Versions Compared

Key

  • This line was added.
  • This line was removed.
  • Formatting was changed.


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Design Name is always "TE Series Name" + Design name, for example "TE0720 Test Board"


Date

Version

Changes

Author

2022-08-243.1.11
  • Modification from link "available short link"
ma
2022-01-253.1.10
  • removed u-boot.dtb from QSPI-Boot mode and SD-Boot mode. Is implemented in BOOT.bin
  • corrected Boot Source File in Boot Script-File
ma
2022-01-143.1.9
  • extended notes for microblaze boot process with linux
  • add u.boot.dtb to petalinux notes
  • add dtb to prebuilt content
  • replace 20.2 with 21.2
jh

2021-06-28

3.1.8

  • added boot process for Microblaze

  • minor typos, formatting

ma

2021-06-01

3.1.7

  • carrier reference note

jh

2021-05-04

3.1.6

  • removed zynq_ from zynq_fsbl

ma

2021-04-28

3.1.5

  • added macro "Scroll ignore" for suppression of horizontal dividing lines during .pdf-export

  • minor typos, formatting

ma

2021-04-27

3.1.4

  • Version History

    • changed from list to table

  • Design flow

    • removed step 5 from Design flow

    • changed link from TE Board Part Files to Vivado Board Part Flow

    • changed cmd shell from picture to codeblock

    • added hidden template for "Copy PetaLinux build image files", depending from hardware

    • added hidden template for "Power on PCB", depending from hardware

  • Usage update of boot process

  • Requirements - Hardware

    • added "*used as reference" for hardware requirements

  • all

    • placed a horizontal separation line under each chapter heading

    • changed title-alignment for tables from left to center

  • all tables

    • added "<project folder>\board_files" in Vivado design sources

ma


3.1.3

  • Design Flow

    • formatting

  • Launch

    • formatting

ma


3.1.2

  • minor typing corrections

  • replaced SDK by Vitis

  • changed from / to \ for windows paths

  • replaced <design name> by <project folder>

  • added "" for path names

  • added boot.src description

  • added USB for programming

ma


3.1.1

  • swapped order from prebuilt files

  • minor typing corrections

  • removed Win OS path length from Design flow, added as caution in Design flow

ma


3.1

  • Fix problem with pdf export and side scroll bar

  • update 19.2 to 20.2

  • add prebuilt content option



3.0

  • add fix table of content

  • add table size as macro

  • removed page initial creator



Custom_table_size_100

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Important General Note:

  • Export PDF to download, if vivado revision is changed!

  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

    • Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)

      • Figure template (note: inner scroll ignore/only only with drawIO object):

        Scroll Title
        anchorFigure_xyz
        titleText


        Scroll Ignore

        Create DrawIO object here: Attention if you copy from other page, use


        Scroll Only

        image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed



      • Table template:

        • Layout macro can be use for landscape of large tables

        • Set column width manually (can be used for small tables to fit over whole page) or leave empty (automatically)


      • Scroll Title
        anchorTable_xyz
        titleText

        Scroll Table Layout
        orientationportrait
        sortDirectionASC
        repeatTableHeadersdefault
        sortByColumn1
        sortEnabledfalse
        cellHighlightingtrue

        Example

        Comment

        1

        2



  • ...

Overview

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Notes :

Design Example with minimum PS Setup (DDR, QSPI, UART0) only for custom boards or easier debug via Vitis.

Refer to http://trenz.org/te0803-info for the current online version of this manual and other available documentation.

Key Features

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Notes :

  • Add basic key futures, which can be tested with the design


Excerpt
  • Vitis/Vivado 2021.2.1

  • QSPI

  • Custom Carrier (minimum PS Design with available module components only)

  • Modified FSBL (some additional outputs only)

Revision History

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Notes :

