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Table of Contents
Overview
The Trenz Electronic TEI0015 is a commercial-grade, low cost and small size module integrated with Intel® MAX 10. Intel MAX 10 devices are the ideal solution for system management, I/O expansion, communication control planes, industrial, automotive, and consumer applications.
Refer to http://trenz.org/tei0015-info for the current online version of this manual and other available documentation.
Key Features
Intel® MAX 10 Commercial [10M08SAU169C8G]
Package: UBGA-169
Speed Grade: C8 (Slowest)
Temperature: 0°C to 85°C
Package compatible device 10M08...10M16 as assembly variant on request possible
SDRAM Memory up to 32 Mbyte (8Mbyte default)
USB 2.0 Multipurpose UART/FIFO IC (FT2232H)
- 4 Kbit EEPROM Memory for FTDI configuration data
- Micro USB Receptacle (communication and power)
SPI Flash - NOT INSTALLED (only special option)
- 8x User LED
- 18 Bit 2MSPS Analog to Digital Converter
2x SMA Female Connector
I/O interface: 23x GPIO - Arduino MKR compatible
Power Supply: 5V
Dimension: 86.5mm x 25mm
Others:
Instrumentation Amplifier
Differential Amplifier
Operational Amplifier
Block Diagram
TEI0015 block diagram
Main Components
TEI0015 main components
SMA Connector, J5...6
Amplifier, U12 - U14 - U6
Voltage Reference, U8
Analog to Digital Converter, U15
Voltage Regulator, U10 - U13 - U16
Switching Voltage Regulator/LDO, U11 - U4
SDRAM Memory, U2
- Intel® MAX 10 FPGA, U1
SPI Flash Memory, U5
12.00 MHz MEMS oscillator, U7
FTDI USB2 to JTAG/UART adapter, U3
User LEDs, D2...9
FTDI configuration EEPROM, U9
Configuration/Status LED (Red) , D10
Power-on LED (Green), D1
Push button, S1...2
Micro USB Connector, J9
1x14 pin header, J2 (Not assembled)
1x6 pin header, J4 (Not assembled)
1x4 Header, J3 (Not assembled)
1x14 pin header, J1 (Not assembled)
Initial Delivery State
Storage device name | Content | Notes |
|---|---|---|
Quad SPI Flash | N/A | Not populated |
| EEPROM | Programmed | FTDI configuration |
Initial delivery state of programmable devices on the module
Configuration Signals
The FPGA configuration for Intel MAX 10 FPGAs can be stored through JTAG interface (using a *.POF file) on the FPGA itself since the Intel MAX 10 FPGA offers non-volatile configuration memory on chip. The FPGA configuration is loaded from the non-volatile memory when the board is powered up. To configure the FPGA directly, the JTAG interface can be used to configure the FPGA volatile (using a *.SOF file), means the configuration is lost after power off.
FPGA Reconfigration can be triggered by pressing push button S1.
Signal | Push Button | Pin Header | Note |
|---|---|---|---|
RESET | S1 | J2 | Connected to nCONFIG |
Reset process.
