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Overview

The Trenz Electronic TEG2000 is a FPGA module integrating a CologneChip GateMate FPGA, a QSPI Flash, level shifter, LEDs and several clocking and power components necessary for all on-board voltages. Numerous configurable I/Os are provided via rugged high-speed strips. All this on a tiny footprint, smaller than a credit card size at a very competitive price. All Trenz Electronic SoMs in 4 x 5 cm form factor are mechanically compatible.

Refer to http://trenz.org/teg2000-info for the current online version of this manual and other available documentation.

Key Features

  • SoC/FPGA/Module
    • CologneChip GateMate A1 / A2 / A4 1)
    • performance mode: economy, speed 1)
    • Temperature range: industrial (-20°C to 85°C)
  • RAM/Storage
    • 16 MByte QSPI Flash 2) 
  • On Board
    • Oscillator

    • 3 x LED

    • Level shifter
  • Interface
    • 2 x B2B Connector (LSHM)

    • Configuration via Flash on board, USB or JTAG
    • 2.5 Gb/s SerDes interface
    • 2 x B2B Connector (LSHM)
      • up to 130 single ended IO / up to 57 differential pairs
      • JTAG
  • Power
    • 3.3 V power supply via B2B Connector needed

  • Dimension
    • 40 x 50 mm
  • Notes
    1) Please, take care of the possible assembly options. 
    2) Up to 16 MByte are possible.

Block Diagram

TEG2000 block diagram

Main Components


TEG2000 main components
  1. CologneChip GateMate FPGA, U1
  2. QSPI Flash, U5
  3. Power Switch, Q1
  4. DCDC, U7, U8
  5. Power Monitor, U9
  6. Oscillator, U10, U3
  7. LEDs, D1, D2, D3
  8. B2B connector, JM2, JM1
  9. Level shifter, U2
  10. Optional additional Flash, U4
  11. BUS-Transceiver, U6

Initial Delivery State

Storage device name

Content

Notes

Quad SPI Flash

Blinky Demo Design

U5

Initial delivery state of programmable devices on the module

Signals, Interfaces and Pins

Connectors

Connector TypeDesignatorInterfaceIO CNTNotes
B2B JM1SerDes8
B2B JM1GPIO48Bank NB/EB/EA, powered by VCCIOA
B2B JM1GPIO6up to 3.3V due to level shifter, connected to Bank SB
B2B JM1GPIO6up to 1.8V, also connected to Bank SB
B2B JM1configuration Signals3EN1, PGOOD , MODE
B2B JM2GPIO50Bank NA/WB/WC, powered by VCCIOD
B2B JM2GPIO18Bank SA, powered by VCCIOC
B2B JM2JTAG40..3.3VIN
B2B JM2MR1low active Reset
B2B JM1CLKDIFF CLK
Board Connectors


Test Points

Test PointSignalSideNotes1)
TP1NA_6_N TP1topFPGA IO
TP2NA_6_PtopFPGA IO
TP3NB_B3topFPGA IO
TP4NB_A3topFPGA IO
TP51Vbottom1V power rail
TP6DONEbottomFPGA CFG_DONE pin
TP7PROG_BbottomFPGA RST_N pin
TP8GNDbottom
TP9GNDbottom
TP101Vtop1V power rail
TP111.8V topOUT, 1.8V power rail
TP12VINtopVIN (3.3 - 5.0V)
TP133.3VINtop
TP143.3VtopOUT, 3.3V power rail
TP15VCCIOAtopIN 1.1V ... 2.7V, powers IO Banks NB/EB/EA
TP16VCCIOCtopIN 1.1V ... 2.7V, powers IO Bank SA
TP17VCCIODtopIN 1.1V ... 2.7V, powers IO Banks NA/WB/WC
TP18DONEtopFPGA CFG_DONE pin
TP19PROG_BtopFPGA RST_N pin
TP20GNDtop
TP21GNDtop
TP22FAILED_nbottomFPGA CFG_FAILED pin
TP23FAILED_ntopFPGA CFG_FAILED pin

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.
Test Points Information

On-board Peripherals

Chip/InterfaceDesignatorConnected ToNotes

QSPI Flash

U5FPGA Bank CFG WASPIx4 Interface for FPGA configuration

Oscillator

U3FPGA Bank SB, Pin IO_SB_A825 MHz

Oscillator

U10JM1.16, JM1.18differential 100 MHz Clock for Gigabit-Transceiver
On board peripherals

Configuration and System Control Signals

Connector+Pin

Signal Name

Direction1)Description
JM1.28EN1INactivates DC-DCs
JM1.30PGOODOUTOutput from power monitor
JM1.32MODEINconfiguration mode -
0 → JTAG or 1 → SPI active Mode
JM2.18MRINlow active Reset connected to the Power Monitor that triggers PROG_B (FPGA RST_N)

JM2.93 / JM2.95 /

JM2.97 / JM2.99

TMS / TDI / TDO / TCKSignal-dependent

JTAG configuration and debugging interface.

