TEC0330 TRM

Download PDF version of this document.

Table of Contents

Overview

The Trenz Electronic TEC0330 FPGA board is a PCI Express form factor card (PCIe 2.0 or higher) integrating the Xilinx Virtex-7 XC7VX330T FPGA chip. This high-end FPGA card is designed for maximum system performance and intended for use in applications with high demands on system throughput. There is a SO-DIMM socket on the board for standard DDR3 SDRAM extension memory module.

The TEC0330 features HPC (High Pin Count) ANSI/VITA 57.1 compatible FMC interface connector for standard I/O Mezzanine modules. Other interface connectors found on-board include JTAG for accessing FPGA and on-board System Controller CPLD, and also connector with 5 high-speed I/O differential signaling pairs.

The TEC0330 FPGA board is intended to be used as add-on card in a PCIe 2.0 or higher capable host systems, it can not be used as a stand-alone device.

Key Features

Xilinx Virtex-7 FPGA module XC7VX330T-2FFG1157C (commercial temperature range)
PCI Express 2.0 x8 card with maximum throughput of 4 GB/s
FMC High Pin Count (HPC) connector
8 FPGA MGT lanes available on PCIe interface
DDR3 SO-DIMM SDRAM socket
256-Mbit (32-MByte) Quad SPI Flash memory (for configuration and operation) accessible through:
- FPGA
- JTAG port (SPI indirect, bus width x4)
External clock input via SMA coaxial connector
28 GTH transceivers, each with up to 13.1 Gbit/s data transmission rate
FPGA configuration through:
- JTAG connector
- Quad SPI Flash memory
Programmable quad clock generator
TI LMK04828B ultra low-noise JESD204B compliant clock jitter cleaner
On-board high-efficiency DC-DC converters
Up to 202 FPGA I/O pins available on FMC connector (up to 101 LVDS pairs possible)
System management and power sequencing
AES bit-stream encryption
eFUSE bit-stream encryption

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Figure 1: TEC0330-03 block diagram.

Main Components

Figure 2: FPGA board TEC0330-03.

PCI Express 2.0 x8 connector, J1
FPGA JTAG connector, J9
User button, S2
SO-DIMM socket, U2
Xilinx Virtex-7 XC7VX330T-2FFG1157C FPGA, U1
ANSI/VITA 57.1 compliant FMC HPC connector, J2
SMA coaxial connector for external clock input, J3
System Controller CPLD JTAG connector, J8
I²C connector for LT LTM4676 step-down DC-DC regulator, J10
IDC header for access to 5 x high-speed data lanes (LVDS pairs), J7
4-wire PWM fan connector, J4
6-pin 12V power connector, J5
Reference clock generator @10.0 MHz (P5146) , U11
LDO DC-DC regulator @3.3V (LMK_3V3) (TI TPS74901RGWR), U21
256 Mbit Quad SPI Flash Memory (Micron N25Q256A), U12
Cooling fan 5VDC M1 (45X5MM, 0.7W, 1.06CFM)
System Controller CPLD (Lattice Semiconductor LCMXO2-1200HC), U5
Ultra low jitter clock synthesizer (TI LMK04828B), U9
Step-down DC-DC regulator @1.0V (LT LTM4676), U4
Step-down DC-DC regulator @1.5V (VCC1V5) (LT LTM4676, U3
I²C Programmable quad clock generator (Silicon Labs Si5338A), U13
4A PowerSoC DC-DC converter @1.8V (Altera EN6347QI, U20
LDO DC-DC regulator @1.0V (MGTAVCC_FPGA) (TI TPS74401RGW), U18
LDO DC-DC regulator @1.2V (MGTAVTT_FPGA) (TI TPS74401RGW), U17
4A PowerSoC DC-DC converter @3.3V (3V3FMC) (Altera EN6347QI), U15
4A PowerSoC DC-DC converter @1.8V (FMC_VADJ) (Altera EN6347QI), U7

Initial Delivery State

Storage device name	Content	Notes
SPI Flash OTP Area	Empty, not programmed	Except serial number programmed by flash vendor.
SPI Flash Quad Enable bit	Programmed	-
SPI Flash main array	Demo design	-
eFUSE USER	Not programmed	-
eFUSE Security	Not programmed	-

Table 1: Initial delivery state.

Signals, Interfaces and Pins

FMC Connector

The high-pin count (HPC) FMC (FPGA Mezzanine Card) connector (J2) is a standard ANSI/VITA 57.1 modular interface to the FPGA and provides access to numerous FPGA I/O pins for use by other mezzanine modules and expansion cards. The FMC connector supports single ended I/O (with several VCCIO voltages available) and LVDS I/O signaling.