  • add every update file on the download

  • add design changes on description


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Date

Vivado

Project Built

Authors

Description

2022-10-172021.2.1TE0803-test_board-vivado_2021.2-build_18_20221017093148.zip
TE0803-test_board_noprebuilt-vivado_2021.2-build_18_20221017093148.zip
Manuela Strücker
  • script update
2022-08-302021.2.1TE0803-test_board-vivado_2021.2-build_15_20220830131430.zip
TE0803-test_board_noprebuilt-vivado_2021.2-build_15_20220830131430.zip
Manuela Strücker
  • new assembly variants
2022-04-052021.2TE0803-test_board-vivado_2021.2-build_11_20220405100116.zip
TE0803-test_board_noprebuilt-vivado_2021.2-build_11_20220405100116.zip
Manuela Strücker
  • 2021.2 update
2021-09-062020.2TE0803-test_board-vivado_2020.2-build_7_20210906104518.zip
TE0803-test_board_noprebuilt-vivado_2020.2-build_7_20210906104536.zip
Manuela Strücker
  • 2020.2 update
  • update document style

2020-04-06

2019.2

TE0803-test_board-vivado_2019.2-build_9_20200406081019.zip

TE0803-test_board_noprebuilt-vivado_2019.2-build_9_20200406081036.zip

John Hartfiel

  • new assembly variants

2020-03-25

2019.2

TE0803-test_board-vivado_2019.2-build_8_20200325082253.zip

TE0803-test_board_noprebuilt-vivado_2019.2-build_8_20200325082311.zip

John Hartfiel

  • script update

2020-01-23

2019-2

TE0803-test_board-vivado_2019.2-build_3_20200123070036.zip

TE0803-test_board_noprebuilt-vivado_2019.2-build_3_20200123070049.zip

John Hartfiel

  • 2019.2 update

  • Vitis support

  • FSBL SI programming procedure update 

2019-5-06

2018.3

TE0803-test_board_noprebuilt-vivado_2018.3-build_05_20190506161948.zip

TE0803-test_board-vivado_2018.3-build_05_20190506161936.zip

John Hartfiel

  • custom FSBL

  • new assembly variants

2018-10-26

2018.2

TE0803-test_board_noprebuilt-vivado_2018.2-build_03_20181026141705.zip

TE0803-test_board-vivado_2018.2-build_03_20181026141651.zip

John Hartfiel

  • new assembly variant

2018-08-14

2018.2

TE0803-test_board_noprebuilt-vivado_2018.2-build_02_20180814103119.zip

TE0803-test_board-vivado_2018.2-build_02_20180814103105.zip

John Hartfiel

  • new assembly variant

2018-07-13

2018.2

TE0803-test_board_noprebuilt-vivado_2018.2-build_02_20180713085721.zip

TE0803-test_board-vivado_2018.2-build_02_20180713085704.zip

John Hartfiel

  • additional notes for FSBL generated with Win SDK

  • changed *.bif

2018-05-17

2017.4

TE0803-test_board_noprebuilt-vivado_2017.4-build_09_20180517152118.zip

TE0803-test_board-vivado_2017.4-build_09_20180517152103.zip

John Hartfiel

  • new assembly variant

2018-04-11

2017.4

TE0803-test_board_noprebuilt-vivado_2017.4-build_07_20180411081821.zip

TE0803-test_board-vivado_2017.4-build_07_20180411081757.zip

John Hartfiel

  • bugfix TE0803-01-04EG board part file

2018-02-13

2017.4

TE0803-test_board_noprebuilt-vivado_2017.4-build_06_20180213120257.zip

TE0803-test_board-vivado_2017.4-build_06_20180213120229.zip

John Hartfiel

  • new assembly variant

2018-02-05

2017.4

TE0803-test_board-vivado_2017.4-build_05_20180205101915.zip

TE0803-test_board_noprebuilt-vivado_2017.4-build_05_20180205101943.zip

John Hartfiel

  • new assembly variant

2018-01-31

2017.4

TE0803-test_board-vivado_2017.4-build_05_20180131124202.zip

TE0803-test_board_noprebuilt-vivado_2017.4-build_05_20180131124215.zip

John Hartfiel

  • new assembly variant

2018-01-18

2017.4

TE0803-test_board-vivado_2017.4-build_05_20180118160549.zip

TE0803-test_board_noprebuilt-vivado_2017.4-build_05_20180118160604.zip

John Hartfiel

  • rework Board Part Files

2017-11-16

2017.2

TE0803-test_board-vivado_2017.2-build_05_20171116152716.zip

TE0803-test_board_noprebuilt-vivado_2017.2-build_05_20171116154619.zip

John Hartfiel

  • Update Board Part CSV File with new Flash assembly variants

2017-11-14

2017.2

TE0803-test_board-vivado_2017.2-build_05_20171114090712.zip

TE0803-test_board_noprebuilt-vivado_2017.2-build_05_20171114090725.zip

John Hartfiel

  • Initial release


Release Notes and Know Issues

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Notes :
  • add known Design issues and general notes for the current revision
  • do not delete known issue, add fixed version time stamp if issue fixed


