin E4, FPGA Bank 65
B/L2CB / SEG_CBPin D3, FPGA Bank 65
C/L3CC / SEG_CCPin N5, FPGA Bank 65
DCD / SEG_CDPin P5, FPGA Bank 65
ECE / SEG_CEPin N4, FPGA Bank 65
FCF / SEG_CFPin C3, FPGA Bank 65
GCG / SEG_CGPin R5, FPGA Bank 65
DPCDP / SEG_CDPPin N3, FPGA Bank 65
A1SEG_AN1Pin A9, FPGA Bank 26
A2SEG_AN2Pin B9, FPGA Bank 26
A3SEG_AN3Pin A7, FPGA Bank 26
A4SEG_AN4Pin B6, FPGA Bank 26
L1-L3SEG_ANPin A8, FPGA Bank 26
7-Segment LED Pins

User LED

SchematicColorConnected toActive LevelNote
LED0...7RedBank 65High
D12GreenU9, PMICHighPOWER_OK
On-board LEDs

Push Button

Designator SchematicConnected toFunctionalityNote
BTN_1USER_BTN_UPPin U2, FPGA Bank 65User Push ButtonPulled-up to +1.8V_PL.
BTN_2USER_BTN_LEFTPin R1, FPGA Bank 65User Push ButtonPulled-up to +1.8V_PL.
BTN_3USER_BTN_OKPin T1, FPGA Bank 65User Push ButtonPulled-up to +1.8V_PL.
BTN_4USER_BTN_RIGHTPin U1, FPGA Bank 65User Push ButtonPulled-up to +1.8V_PL.
BTN_5USER_BTN_DOWNPin T2, FPGA Bank 65User Push ButtonPulled-up to +1.8V_PL.
BTN_6POR_B

Pin 38, U1 (PMIC),

Pin 38, U9 (PMIC),

Pin K12, FPGA Bank 503

Reset ButtonPulled-up to +3.3V.
On-board Push Buttons

DIP Switch

DesignatorSchematicConnected toFunctionalityNote
S1AMODE0Pin J16, FPGA Bank 503DIPPulled-down to GND.
S1BMODE1Pin H15, FPGA Bank 503DIPPulled-down to GND.
S1CUSER_CFG0Pin A4, FPGA Bank 66DIPPulled-down to GND.
S1DUSER_CFG1Pin B4, FPGA Bank 66DIPPulled-down to GND.
S7AUSER_SW7Pin M5, FPGA Bank 65DIPPulled-up to +1.8V_PL.
S7BUSER_SW6Pin M4, FPGA Bank 65DIPPulled-up to +1.8V_PL.
S7CUSER_SW5Pin J2, FPGA Bank 65DIPPulled-up to +1.8V_PL.
S7DUSER_SW4Pin K1, FPGA Bank 65DIPPulled-up to +1.8V_PL.
S8AUSER_SW3Pin L1, FPGA Bank 65DIPPulled-up to +1.8V_PL.
S8BUSER_SW2Pin M1, FPGA Bank 65DIPPulled-up to +1.8V_PL.
S8CUSER_SW1Pin P2, FPGA Bank 65DIPPulled-up to +1.8V_PL.
S8DUSER_SW0Pin P3, FPGA Bank 65DIPPulled-up to +1.8V_PL.
DIP Switches

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 3 A for system startup is recommended.

Power Consumption

Power Input PinTypical Current
VINTBD*
Power Consumption

* TBD - To Be Determined

Power Distribution Dependencies

Power Distribution

Power-On Sequence

PMICs will be reset after pressing Push Button BTN6 (POR_B).

Power Rails

Power Rail NameDirectionNotes
VININSupply Voltage
+5VOutJ1...2
+3.3VOutJ14, J10
Module Power Rails

Bank Voltages

Bank          

Schematic Name

Voltage

Notes
Bank 26+3.3V3.3 V
Bank 65+1.8V_PL1.8 V
Bank 66+1.8V_PL1.8 V
Bank 500+3.3V3.3 V
Bank 501+3.3V3.3 V
Bank 502+1.8V_PS1.8 V


Bank 503+3.3V3.3 V
Bank 504+1.1V_LPDDR41.1 V


Bank 505

+0.85V_MGTRAVCC

0.85 V


SoC Bank Voltages

Technical Specifications

Absolute Maximum Ratings

SymbolsDescriptionMinMaxUnit
VINInput Supply Voltage (J13)-3.57V
T_STGStorage Temperature-4085°C
Absolute Maximum Ratings

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

ParameterMinMaxUnitsReference Document
VIN45.5VSchematic "POWER" (Component: LTC4365ITS8)
T_STG085°CZynq Ultrascale+ Data sheet
Recommended Operating Conditions

Physical Dimensions

Module size: 100 mm × 100 mm.  Please download the assembly diagram for exact numbers.

PCB thickness: 1.48 mm

Physical Dimension in mm

Currently Offered Variants 

Trenz Shop TE0802 Overview Page
English pageGerman page
Trenz Electronic Shop Overview

Revision History

Hardware Revision History


DateRevisionChangesDocumentation Link
2019-04-2902
  • Added suppressor 1SMA5.0AT3G on power input
  • Changed OV and UV protection range
  • Changed VGA schematic
  • USB page: VBUS resistor changed on 1K
REV02
2018-10-1701ReleaseREV01
Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Board Hardware Revision Number

Document Change History

DateRevisionContributorDescription

Pedram Babakhani

  • Technical Specifications updated

--

all

Pedram Babakhani , ED , Ivan Grishchenko , John Hartfiel

  • --
Document Change History

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REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.




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