The I/O signals are routed from the FPGA I/O banks to the FMC connector as LVDS pairs:

FPGA Bank	I/O Signals	LVDS pairs	Bank Voltage (VCCO)	Notes
Bank 19	92	46	1.8V	-
Bank 39	42	21	VIO_B_FMC	Bank voltage VIO_B_FMC must be supplied by FMC connector pins J2-J39, J2-K40. Bank's VREF_B_M2C signal is routed to the FMC connector pin J2-K1 (external reference voltage).
Bank 37	34	17	1.8V	Bank's VREF_A_M2C signal is routed to the FMC connector pin J2-H1 (external reference voltage).
Bank 38	34	17	1.8V	Bank's VREF_A_M2C signal is routed to the FMC connector pin J2-H1 (external reference voltage).

Table 2: Overview of the FPGA I/O bank signals routed to the FMC.

There are also 10 high-speed MGT lanes (Xilinx GTH transceivers) from different FPGA MGT banks routed to the FMC connector. Following MGT lanes are available on the FMC connector:

FPGA Bank

I/O Signals

LVDS Pairs

MGT Lanes

MGT Bank's Reference Clock

116

8

4

2

1 clock-signal from clock synthesizer U9 to bank's pins T6/T5.

117

16

8

4

2 clock-signals from clock FMC connector GBTCLK0_M2C and GBTCLK1_M2C (pins J2-D4/J2-D5 and J2-B20/J2-B21) to bank's pins M6/M5 and P6/P5.

118

16

8

4

1 reference clock from clock synthesizer U9 to bank's pins F6/F5

1 reference clock from programmable quad clock generator U13 to bank's pins H6/H5.

Table 3: Overview of MGT banks lanes routed to the FMC connector.

The FMC connector has also two reference clock input pairs (LVDS) routed to the FPGA MGT bank 117, see also section MGT lanes.

There are also JTAG, I²C interface and power good control signals routed between FMC connector and System Controller CPLD:

Interface

I/O Signals

Schematic Name / FMC Pin

Connected to

Notes

JTAG

5

FMC_TRST, pin D34

FMC_TCK, pin D29

FMC_TMS, pin D33

FMC_TDI, pin D30

FMC_TDO, pin D31

SC CPLD, bank 2

VCCIO: 3V3PCI.

I²C

2

FMC_SCL, pin C30

FMC_SDA, pin C31

SC CPLD, bank 2

VCCIO: 3V3PCI.

I²C-lines 3V3PCI pulled-up.

Control lines

3

FMC_PRSNT_M2C_L, pin H2

FMC_PG_C2M, pin D1 (3V3FMC pull-up)

FMC_PG_M2C, pin F1 (3V3FMC pull-up)

SC CPLD, bank 1

PG - Power Good signal.

C2M - carrier to mezzanine module.

M2C - mezzanine module to carrier.

Internal System Controller CPLD signal assignment:

FEX_0_N <= FMC_PG_M2C

FMC_PG_C2M <= FMC_PRSNT_M2C_L

Table 4: FMC connector pin-outs of available interfaces to the System Controller CPLD.

FPGA bank 17 and 18 clock inputs from FMC connector:

Schematic Name	FMC Connector Pins	FPGA Bank	FPGA Pins
CLK0_P, CLK0_N	H4, H5	17	R28, R29
CLK1_P, CLK1_N	G2, G3	17	P29, P30
CLK2_P, CLK2_N	K4, K5	18	G31, G31
CLK3_P, CLK3_N	J2, J3	18	H29, H30

Table 5: FMC connector pin-outs for reference clock input.

Several VCCIO voltages are available on the FMC connector for FPGA I/O banks:

Schematic Name	Max Current	FMC Connector Pins	Notes
12V	1A	C35, C37	Externally supplied 12V
3V3PCI	20mA	D32	Supplied by the PCIe interface
3V3FMC	3A	D36, D38, D40, C39	Supplied by DC-DC converter U15
VIO_B_FMC	External supply	J39, K40	Externally supplied VCCO to HB FPGA bank 39
FMC_VADJ	4A	H40, G39, F40, E39	Fixed to 1.8V, supplied by DC-DC converter U7

Table 6: Available VCCIO voltages on FMC connector.

PCI Express Interface

The TEC0330 FPGA board is a PCI Express card designed to fit into systems with PCI Express x8 slots (PCIe 2.0 or higher) and is PCIe Gen. 2 capable. See next section for the overview of FPGA MGT lanes routed to the PCIe interface.

MGT Lanes

MGT (Multi Gigabit Transceiver) lane consists of one receive and one transmit (RX/TX) differential pairs, four signals total per one MGT lane. Following table lists lane number, MGT bank number, transceiver type, signal schematic name, FMC connector pin connection and FPGA pin connection information.