Signals, Interfaces and Pins
I/Os on Pin Headers and Connectors
| FPGA Bank | Connector Designator | I/O Signal Count | Voltage Level | Notes |
|---|---|---|---|---|
| Bank 1A | J1 | 7 | 3.3V | AIN0...6 |
| Bank 1B | J4 | 5 | 3.3V | JTAG interface |
| Bank 2 | J1 | 4 | 3.3V | DIO2...5 |
| Bank 5 | J2 | 9 | 3.3V | DIO6...14 |
| J1 | 2 | 3.3V | DIO0...1 | |
| Bank 8 | J2 | 1 | 3.3V | RESET |
General I/Os to Pin Headers and connectors information
FPGA I/O Banks
| FPGA Bank | I/O Signal Count | Connected to | Notes |
|---|---|---|---|
| Bank 1A | 7 | 1x14 Pin header, J1 | AIN0...6 |
| 1 | Jumper, J3 | AIN7 | |
| Bank 1B | 5 | 1x6 Pin header, J4 | JTAG_EN, TDI, TDO, TMS, TCK |
| Bank 2 | 4 | 1x14 Pin header, J1 | D2...5 |
| 5 | A2D, U15 | ADC_EN, ADC_SDI, ADC_SDO, ADC_SCK, ADC_CNV | |
| 1 | 12MHz Oscillator, U7 | CLK12M | |
| 2 | Amplifier, U12 | nIAMP_A0, nIAMP_A1 | |
| Bank 3 | 22 | SDRAM, U2 | RAM_ADDR_CMD |
| Bank 5 | 9 | 1x14 Pin header, J2 | DIO6...14 |
| 2 | 1x14 Pin header, J1 | DIO0...1 | |
| 1 | D12_R | DIO12 | |
| Bank 6 | 16 | SDRAM, U2 | DQ0...15 |
| 2 | SDRAM, U2 | DQM0...1 | |
| 1 | D11_R | DIO11 | |
| Bank 8 | 8 | User Red LEDs, D2...9 | LED0...7 |
| 6 | SPI Flash, U5 | F_CS, F_CKL, F_DI, F_DO, nSTATUS, DEVCLRn | |
| 1 | Red LED, D10 | CONF_DONE | |
| 6 | FTDI JTAG/UART Adapter, U3 | BDBUS0...5 | |
| 1 | Push Button, S2 | USER_BTN |
FPGA I/O Banks
Micro-USB Connector
The Micro-USB connector J9 provides an interface to access the FIFO/UART and JTAG functions via FTDI FT2232 chip. The use of this feature requires that FTDI USB drivers are installed on your host PC.
| Pins | Connected to | Note |
|---|---|---|
| VBUS | USB_VBUS | |
| D+ | FTDI FT2232H U3, DP pin | |
| D- | FTDI FT2232H U3, DM pin |
Micro USB-2 connector pins
JTAG Interface
JTAG access to the TEI0015 SoM through pin header connector J4. This is normally not needed as there is on-board USB JTAG functionality.
JTAG Signal | Pin Header Connector | Note |
|---|---|---|
| TMS | J4-6 | |
| TDI | J4-5 | |
| TDO | J4-4 | |
| TCK | J4-3 | |
| JTAG_EN | J4-2 | Pulled-up to 3.3V |
JTAG pins connection
On-board Peripherals
| Chip/Interface | Designator | Notes |
|---|---|---|
| 77530153 | U2 | |
| FTDI FT2232H | U3 | JTAG/UART/FIFO |
| SPI Flash | U5 | |
| 77530153 | U9 | |
| Oscillator | U7 | 12 MHz clock source |
| 77530153 | U12, U14 | Analog to Digital Converter |
| Push Buttons | S1...2 | |
| 8x User LEDs | D2...9 | Red LEDs |
On board peripherals
SDRAM
TEI0015 is equipped with a Winbond 64 MBit (8 MByte) SDRAM chip in standard configuration, variants with 256 Mbit (32 MByte) memory density are also available. The SDRAM chip is connected to the FPGA bank 3 and 6 via 16-bit memory interface with 166MHz clock frequency and CL3 CAS latency.
| SDRAM I/O Signals | Signal Schematic Name | Connected to | Notes |
|---|---|---|---|
| Address inputs | A0 ... A13 | bank 3 | - |
| Bank address inputs | BA0 / BA1 | bank 3 | - |
| Data input/output | DQ0 ... DQ15 | bank 6 | - |
| Data mask | DQM0 ... DQM1 | bank 6 | - |
| Clock | CLK | bank 3 | - |
| Control Signals | CS | bank 3 | Chip select |
CKE | bank 3 | Clock enable | |
RAS | bank 3 | Row Address Strobe | |
CAS | bank 3 | Column Address Strobe | |
| WE | bank 3 | Write Enable |
SDRAM interface IOs and pins
FTDI FT2232H
The FTDI chip U3 converts signals from USB2 to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the features of the FT2232H chip. FTDI FT2232H chip channel A is used in MPPSE mode for JTAG. Channel B is configured to be used in async FIFO mode, this is default mode when using preprogrammed FTDI configuration. In this mode the communication from host PC looks like normal UART but from the FTDI side it is 8 bit FIFO style interface.
