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titleDesign Revision History

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DateVivadoProject BuiltAuthorsDescription
2020-10-062019.2TE0807-test_board_noprebuilt-vivado_2019.2-build_15_20201006121447.zip
TE0807-test_board-vivado_2019.2-build_15_20201006121342.zip		John Hartfiel
  • new assembly variants
2020-03-252019.2TE0807-test_board_noprebuilt-vivado_2019.2-build_8_20200325082749.zip
TE0807-test_board-vivado_2019.2-build_8_20200325082730.zip		John Hartfiel
  • script update
2020-01-272019.2TE0807-test_board_noprebuilt-vivado_2019.2-build_4_20200127075704.zip
TE0807-test_board-vivado_2019.2-build_4_20200127075454.zip		John Hartfiel
  • 2019.2 update
  • Vitis support
2019-05-222018.3TE0807-test_board_noprebuilt-vivado_2018.3-build_05_20190522132408.zip
TE0807-test_board-vivado_2018.3-build_05_20190522132356.zip		John Hartfiel
  • custom FSBL
  • Note: Prebuilt for ES2 version not included
2019-02-082018.2TE0807-test_board_noprebuilt-vivado_2018.2-build_04_20190207111539.zip
TE0807-test_board-vivado_2018.2-build_04_20190207111524.zip		John Hartfiel
  • new assembly variant
2018-09-042018.2TE0807-test_board_noprebuilt-vivado_2018.2-build_03_20180904121458.zip
TE0807-test_board-vivado_2018.2-build_03_20180904121522.zip		John Hartfiel
  • additional notes for FSBL generated with Win SDK
  • changed *.bif
2018-01-182017.4TE0807-test_board_noprebuilt-vivado_2017.4-build_05_20180118152119.zip
TE0807-test_board-vivado_2017.4-build_05_20180118152104.zip		John Hartfiel
  • rework Board Part Files

2017-11-14

2017.2TE0807-test_board_noprebuilt-vivado_2017.2-build_05_20171114115524.zip
TE0807-test_board-vivado_2017.2-build_05_20171114115511.zip		John Hartfiel
  • initial release


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Module ModelBoard Part Short NamePCB Revision SupportDDRQSPI FlashEMMCOthersNotes
TE0807-01-07EV-ES   es2_2gb      REV01    2GB      64GB       NA         NA     Not longer supported by vivado
TE0807-02-07EV-1E   7ev_1e_4gb   REV02    4GB      64GB       NA         NA     NA                               
TE0807-02-07EV-1EK  7ev_1e_4gb   REV02    4GB      64GB       NA         NA     with heat sink                 
TE0807-02-4BE21-A   4eg_1e_4gb   REV02    4GB      128MB      NA         NA     NA                               
TE0807-02-7DE21-A   7ev_1e_4gb   REV02    4GB      128MB      NA         NA     NA                               
TE0807-02-7DI21-C   7ev_1i_4gb   REV02    4GB      128MB      NA         NA     without encryption             
TE0807-02-7DI21-A   7ev_1i_4gb   REV02    4GB      128MB      NA         NA     NA                               
TE0807-02-4AI21-A   4cg_1i_4gb   REV02    4GB      128MB      NA         NA     NA                               
TE0807-02-5AI21-A   5cg_1i_4gb   REV02    4GB      128MB      NA         NA     NA                               
TE0807-02-7AI21-A   7cg_1i_4gb   REV02    4GB      128MB      NA         NA     NA                               
TE0807-02-7DI24-A   7ev_1i_4gb   REV02    4GB      512MB      NA         NA     NA                               
TE0807-02-7DE21-AK  7ev_1e_4gb   REV02    4GB      128MB      NA         NA     -AK  7ev_1e_4gb   REV02    4GB      128MB      NA         NA     with heat sink                 
TE0807-02-4AI21-X   4cg_1i_4gb   REV02    4GB      128MB      NA         NA     U41 replaced with diode        
TE0807-02-4BE21-AK  4eg_1e_4gb   REV02    4GB      128MB      NA         NA     with heat sink                 
TE0807-02-7DI21-AK   7ev_1i_4gb   REV02    4GB      128MB      NA         NA     with heat sink                 
TE0807-02-5DI21-A   5ev_1i_4gb   REV02    4GB      128MB      NA         NA     NA                               
TE0807-02-7NE21-A   7ev_3e_4gb   REV02    4GB      128MB      NA         NA     NA                               
TE0807-03-5DI21-A   5ev_1i_4gb   REV03    4GB      128MB      NA         NA     NA                               
TE0807-03-7NE21-A   7ev_3e_4gb   REV03    4GB      128MB      NA         NA     NA                               
TE0807-03-4AI21-X   4cg_1i_4gb   REV03    4GB      128MB      NA         NA     U41 replaced with diode        
TE0807-03-4AI21-A   4cg_1i_4gb   REV03    4GB      128MB      NA         NA     NA                               
TE0807-03-4AI21-C   4cg_1i_4gb   REV03    4GB      128MB      NA         NA     without encryption             
TE0807-03-4BE21-A   4eg_1e_4gb   REV03    4GB      128MB      NA         NA     NA                               
TE0807-03-5AI21-A   5cg_1i_4gb   REV03    4GB      128MB      NA         NA     NA                               
TE0807-03-7AI21-A   7cg_1i_4gb   REV03    4GB      128MB      NA         NA     NA                               
TE0807-03-7DE21-A   7ev_1e_4gb   REV03    4GB      128MB      NA         NA     NA                               
TE0807-03-7DE21-AK  7ev_1e_4gb   REV03    4GB      128MB      NA         NA     with heat sink                 
TE0807-03-7DI21-A   7ev_1i_4gb   REV03    4GB      128MB      NA         NA     NA                               
TE0807-03-7DI21-C   7ev_1i_4gb   REV03    4GB      128MB      NA         NA     without encryption             
TE0807-03-7DI24-A   7ev_1i_4gb   REV03    4GB      512MB      NA         NA     NA                               with heat sink                 


Note: Design contains also Board Part Files for TE0807+TEBF0808 configuration, this boart part files are not used for this reference design.

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  1. Prepare HW like described on section Programming 71631609
  2. Connect UART USB (most cases same as JTAG)
  3. Select QSPI Card as Boot Mode
    Note: See TRM of the Carrier, which is used.
  4. Power On PCB
    Note: 1. ZynqMP Boot ROM loads PMU Firmware and  FSBL from QSPI into OCM, 2. FSBL loads Application into DDR

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DateDocument RevisionAuthorsDescription

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  • new assembly variants
2020-03-25v.13John Hartfiel
  • script update
2020-01-27v.12John Hartfiel
  • Release 2019.2
  • new assembly variants
2019-05-22v.10John Hartfiel
  • Release 2018.3
2019-02-07v.9John Hartfiel
  • new assembly variant

2018-09-04

v.7John Hartfiel
  • Release 2018.2
2018-02-08v.5John Hartfiel
  • Release 2017.4
2017-11-14v.3John Hartfiel
  • Release 2017.2
--all

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