FPGA to FMC Connector MGT lanes

Lane	FPGA Bank	Type	Signal Name	FPGA Pin	FMC Pin
0	117	GTH	DP0_M2C_P DP0_M2C_N DP0_C2M_P DP0_C2M_N	MGTHRXP0_117, N4 MGTHRXN0_117, N3 MGTHTXP0_117, M2 MGTHTXN0_117, M1	J2A-C6 J2A-C7 J2A-C2 J2A-C3
1	117	GTH	DP1_M2C_P DP1_M2C_N DP1_C2M_P DP1_C2M_N	MGTHRXP1_117, L4 MGTHRXN1_117, L3 MGTHTXP1_117, K2 MGTHTXN1_117, K1	J2A-A2 J2A-A3 J2A-A22 J2A-A23
2	117	GTH	DP2_M2C_P DP2_M2C_N DP2_C2M_P DP2_C2M_N	MGTHRXP2_117, K6 MGTHRXN2_117, K5 MGTHTXP2_117, H2 MGTHTXN2_117, H1	J2A-A6 J2A-A7 J2A-A26 J2A-A27
3	117	GTH	DP3_M2C_P DP3_M2C_N DP3_C2M_P DP3_C2M_N	MGTHRXP3_117, J4 MGTHRXN3_117, J3 MGTHTXP3_117, F2 MGTHTXN3_117, F1	J2A-A10 J2A-A11 J2A-A30 J2A-A31
4	118	GTH	DP4_M2C_P DP4_M2C_N DP4_C2M_P DP4_C2M_N	MGTHRXP0_118, G4 MGTHRXN0_118, G3 MGTHTXP0_118, D2 MGTHTXN0_118, D1	J2A-A14 J2A-A15 J2A-A34 J2A-A35

Table 8: FPGA to FMC connector MGT lanes overview (continue on next page).

FPGA to FMC Connector MGT lanes (continued)

Lane	FPGA Bank	Type	Signal Name	FPGA Pin	FMC Pin
5	118	GTH	DP5_M2C_P DP5_M2C_N DP5_C2M_P DP5_C2M_N	MGTHRXP1_118, E4 MGTHRXN1_118, E3 MGTHTXP1_118, C4 MGTHTXN1_118, C3	J2A-A18 J2A-A19 J2A-A38 J2A-A39
6	118	GTH	DP6_M2C_P DP6_M2C_N DP6_C2M_P DP6_C2M_N	MGTHRXP2_118, D6 MGTHRXN2_118, D5 MGTHTXP2_118, B2 MGTHTXN2_118, B1	J2A-B16 J2A-B17 J2A-B36 J2A-B37
7	118	GTH	DP7_M2C_P DP7_M2C_N DP7_C2M_P DP7_C2M_N	MGTHRXP3_118, B6 MGTHRXN3_118, B5 MGTHTXP3_118, A4 MGTHTXN3_118, A3	J2A-B12 J2A-B13 J2A-B32 J2A-B33
8	116	GTH	DP8_M2C_P DP8_M2C_N DP8_C2M_P DP8_C2M_N	MGTHRXP2_116, U4 MGTHRXN2_116, U3 MGTHTXP2_116, T2 MGTHTXN2_116, T1	J2A-B8 J2A-B9 J2A-B28 J2A-B29
9	116	GTH	DP9_M2C_P DP9_M2C_N DP9_C2M_P DP9_C2M_N	MGTHRXP3_116, R4 MGTHRXN3_116, R3 MGTHTXP3_116, P2 MGTHTXN3_116, P1	J2A-B4 J2A-B5 J2A-B24 J2A-B25

Table 8: FPGA to FMC connector MGT lanes overview.

FPGA to PCIe Connector MGT lanes

Lane	FPGA Bank	Type	Signal Name	FPGA Pin	PCIe Pin
0	115	GTH	PER0_P PER0_N PET0_P PET0_N	MGTHRXP3_115, AB2 MGTHRXN3_115, AB1 MGTHTXP3_115, AC4 MGTHTXN3_115, AC3	J1-A16 J1-A17 J1-B14 J1-B15
1	115	GTH	PER1_P PER1_N PET1_P PET1_N	MGTHRXP2_115, AD2 MGTHRXN2_115, AD1 MGTHTXP2_115, AE4 MGTHTXN2_115, AE3	J1-A21 J1-A22 J1-B19 J1-B20
2	115	GTH	PER2_P PER2_N PET2_P PET2_N	MGTHRXP1_115, AF2 MGTHRXN1_115, AF1 MGTHTXP1_115, AF6 MGTHTXN1_115, AF5	J1-A25 J1-A26 J1-B23 J1-B24
3	115	GTH	PER3_P PER3_N PET3_P PET3_N	MGTHRXP0_115, AH2 MGTHRXN0_115, AH1 MGTHTXP0_115, AG4 MGTHTXN0_115, AG3	J1-A29 J1-A30 J1-B27 J1-B28
4	114	GTH	PER4_P PER4_N PET4_P PET4_N	MGTHRXP3_114, AK2 MGTHRXN3_114, AK1 MGTHTXP3_114, AJ4 MGTHTXN3_114, AJ3	J1-A35 J1-A36 J1-B33 J1-B34
5	114	GTH	PER5_P PER5_N PET5_P PET5_N	MGTHRXP2_114, AM2 MGTHRXN2_114, AM1 MGTHTXP2_114, AL4 MGTHTXN2_114, AL3	J1-A39 J1-A40 J1-B37 J1-B38
6	114	GTH	PER6_P PER6_N PET6_P PET6_N	MGTHRXP1_114, AN4 MGTHRXN1_114, AN3 MGTHTXP1_114, AM6 MGTHTXN1_114, AM5	J1-A43 J1-A44 J1-B41 J1-B42
7	114	GTH	PER7_P PER7_N PET7_P PET7_N	MGTHRXP0_114, AP2 MGTHRXN0_114, AP1 MGTHTXP0_114, AP6 MGTHTXN0_114, AP5	J1-A47 J1-A48 J1-B45 J1-B46

Table 9: FPGA to PCIe connector MGT lanes overview.