The configuration of FTDI FT2232H chip is pre-programmed in the EEPROM U9.
| FTDI Chip U3 Pin | Signal Schematic Name | Connected to | Notes |
|---|---|---|---|
| ADBUS0 | TCK | FPGA bank 1B, pin G2 | JTAG interface |
| ADBUS1 | TDI | FPGA bank 1B, pin F5 | |
| ADBUS2 | TDO | FPGA bank 1B, pin F6 | |
| ADBUS3 | TMS | FPGA bank 1B, pin G1 | |
| BDBUS0 | BDBUS0 | FPGA bank 8, pin A4 | User configurable |
| BDBUS1 | BDBUS1 | FPGA bank 8, pin B4 | User configurable |
| BDBUS2 | BDBUS2 | FPGA bank 8, pin B5 | User configurable |
| BDBUS3 | BDBUS3 | FPGA bank 8, pin A6 | User configurable |
| BDBUS4 | BDBUS4 | FPGA bank 8, pin B6 | User configurable |
| BDBUS5 | BDBUS5 | FPGA bank 8, pin A7 | User configurable |
| BDBUS6 | BDBUS6 | FPGA bank 6, pin C11 | |
| BDBUS7 | BDBUS7 | FPGA bank 3, pin J7 | |
| BCBUS0 | BCBUS0 | FPGA bank 5, pin J9 | |
| BCBUS1 | BCBUS1 | FPGA bank 3, pin K5 | |
| BCBUS2 | BCBUS2 | FPGA bank 3, pin L4 | |
| BCBUS3 | BCBUS3 | FPGA bank 3, pin L5 | |
| BCBUS4 | BCBUS4 | FPGA bank 3, pin N12 |
FTDI chip interfaces and pins
SPI Flash
Optional SPI flash device maybe assembled in custom variants, normally it is not populated.
| Signal Schematic Name | Connected to | Notes |
|---|---|---|
| F_CS | FPGA bank 8, pin B3 | Chip select |
| F_CLK | FPGA bank 8, pin A3 | Clock |
| F_DI | FPGA bank 8, pin A2 | Data in / out |
| nSTATUS | FPGA bank 8, pin C4 | Data in / out, configuration dual-purpose pin of FPGA |
| DEVCLRN | FPGA bank 8, pin B9 | Data in / out, configuration dual-purpose pin of FPGA |
| F_DO | FPGA bank 8, pin B2 | Data in / out |
Quad SPI Flash memory interface
EEPROM
The configuration of FTDI FT2232H chip is pre-programmed in the EEPROM U9.
| Schematic | Connected to | Notes |
|---|---|---|
EECS | FTDI U3, Pin EECS | |
| EECLK | FTDI U3, Pin EECLK | |
| EEDATA | FTDI U3, Pin EEDATA |
I2C EEPROM interface MIOs and pins
ADC
The TEI0015 board is equipped with the Analog Devices AD4003BCPZ-RL7 18-bit 2MSPS ADC.
