TE0950 TRM

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Overview

The Trenz Electronic TE0950-02 is a powerful adaptive SoC evaluation board, equipped with an AMD Versal™ AI (Edge) device. Furthermore, the board is equipped with up to 8GB DDR4 SDRAM, 128 MByte SPI Flash and an  eMMC for configuration and data storage as well as powerful switching power supplies for all required voltages. Inputs and outputs are provided by robust, flexible and cost-effective high-speed connectors.

Refer to http://trenz.org/te0950-info for the current online version of this manual and other available documentation.

Key Features

• SoC
  • AMD Versal™ AI device ¹⁾
    
    • Package: A784
    • Device:  VE2002, VE2102, VE2202, VE2302, VM1102 ¹⁾
    • Speed: -1, -2, -3 ¹⁾
    • Temperature: I, E ¹⁾
• RAM/Storage
  • DDR4 SDRAM
    • Data width: 64bit
    • Size: def. 8GB, up to 8 GByte possible ¹⁾
    • Speed: up to 3200Mb/s ²⁾
  • 128 MByte SPI Flash (primary boot option)
    • Data width: 8bit
    • size: def. 128MB, up to 512MB possible ¹⁾
  • MicroSD card (primary boot option)
  • e.MMC (secondary boot option) ¹⁾
    
    • Data width: 8bit
    • size: def. 32GB ¹⁾
  • EEPROM with MAC-address
• On Board
  
  • AMD Artix™ 7 FPGA as configurable Levelshifter/MUX for FMC and other 3.3 V IOs
    
    • 32 MByte SPI Flash
    • 1 dip switch
    • 2 LEDs
  • USB 2.0 Host/Device/OTG (type Micro A/B connector)
  • USB JTAG + UART Micro-USB B
  • Gigabit Ethernet RJ45
  • Output
    • 2 LEDs (1 x MIO, 1 x PL)
  • Input
    • 1 push button (PL)
    • 2 dip switches (2 x MIO)
    • Reset button
• Interface
  • zQSFP
    • 4 GTYP Transceiver
  • 2 x CRUVI HS
    • each optimized for 4 Lane MIPI, one with reduced pinout
  • 2 x CRUVI LS
  • CSI-2 connector
    • optimized for camera, 2 lane MIPI
  • FMC
    • 4 GTYP Transceiver
    • 34 LA diff pairs to Levelshifter/MUX
• Power
  • 12 V plug
• Dimension
  • 150 mm x 120 mm
• Notes
  • ¹⁾ depends on assembly version
  • ²⁾ depends on used DDR4
  • ³⁾ productions within 2023 are equipped with engineering samples (AMD Vivado ES licence needed)

Block Diagram

Main Components

1. SoC (Versal) U1
2. DDR4 U8, U9, U10, U11
3. eMMC U25
4. dual QSPI Configuration Flash (Versal) U23, U24
5. ETH Phy U31
6. MAC EEPROM U35
7. USB 2.0 Phy U27
8. Jumper (USB Device/Host/OTG) J5
9. Artix FPGA (Levelshifter/MUX for FMC IOs) U13
10. OSPI Configuration Flash (Artix) U14
11. FTDI JTAG/UART to USB Bridge U15
12. FTDI Configuration EEPROM U17
13. zQSFP U12/J1
14. LPC FMC J3
15. CRUVI HS J10, J11
16. CRUVI LS J12, J13
17. CSI CAM Connector J15
18. SD-CARD Slot J4
19. RJ45 ETH jack J9
20. micro USB A/B Connector J8
21. micro USB B Connector (JTAG/UART) J2
22. 4 Pin FAN Connector J17
23. Power Input Jack J14
24. Reset Push Button S3
25. User Push Button S1
26. Dip Switches (JTAG Selection) S4
27. Dip Switches (Bootmode, User) S2
28. Dip Switches (FMC VADJ Selection, User) S5
29. LEDs (Power) D8, D9, D10
30. LEDs (Status/User) D0, D1, D2, D3 D4, D6, D11
31. 1x6 JTAG Header J18 (optional)

Initial Delivery State

Signals, Interfaces and Pins

Connectors

Test Points

On-board Peripherals

Configuration and System Control Signals

Power and Power-On Sequence

Power Rails

Recommended Power up Sequencing

Power up sequencing is handled board internally. No further interaction needed. For details See Schematic page 4 Power Diagram.

Board to Board Connectors

Following B2B connectors for board extensions are available:

• CRUVI,
  • Please see also CRUVI documentation at CRUVI.com.
  • More extensions are available at the Trenz electronic CRUVI.
  • CRUVI modules use on bottom side:

    • TMMH-106-04-F-DV-A-M as Low Speed connectors, (12 pins, 6 per row) 
    • ST4-30-1.50-L-D as High Speed connectors, (60 pins, 30 per row) 

    CRUVI carrier use on top side: 

    • CLT-106-02-F-D-A-K as Low Speed connectors , (12 pins, 6 per row) 
    • SS4-30-3.50-L-D as High Speed connectors, (60 pins, 30 per row)

    Connector Mating height

    Mating height of the high speed connectors is 5mm. The low speed connectors mate correctly within a range from 4.78 mm to 5.29 mm.

    Current Rating

    Current rating of High Speed B2B connectors is 1.6A per pin (2 pins powered).

    Current rating of Low Speed B2B connectors is 4.1A per pin (2 pins powered).

    Speed Rating

    There is no data available for the connectors actual used here. Data available for other stacking heights of same connectors is summarized in the folllowing table:

    Connector	Speed ratings
    ST4/SS4 single ended (4mm stacking height!)	13.5GHz / 27 Gbps
    ST4/SS4 differential (4mm stacking height!)	15.5 GHz / 31 Gbps
    TMMH/CLT single ended (4.77mm stacking height!)	5.5GHz / 11 Gbps

    Connector speed ratings

    Operating Temp Range

    All connectors are specified for a temp. range of -55 °C to 125 °C.

• FMC
  
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Technical Specifications

Absolute Maximum Ratings ^*)

^*) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these
   or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

This TRM is generic for all variants. Temperature range can be differ depending on the assembly version.  Voltage range is mostly the same during variants (exceptions are possible, depending on custom request)

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

• Variants of modules are described here: Article Number Information
• Modules with commercial temperature grade are equipped with components that cover at least the range of 0°C to 75°C
• Modules with extended temperature grade are equipped with components that cover at least the range of 0°C to 85°C
• Modules with industrial temperature grade are equipped with components that cover at least the range of -40°C to 85°C
• The actual operating temperature range will depend on the FPGA / SoC design / usage and cooling and other variables.

Physical Dimensions

• Module size: 150 mm × 120 mm.  Please download the assembly diagram for exact numbers.

PCB thickness: 1.6 mm.

Currently Offered Variants 

Revision History

Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Document Change History

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