Following table lists reference clock sources of the MGT banks.

Clock Signal	MGT Bank	Source	FPGA Pin	Notes
MGTCLK_5338_P	115	U13, CLK1A	MGTREFCLK0P_115, AB6	On-board Si5338A.
MGTCLK_5338_N	115	U13, CLK1B	MGTREFCLK0N_115, AB5	On-board Si5338A.
PCIE_CLK_P	115	J1-A13, REFCLK+	MGTREFCLK1P_115, AD6	External clock from PCIe slot.
PCIE_CLK_N	115	J1-A14, REFCLK-	MGTREFCLK1N_115, AD6	External clock from PCIe slot.
CLK_SYNTH_DCLKOUT4_P	116	U9, DCLKout4	MGTREFCLK0P_116, T6	On-board LMK04828B.
CLK_SYNTH_DCLKOUT4_N	116	U9, DCLKout4*	MGTREFCLK0N_116, T6	On-board LMK04828B.
GBTCLK0_M2C_P	117	J2-D4	MGTREFCLK0P_117, M6	External clock from FMC connector.
GBTCLK0_M2C_N	117	J2-D5	MGTREFCLK0N_117, M5	External clock from FMC connector.
GBTCLK1_M2C_P	117	J2-B20	MGTREFCLK1P_117, P6	External clock from FMC connector.
GBTCLK1_M2C_N	117	J2-B21	MGTREFCLK1N_117, P5	External clock from FMC connector.
CLK_SYNTH_SDCLKOUT7_P	118	U9, DCLKout7	MGTREFCLK0P_118,F6	On-board LMK04828B.
CLK_SYNTH_SDCLKOUT7_N	118	U9, DCLKout7*	MGTREFCLK0N_118,F5	On-board LMK04828B.
MGTCLK2_5338_P	118	U13, CLK3A	MGTREFCLK1P_118, H6	On-board Si5338A.
MGTCLK2_5338_N	118	U13, CLK3B	MGTREFCLK1N_118, H5	On-board Si5338A.

Table 10: MGT banks reference clock sources.

JTAG Interfaces

There are three JTAG interfaces available on the TEC0330 board:

JTAG Interface	Signal Schematic Name	JTAG Connector Pin	Connected to
CPLD JTAG VCCIO: 3V3PCI Connector: J8	CPLD_JTAG_TMS	J8-1	SC CPLD, bank 0, pin 90
	CPLD_JTAG_TDI	J8-2	SC CPLD, bank 0, pin 94
	CPLD_JTAG_TDO	J8-3	SC CPLD, bank 0, pin 95
	CPLD_JTAG_TCK	J8-4	SC CPLD, bank 0, pin 91

FPGA JTAG VCCIO: 1V8 Connector: J9	FPGA_JTAG_TMS	J9-4	FPGA, bank 0, pin N9
	FPGA_JTAG_TMS	J9-6	FPGA, bank 0, pin M8
	FPGA_JTAG_TCK	J9-8	FPGA, bank 0, pin N8
	FPGA_JTAG_TDI	J9-10	FPGA, bank 0, pin L8

FMC JTAG VCCIO: 3.3VPCI Connector: J2	FMC_TRST	J2-D34	SC CPLD, bank 2, pin 36
	FMC_TRST	J2-D29	SC CPLD, bank 2, pin 27
	FMC_TCK	J2-D33	SC CPLD, bank 2, pin 28
	FMC_TMS	J2-D30	SC CPLD, bank 2, pin 31
	FMC_TDO	J2-D31	SC CPLD, bank 2, pin 32

Table 11: JTAG interfaces on TEC0330 board.

On-board Peripherals

System Controller CPLD

The System Controller CPLD is the central system management unit that provides numerous interfaces between the on-board peripherals and to the FPGA module. The signals routed to the CPLD will be linked by the logic implemented in the CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. So some interfaces between the on-board peripherals and to the FPGA module are by-passed, forwarded and controlled by the System Controller CPLD.

Other tasks of the System Controller CPLD are the monitoring of the power-on sequence, the proper programing of the FPGA module and to display its programming state.

SC CPLD Bank	CPLD Bank's VCCIO
0	3V3PCI
1	3V3PCI
2	3V3PCI
3	1V8

Table 12: VCCIO voltages of CPLD banks.

