The FPGA industrial micromodule integrates a leading edge Xilinx Spartan-3E FPGA, an USB 2.0 microcontroller, configuration Flash, DDR SDRAM and power supplies on a tiny footprint. A large number of configurable I/Os are provided via B2B mini-connectors.

The module is intended to be used as an OEM board, or to be combined with our carrier boards. It is a powerful system widely used for educational and research activities.

Boards with other configurations, larger FPGA's or equipped with industrial temperature grade parts are available on request.

Software for SPI flash programming over USB as well as reference designs for high speed data transfer over USB are included.

 

model

gates
[M]

block-RAM
[kbit]

clock
[MHz]

DDR RAM
[Mbit]

temp.
range

TE0300-01M

1.2

504

125

512

comm.

TE0300-01BM

1.6

648

125

512

comm.

TE0300-01BMLP

1.6

648

100

512

comm.

TE0300-01NR

1.2

504

125

-

comm.

TE0300-01I

1.2

504

125

512

ind.

TE0300-01IBM

1.6

648

125

512

ind.

TE0300-01IBMLP

1.6

648

100

512

ind.

abbreviations:

  • comm. = commercial grade temperature
  • ind. = industrial grade temperature
TE0300 Series Selection Chart

Module Options

  • FPGA options
    Module can be ordered with Xilinx Spartan-3E XC3S1200E  or XC3S1600E chip.

  • Flash options
    Module can be ordered with 32, 64 or 128 Mbit SPI Flash chip.
  • Temperature grade options
    Module can be ordered in commercial or in extended (from -25 C° to +85 C°) temperature grade.

Sample Applications

  • Cryptographic hardware module
  • Digital signal processing
  • Embedded educational platform
  • Embedded industrial OEM platform
  • Embedded system design
  • Emulation platforms
  • FPGA graphics
  • Image processing
  • IP (intellectual property) cores
  • Low-power design
  • Parallel processing
  • Rapid prototyping
  • Reconfigurable computing
  • System-on-Chip (SoC) development

 

TE0300, top view

TE0300, bottom view

 

 

 

Key Features

  • High-density plug-in Xilinx Spartan-3E module

  • USB 2.0 interface with high speed (480 Mbit/s) data rate

  • Large SPI flash for configuration and user storage accessible via USB or SPI connector

  • Large DDR-SDRAM

  • FPGA configuration is implemented via JTAG, SPI Flash or USB

  • 3 on-board high-power, high-efficiency, switch-mode DC-DC converters (1 A for each voltage rail: 1.2 V, 2.5 V, 3.3 V)

  • Power supply via USB or B2B (carrier board)

  • Flexible expansion via high-density shockproof B2B (board-to-board) connectors

  • Most I/O's on the B2B connectors are routed as LVDS pairs

  • Evenly spread supply pins for good signal integrity

  • Industrial temperature grade available on request

  • Low-cost, versatile and ruggedized design

Specifications

  • FPGA: Xilinx Spartan-3E XC3S1200E – XC3S1600E

  • USB controller: Cypress EZ-USB FX2 USB 2.0 microcontroller CY7C68013A-56LFX

  • Non volatile memory: 16 MBit - 64 Mbit SPI Flash for FPGA-configuration and user data

  • Volatile memory: 512 Mbit x 16 DDR SDRAM with up to 666 Mbyte/s

  • Up to 110 FPGA user I/Os

  • Supply voltage range: 4.0 V – 5.5 V

  • 1 push-button

  • 1 LED

  • Small size (only 40.5 mm x 47.5 mm)

 

TE0300 block diagram
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