| Pins | Connected to | Notes |
|---|---|---|
IN+ | Diff Amplifier U14, VOUT- | |
| IN- | Diff Amplifier U14, VOUT+ | |
| SDI | FPGA, bank 2, pin M2, ADC_SDI | |
| SDO | FPGA, bank 2, pin M1, ADC_SDO | |
| SCK | FPGA, bank 2, pin N3, ADC_SCK | |
| CNV | FPGA, bank 2, pin N2, ADC_CNV |
A2D converter interface and pins
LEDs
| Designator | Color | Connected to | Active Level | Note |
|---|---|---|---|---|
| D2...9 | Red | LED1...8 | Active High | User LEDs |
| D10 | Red | CONF_DONE | Active Low | Configuration DONE LED |
| D1 | Green | 3.3V | Active High | After power on it will be on. |
On-board LEDs
Push Bottuns
| Designator | Connected to | Functionality | Note |
|---|---|---|---|
| S1 | RESET | General reset | |
| S2 | USER_BTN | User push button | Connected to FPGA Bank 8. |
On-board Push Buttons
Clock Sources
| Clock Source | Schematic Name | Frequency | Note |
|---|---|---|---|
| MEMS Oscillator, U7 | CLK12M | 12.00 MHz | Connected to FTDI FT2232 U3, pin 3. Connected to FPGA SoC bank 2, pin H6. |
Osillators
Power and Power-On Sequence
Power Supply
The module is power supplied from USB (optionally via unpopulated pin header).
Power Consumption
| FPGA | Typical Current |
|---|---|
| Intel MAX 10 10M08 FPGA | TBD* |
Power Consumption
* TBD - To Be Determined
Actual power consumption depends on the FPGA design and ambient temperature.
Power Distribution Dependencies
Power Distribution
Power-On Sequence
There is no specific or special power-on sequence, just one single power source is needed. After power on the green LED (D1) will be on.
Power Rails
| Power Rail Name | Connector J2 Pin | Connector J9 Pin | Direction | Notes |
|---|---|---|---|---|
| VIN | J2-13 | - | Input | 5 V - Pin Header |
| 3.3V | J2-12 | - | Output | |
| 5V | J2-14 | - | Output | |
USB_VBUS | - | J9-1 | Input | 5 V - USB Connector |
Module power rails.
Bank Voltages
Bank | Schematic Name | Voltage | Notes |
|---|---|---|---|
| Bank 1A | VCCIO1A | 3.3V | |
| Bank 1B | VCCIO1B | 3.3V | |
| Bank 2 | VCCIO2 | 3.3V | |
| Bank 3 | VCCIO3 | 3.3V | |
| Bank 5 | VCCIO5 | 3.3V | |
| Bank 6 | VCCIO6 | 3.3V | |
| Bank 8 | VCCIO8 | 3.3V |
Intel MAX 10 SoC bank voltages.
Technical Specifications
Absolute Maximum Ratings
| Symbols | Description | Min | Max | Unit | Reference Document |
|---|---|---|---|---|---|
VIN | Supply voltage | 4.75 | 5.25 | V | |
| CH1-, CH1+ | Analog input voltage on amplifier U12 pin 1, 10 | -30 | 30 | V | AD8251 datasheet |
T_STG | Storage Temperature | -25 | +85 | °C |
Absolute maximum ratings
Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
| Symbols | Min | Max | Unit | Reference Document |
|---|---|---|---|---|
VIN supply voltage (5.0V nominal) | 4.75 | 5.25 | V | |
| Analog input voltage on amplifier U12 pin 1 (CH1-), 10 (CH1+) | -10 | 10 | V | AD8251 datasheet |
T_OP | 0 | +70 | °C | W9864G6JT-6 datasheet |
Recommended operating conditions.
Physical Dimensions
Module size: 25 mm × 86.5 mm. Please download the assembly diagram for exact numbers.
PCB thickness: 1.22 mm.
Physical Dimension
Currently Offered Variants
| Trenz shop TEI0015 overview page | |
|---|---|
| English page | German page |
Trenz Electronic Shop Overview
Revision History
Hardware Revision History
| Date | Revision | Changes | Documentation Link |
|---|---|---|---|
| 2019-02-11 | 01 | - | REV01 |
Hardware Revision History
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Board hardware revision number.
Document Change History
| Date | Revision | Contributor | Description |
|---|---|---|---|
| |||
2020-02-04 | v.98 | ED |
|
-- | all |
|
Document change history.
Disclaimer
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Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
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