Following table describes the interfaces and functionalities of the System Controller CPLD not described elsewhere in this TRM:

CPLD Functionality	Interface	Designated CPLD Pins	Connected to	Notes
I²C interface between on-board peripherals and FPGA	I²C	FPGA_IIC_SDA, pin 24 FPGA_IIC_SCL, pin 25 FPGA_IIC_OE, pin 19	FPGA bank 16, pin V29 FPGA bank 16, pin W29 FPGA bank 16, pin W26	VCCIO: 1V8, all with pull-up to 1V8. Following devices and connectors are linked to the FPGA_IIC I²C interface: DC-DC converter U3 and U4 (LT LTM4676) Programmable quad clock generator U13 FMC connector J2 PCIe connector J1 Note: FPGA_IIC_OE must kept high for I²C operation. For I²C slave device addresses refer to the component datasheets.
User I/Os External LVDS pairs	10 I/Os 5 x LVDS pairs	EX0_P ... EX4_P EX0_N ... EX4_N	IDC header J7	Can also be used for single-ended signaling.
User I/Os Internal LVDS pairs	13 I/Os 6 x LVDS pairs	FEX0_P ... FEX5_P FEX0_N ... FEX5_N FEX_DIR (single-ended I/O)	FPGA bank 18	VCCIO: 1V8 Can also be used for single-ended signaling. FPGA bank 18 has also reference clock input from FMC connector (CLK2, CLK3) and clock synthesizer U9 (FCLK). Internal signal assignment: FEX_DIR <= FMC_PRSNT_M2C_L
FPGA programming control and state	2 I/Os	DONE, pin 7 PROGRAM_B, pin 8	FPGA bank 0, pin V8 FPGA bank 0, pin U8	VCCIO: 1V8
I²C interface to programmable quad clock generator	I²C	PLL_SCL, pin 14 PLL_SDA, pin 15	U13, pin 12 U13, pin 19	VCCIO: 1V8 Only PLL_SDA has 1V8 pull-up.
Fan PWM control J4	2 I/Os	F1SENSE, pin 99 F1PWM, pin 98	J4-3 (active low) J4-4	Internal signal assignment: FEX_5_P <= F1SENSE FEX_5_N => F1PWM
Button S2	1 I/O	BUTTON, pin 77	Switch S2	Functionality depends on CPLD firmware, activating pin PROGRAM_B (active low) and LED1 in standard configuration.
LED1	1 I/O	LED1, pin 76	LED D1 (green)	Fast blinking, when FPGA is not programmed. Internal signal assignment: LED1 <= Button S2 or FEX0_P
PCIe control line RESET_B	1 I/O	PCIE_RSTB, pin 37	J1-A11	Internal signal assignment: FEX_4_N <= PCIE_RSTB
Control interface to clock synthesizer U9 (TI LMK04828B)	SPI (3 I/Os), 4 I/Os	CLK_SYNTH_SDIO, pin 75 CLK_SYNTH_SCK, pin 74 CLK_SYNTH_RESET, pin 54 CLK_SYNTH_CS, pin 53 CLK_SYNTH_SYNC, pin 52 LMK_STAT0, pin 62 LMK_STAT1, pin 63	U9, pin 20 U9, pin 19 U9, pin 5 U9, pin 18 U9, pin 6 U9, pin 31 U9, pin 48	Pull up to 3V3PCI. Internal signal assignment: LMK_SCK <= FEX_1_P LMK_SDIO <= FEX_1_N LMK_CS <= FEX_3_P LMK_SYNC <= EX_3_N LMK_RESET <= FEX_4_P FEX_2_P => LMK_SDIO (FEX_2_N must be 0) LMK_STAT0 and LMK_STAT1 signals are not used.
Control Interface to DC-DC converters U3 and U4 (both LTM4676)	I²C (2 I/Os), 2 I/Os	LTM_SCL, pin 67 LTM_SDA, pin 66 LTM1_ALERT, pin 65 LTM2_ALERT, pin 64	U4, pin E6 and U3, pin E6 U4, pin D6 and U3, pin D6 U4, pin E5 U3, pin E5	3V3 pull-ups. LTM I²C interface is also accessible trough header J10. LTM1_ALERT and LTM2_ALERT signals are not used.
Power-on sequence and monitoring	6 I/Os	EN_1V8, pin 58 PG_1V8, pin 59 EN_FMC_VADJ, pin 60 PG_FMC_VADJ, pin 61 EN_3V3, pin 51 PG_3V3, pin 57	U20, pin 27 U20, pin 28 U7, pin 27 U7, pin 28 U15, pin 27 U15, pin 28	Sequence of the supply voltages depend on the System Controller CPLD firmware. EN_1V8, EN_3V3 and EN_FMC_VADJ will be set simultaneously at start-up. PG signals will not be evaluated.

Table 13: Overview of the System Controller CPLD functions.

SO-DIMM Socket for DDR3 SDRAM

The TEC0330 board supports additional DDR3 SO-DIMM via 204-pin socket U2. The DDR3 memory interface is routed to the FPGA banks 34, 35 and 36.

The reference clock signal for the DDR3 interface is generated by the quad programmable clock generator U13 and is applied to the FPGA bank 35.