JTAG reference voltage: 3.3V

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.

Power and Power-On Sequence


Power Rails

Power Rail Name/ Schematic NameConnector + PinDirection1)Notes
VINJM1.1 / JM1.3 / JM1.5 / JM2.2 / JM2.4 / JM2.6 / JM1.8 IN3.3 V - 5.0V, Micromodule Power
3.3VINJM1.13 / JM1.15INMicromodule Power
VCCIOAJM1.9 / JM1.11IN
VCCIOCJM2.5IN
VCCIODJM2.7 / JM2.9IN
3.3V

JM2.10 / JM2.12 / JM2.91

OUTPower for Carrier, powers on module the level shifter, LEDs and control Pins
1.8VJM1.39OUTPower for Carrier, On module it powers the Flash, FPGA VDD and Banks SB,WA
1V----Powers the FPGA core, PLLs and SerDes interface

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.
Module power rails.

Recommended Power up Sequencing


SequenceNet nameRecommended Voltage RangePull-up/downDescriptionNotes
0---Configuration signal setup.See Configuration and System Control Signals.
1VIN3.3 V - 5.0 V (± 5 %)-Main power supply
1EN1-PU 1), 3.3VINpower enable
1PGOOD-PU 1), 3.3Vpower good status.
23.3VIN3.3 V (± 5 %)-Main power supplyMain module power supply. 0.5 A minimum. Power consumption depends mainly on design and cooling solution.
3VCCIOA, VCCIOC, VCCIOD1.1 V - 2.7 V-Bank Voltages1.8 V on TE0703 Carrier

1) (on module)

Baseboard Design Hints

Board to Board Connectors

These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.

4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.

  • 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
  • 1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)
Connector Mating height

When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height

Order numberConnector on baseboardcompatible toMating height
23836REF-189016-01LSHM-150-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-150-03.0-L-DV-A-S-K-TRLSHM-150-03.0-L-DV-A-S-K-TR7.0 mm
23838REF-189016-02LSHM-150-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-150-06.0-L-DV-A-S-K-TRLSHM-150-06.0-L-DV-A-S-K-TR10.0mm
26125REF-189017-01LSHM-130-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-130-03.0-L-DV-A-S-K-TRLSHM-130-03.0-L-DV-A-S-K-TR7.0 mm
24903 REF-189017-02LSHM-130-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-130-06.0-L-DV-A-S-K-TRLSHM-130-06.0-L-DV-A-S-K-TR10.0mm
Connectors.

The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
12 mm, Single-Ended7.5 GHz / 15 Gbps
12 mm, Differential

6.5 GHz / 13 Gbps

5 mm, Single-Ended11.5 GHz / 23 Gbps
5 mm, Differential7.0 GHz / 14 Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total


Manufacturer Documentation

  File Modified
PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report 07 04, 2016 by Thorsten Trenz
PDF File lshm_dv.pdf LSHM catalog page 07 04, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing 07 04, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189016-01.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189016-02.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189017-01.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189017-02.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report 07 04, 2016 by Thorsten Trenz
PDF File tc0929--2611_qua(1).pdf Shock and vibration report 07 04, 2016 by Thorsten Trenz




Technical Specifications

Absolute Maximum Ratings *)

Power Rail Name/ Schematic NameDescriptionMinMaxUnit
VINMicromodule Power-0.36.5V
3.3VINMicromodule Power-0.36.5V
VCCIOABank NB/EB/EA voltage-2.75V
VCCIOC Bank SA voltage-2.75V
VCCIODBank NA/WB/WC voltage-2.75V
Absolute maximum ratings

*) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these
   or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

This TRM is generic for all variants. Temperature range can be differ depending on the assembly version.  Voltage range is mostly the same during variants (exceptions are possible, depending on custom request)

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

  • Variants of modules are described here: Article Number Information
  • Modules with commercial temperature grade are equipped with components that cover at least the range of 0°C to 75°C
  • Modules with extended temperature grade are equipped with components that cover at least the range of 0°C to 85°C
  • Modules with industrial temperature grade are equipped with components that cover at least the range of -40°C to 85°C
  • The actual operating temperature range will depend on the FPGA / SoC design / usage and cooling and other variables.


ParameterMinMaxUnitsReference Document
VIN3,1355,25V
3.3VIN3,1353,465V
VCCIOA1.12.75V
VCCIOC 1.12.75V
VCCIOD1.12.75V
Recommended operating conditions.


Physical Dimensions

  • Module size: 40 mm × 50 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 8 mm.

PCB thickness: 1.4 mm.

All dimensions are shown in millimeters.


Physical Dimension

Currently Offered Variants 

Trenz shop TEG2000 overview page
English pageGerman page
Trenz Electronic Shop Overview

Revision History

Hardware Revision History

Board hardware revision number.


DateRevisionChangesDocumentation Link
-REV01

First Production Release

REV01
Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Document Change History

DateRevisionContributorDescription

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  • initial revision

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all

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Document change history.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.


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