There is also a I²C interface between the System Controller CPLD and the DDR3 SDRAM memory:

Interface Signals Schematic Name	System Controller CPLD Pin	DDR3 Memory Interface Pin
DDR3_SDA	Bank 2, pin 48	Pin 200 (3V3PCI pull-up)
DDR3_SCL	Bank 2, pin 49	Pin 202 (3V3PCI pull-up)

Table 14: I²C-interface between SC CPLD and DDR3 SDRAM memory.

Quad SPI Flash Memory

An 256 Mbit (32 MByte) Quad SPI Flash Memory (Micron N25Q256A, U12) is provided for FPGA configuration file storage. After configuration process completes the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths to be used. The maximum data transfer rate depends on the bus width and clock frequency. The memory can be accessed indirectly by the FPGA JTAG port (J9) by implementing the functional logic for this purpose inside the FPGA.

Clock sources

The TEC0330 FPGA board has a sophisticated clock generation and conditioning system to meet the requirements of the Xilinx Virtex-7 GTH units with data transmission rates up to 13.1 Gb/s.

List of on-board and external reference clock signals of the TE0330 board:

Clock Source	Schematic Name	Frequency	Clock Destination
SMA coaxial connector, J3	CLK_SYNTH_CLKIN0_P, CLK_SYNTH_CLKIN0_N (GND)	User	Clock synthesizer U9, pins 37/38
RAKON P5146LF oscillator, U11	-	10.0 MHz	Clock synthesizer U9, pins 43/44
SiTime SiT8208 oscillator, U14	CLK_25MHz	25.0 MHz	Programmable quad clock generator U13, pin 3
FMC connector J2, pins H4/H5	CLK0_P, CLK0_N	User	FPGA bank 17, pins R28/R29
FMC connector J2, pins G2/G3	CLK1_P, CLK1_N	User	FPGA bank 17, pins P29/P30
FMC connector J2, pins K4/K5	CLK2_P, CLK2_N	User	FPGA bank 18, pins G30/G31
FMC connector J2, pins J2/J3	CLK3_P, CLK3_N	User	FPGA bank 18, pins H29/H30
FMC connector J2, pins D4/D5	GBTCLK0_M2C_P, GBTCLK0_M2C_N	User	FPGA bank 117, pins M6/M5
FMC connector J2, pins B20/B21	GBTCLK1_M2C_P, GBTCLK1_M2C_N	User	FPGA bank 117, pins P6/P5
PCIe interface J1, pins A13/A14	PCIE_CLK_P, PCIE_CLK_N	100 MHz (PCIe spec.)	FPGA bank 115, pins AD6/AD5

Table 15: Clock generator sources overview.

Programmable Clock Generator

There is a Silicon Labs I²C programmable quad clock generator Si5338A (U13) on-board. It's output frequencies are programmable via FPGA I²C interface using slave device address 0x70 (corresponding I²C logic has to be implemented in FPGA design).

A 25 MHz (U14) oscillator is connected to pin 3 (IN3) and is used to generate the output clocks.

Si5338A (U13) Input	Signal Schematic Name	Notes
IN1/IN2	CLKIN_5338_C_P, CLKIN_5338_C_N	Reference clock signal from clock synthesizer U9 (100 nF decoupling capacitors and 100Ω termination resistor).
IN3	Reference clock oscillator input, SiTime SiT8208AI (U14).	25.0 MHz fixed frequency.
IN4/IN6	Connected to the GND.	LSB (pin 'IN4') of the default I²C-adress 0x70 is zero.
IN5	Not connected	-
Si5338A (U13) Output	Signal Schematic Name	Notes
CLK0 A/B	DDR3_CLK_P, DDR3_CLK_N	DDR3-RAM reference clock signal to FPGA bank 35.
CLK1 A/B	MGTCLK_5338_C_P, MGTCLK_5338_C_N	Reference clock signal to FPGA bank 115 MGT (100 nF decoupling capacitors and 100Ω termination resistor).
CLK2 A/B	LMK_CLK_P, LMK_CLK_N	Input clock signal to clock synthesizer U9 (100 nF decoupling capacitors).
CLK3 A/B	MGTCLK2_5338_C_P, MGTCLK2_5338_C_N	Reference clock signal to FPGA bank 118 MGT (100 nF decoupling capacitors and 100Ω termination resistor).

Table 16: I/O pin description of programmable clock generator Si5338A.

Ultra low-noise high-performance clock synthesizer

The TEC0330 board utilizes an ultra low jitter clock synthesizer TI LMK04828B (U9) for conditioning and generating clean clock signals which are necessary for the GTH units of the Xilinx Virtex-7 FPGA module.

The clock synthesizer can be controlled and programmed by its SPI interface (SPI slave) and other control lines, which are routed to the FPGA module (SPI master) and by-passed trough the System Controller CPLD. See section 'System Controller CPLD' for more detailed information.

Logic needs to be generated inside the FPGA module to utilize SPI bus correctly.

LMK04828B (U9) input	signal schematic name	Note
Status_LD1, Status_LD2	LMK_STAT0, LMK_STAT1	Connected to System Controller CPLD, not implemented in current CPLD firmware.
SPI interface and control lines	see section 'System controller CPLD'	The clock synthesizer IC is accessible to the FPGA via the SPI interface and control lines, which are routed through the System Controller CPLD.
CLKin0, CLKin0*	CLK_SYNTH_CLKIN0_P, CLK_SYNTH_CLKIN0_N	Input reference clock signal via SMA coaxial connector J3, connected to CLKin0* via serial decoupling capacitor 100nF. CLKin0 to connected to GND via serial decoupling capacitor 100nF.
CLKin1, CLKin1*	CLK_SYNTH_CLKIN1_P, CLK_SYNTH_CLKIN1_N	Input reference clock signal from programmable quad clock generator Si5338A (U13) via serial decoupling capacitor 100nF.
OSCin, OSCin*	-	Signal from reference clock oscillator RAKON P51446LF, fixed to 10.0 MHz.
LMK04828B (U9) output	signal schematic name	Note
DCLKout0, DCLKout0*	CLK_SYNTH_DCLKOUT0_P, CLK_SYNTH_DCLKOUT0_N	Reference clock signal to FPGA bank 15 pins AD29/AE29.
SDCLKout1, SDCLKout1*	CLK_SYNTH_SDCLKOUT1_P, CLK_SYNTH_SDCLKOUT1_N	Reference clock signal to FPGA bank 15 pins AE31/AF31.
DCLKout2, DCLKout2*	CLKIN_5338_P, CLKIN_5338_N	Reference clock signal to programmable quad clock generator Si5338A (U13) (100 nF decoupling capacitors and 100Ω termination resistor).
DCLKout4, DCLKout4*	CLK_SYNTH_DCLKOUT4_P, CLK_SYNTH_DCLKOUT4_N	Reference clock signal to FPGA MGT bank 115, pins T6/T5.
SDCLKout7, SDCLKout7*	CLK_SYNTH_SDCLKOUT7_P, CLK_SYNTH_SDCLKOUT7_N	Reference clock signal to FPGA MGT bank 118, pins F6/F5.
OSCout0, OSCout0*	CLK_SYNTH_CLKIN2_P, CLK_SYNTH_CLKIN2_N	Reference clock signal to FPGA bank 18, pins J30/J31 (100 nF decoupling capacitors).

Table 17: Pin description of clock synthesizer TI LMK04828B.

Power and Power-On Sequence

Power Supply

6-pin 12V power connector J5 is the main power supply of the TEC0330 FPGA board, minimum current capability of 3A for system startup is recommended.

Power Consumption

Power Input	Typical Current
12V (J5)	TBD
3V3PCI (J1)	TBD

Table 18: Typical power consumption.

TBD - To Be Determined.

Power-On Sequence

The on-board voltages of the TEC0330 FPGA board are powered up in predefined sequence after the external voltages 12V on connector J5 and 3V3PCI on connector J1 become available.

Core voltages and main supply voltages have to reach stable state and their "Power Good" signals have to be asserted before other voltages like PL bank's I/O voltages can be powered up.

Following diagram describes the sequence of enabling the on-board voltages:

Figure 3: FPGA board TEC0330-03 power-on sequence diagram.

Bank Voltages

Bank	Schematic Name	Voltage	Range	Notes
0	1V8	1.8V	HP: 1.2V to 1.8V	Config bank (fixed to 1.8V) / JTAG interface.
14	1V8	1.8V	HP: 1.2V to 1.8V	QSPI flash memory interface.
15	1V8	1.8V	HP: 1.2V to 1.8V	Reference clock input.
16	1V8	1.8V	HP: 1.2V to 1.8V	I²C interface of FPGA.
17	1V8	1.8V	HP: 1.2V to 1.8V	Reference clock input.
18	1V8	1.8V	HP: 1.2V to 1.8V	Reference clock input / I/O's to CPLD.
34	VCC1V5	1.5V	HP: 1.2V to 1.8V	DDR3 memory interface.
35	VCC1V5	1.5V	HP: 1.2V to 1.8V	DDR3 memory interface.
36	VCC1V5	1.5V	HP: 1.2V to 1.8V	DDR3 memory interface.
114 115 116 117 118	MGTAVCC_FPGA MGTVCCAUX_FPGA MGTAVTT_FPGA	1.0V 1.8V 1.2V	MGT bank supply voltage MGT bank auxiliary supply voltage MGT bank termination circuits voltage	MGT banks with Xilinx GTH transceiver units.
19	1V8	1.8V	HP: 1.2V to 1.8V	I/Os routed to FMC, usable as LVDS pairs.
37	1V8	1.8V	HP: 1.2V to 1.8V	I/Os routed to FMC, usable as LVDS pairs.
38	1V8	1.8V	HP: 1.2V to 1.8V	I/Os routed to FMC, usable as LVDS pairs.
39	VIO_B_FMC	user	HP: 1.2V to 1.8V	I/Os routed to FMC, usable as LVDS pairs.

Table 19: Range of FPGAs bank voltages.

See Xilinx Virtex-7 datasheet (DS183) for the voltage ranges allowed.

Power Rails

Connector / Pin	Voltage	Direction	Notes
J4, pin 2	12V (filtered)	Output	4-wire PWM fan connector supply voltage
J6, pin 2	5V (filtered)	Output	Cooling fan M1 supply voltage
J8, pin 6	3V3PCI	Output	VCCIO CPLD JTAG
J9, pin 2	1V8	Output	VCCIO FPGA JTAG
J2, pin C35 / C37	12V	Output	VCCIO FMC
J2, pin D32	3V3PCI	Output	VCCIO FMC
J2, pin D36 / D38 / D39 / D40	3V3FMC	Output	VCCIO FMC
J2, pin H1	VREF_A_M2C	Input	VREF voltage for bank 37 / 38
J2, pin K1	VREF_B_M2C	Input	VREF voltage for bank 39
J2, pin J39 / J40	VIO_B_FMC	Input	PL I/O voltage bank 39 (VCCO)
J2, pin H40 / G39 / F40 / E39	FMC_VADJ	Output	VCCIO FMC (fixed to 1.8V)
J1, pin A10 / A11 / B8	3V3PCI	Input	PCIe interface supply voltage
J5, pin 1 / 2 / 3	12V	Input	Main power supply connector

Table 20: Power rails and corresponding connectors of the FPGA board.

Technical Specifications

Absolute Maximum Ratings

Parameter	Min	Max	Units	Notes	Notes
12V power supply voltage	11.4	12.6	V	12V ± 5 %	ANSI/VITA 57.1 FPGA Mezzanine Card (FMC) standard
PL I/O voltage for HP banks	-0.55	VCCO_X + 0.55	V	-	Xilinx datasheet DS183
GTH transceivers	-0.5	1.26	V	-	Xilinx datasheet DS183
Voltage on System Controller CPLD pins	-0.3	3.6	V	-	MachXO2 family datasheet
Storage temperature	-55	+125	°C	-	MachXO2 family datasheet

Table 21: Absolute maximum ratings.

Recommended Operating Conditions

Parameter	Min	Max	Units	Notes	Reference Document
12V power supply voltage	11.4	12.6	V	12V ± 5 %	ANSI/VITA 57.1 FPGA Mezzanine Card (FMC) standard
PL I/O voltage for HP banks	-0.2	VCCO_X + 0.2	V	-	Xilinx datasheet DS183
GTH transceivers	(*)	(*)	-	-	Xilinx datasheet DS183
Voltage on System Controller CPLD pins	3.135	3.6	V	-	MachXO2 family datasheet

Table 22: Recommended operation conditions.

Check Xilinx datasheet (DS183) for complete list of absolute maximum and recommended operating ratings.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

The FPGA board's operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Physical Dimensions

board size: 106,65mm × 167,65mm
Mating height with standard FMC connectors: 10 mm
PCB thickness: 1.65 mm

All dimensions are given in millimeters.

Figure 4: Physical dimensions of the TEC0330-03 board.

Hardware Revision History

Date	Revision	Notes	PCN	Documentation
-	03	First production release	-	-
2015-11-05	02	Prototype	-	-
-	01	Prototype	-	-

Table 23: Hardware revision history.

Hardware revision number is printed on the PCB board together with the model number separated by the dash.

Figure 5: TE0330 board hardware revision number.

Document Change History

Date	Revision	Contributors	Description
Error rendering macro 'page-info' Ambiguous method overloading for method jdk.proxy244.$Proxy3578#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject]		Jan Kumann	MGT Lanes section added. MGT banks clock sources table added. Fixed signal names in JTAG section. On-board peripherals section added. Weight section removed.
2017-08-30	v.15	Jan Kumann	Block diagram changed. Physical dimensions image changed. New product images. Corrections in content. Template revision added.
2017-03-15	v.3	Ali Naseri	Initial TRM release.

Table 24: Document change history.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.

Error rendering macro 'page-info'

Ambiguous method overloading for method jdk.proxy244.$Proxy3578#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject]

Trenz Electronic Documentation

TEC0330 TRM

Overview

Key Features

Block Diagram

Main Components

Initial Delivery State

Signals, Interfaces and Pins

FMC Connector

PCI Express Interface

MGT Lanes

JTAG Interfaces

On-board Peripherals

System Controller CPLD

SO-DIMM Socket for DDR3 SDRAM

Quad SPI Flash Memory

Clock sources

Programmable Clock Generator

Ultra low-noise high-performance clock synthesizer

Power and Power-On Sequence

Power Supply

Power-On Sequence

Bank Voltages

Power Rails

Technical Specifications

Absolute Maximum Ratings

Recommended Operating Conditions

Operating Temperature Ranges

Physical Dimensions

Hardware Revision History

Document Change History

Disclaimer

Data Privacy

Document Warranty

Limitation of Liability

Copyright Notice

Technology Licenses

Environmental Protection

REACH, RoHS and WEEE