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IssuesDescriptionWorkaroundTo be fixed version
Xilinx SoftwareIncompatibility of board files for ZynqMP with eMMC activated between 2021.2 and 2021.2.1 patch, see Xilinx Forum Requestuse corresponding board files for the Vivado versions--
QSPI FlashFlash programming is not supported with boot mode QSPI or SD. If flash programming fails, configure device for JTAG boot mode and try again or
use older Vivado Versions for programming. (Vivado 2020.2 or 2019.2)
--


Requirements

Software

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Notes :

  • list of software which was used to generate the design


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SoftwareVersionNote
Vitis2021.2.1needed, Vivado is included into Vitis installation



Hardware

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Notes :

  • list of hardware which was used to generate the design
  • mark the module and carrier board, which was used tested with an *
Basic description of TE Board Part Files is available on TE Board Part Files.

Complete List is available on "<project folder>\board_files\*_board_files.csv"

Design supports following modules:

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Module ModelBoard Part Short NamePCB Revision SupportDDRQSPI FlashEMMCOthersNotes
TE0803-01-02EG-1E2eg_2gbREV012GB64MBNANANA
TE0803-01-02CG-1E2cg_2gbREV012GB64MBNANANA
TE0803-01-03EG-1E3eg_2gbREV012GB64MBNANANA
TE0803-01-03CG-1E3cg_2gbREV012GB64MBNANANA
TE0803-01-02EG-1EA2eg_2gbREV012GB128MBNANANA
TE0803-01-02CG-1EA2cg_2gbREV012GB128MBNANANA
TE0803-01-03EG-1EA3eg_2gbREV012GB128MBNANANA
TE0803-01-03CG-1EA3cg_2gbREV012GB128MBNANANA
TE0803-02-03EG-1EB3eg_4gbREV02|REV014GB128MBNANANA
TE0803-01-04CG-1EA4cg_2gbREV012GB128MBNANANA
TE0803-02-04EV-1EA4ev_2gbREV02|REV012GB128MBNANANA
TE0803-01-04EV-1E34ev_2gbREV012GB128MBNA1 mm connectorsNA
TE0803-01-04EG-1EA4eg_2gbREV012GB128MBNANANA
TE0803-01-04CG-1EB4cg_2gbREV012GB256MBNANANA
TE0803-01-05EV-1EA5ev_2gbREV012GB128MBNANANA
TE0803-01-05EV-1IA5ev_i_2gbREV012GB128MBNANANA
TE0803-02-04EV-1E34ev_4gbREV024GB128MBNA1 mm connectorsNA
TE0803-02-04EG-1E34eg_4gbREV024GB128MBNA1 mm connectorsNA
TE0803-03-2AE11-A2cg_2gbREV032GB128MBNANANA
TE0803-03-2BE11-A2eg_2gbREV032GB128MBNANANA
TE0803-03-3AE11-A3cg_2gbREV032GB128MBNANANA
TE0803-03-3BE11-A3eg_2gbREV032GB128MBNANANA
TE0803-03-4AE11-A4cg_2gbREV032GB128MBNANANA
TE0803-03-4BE11-A4eg_2gbREV032GB128MBNANANA
TE0803-03-4BE21-L4eg_4gbREV034GB128MBNA1 mm connectorsNA
TE0803-03-4BI21-A4eg_i_4gbREV034GB128MBNANANA
TE0803-03-4DE11-A4ev_2gbREV032GB128MBNANANA
TE0803-03-4DE21-L4ev_4gbREV034GB128MBNA1 mm connectorsNA
TE0803-03-4GE21-L4eg_2_4gbREV034GB128MBNA1 mm connectorsNA
TE0803-03-5DE11-A5ev_2gbREV032GB128MBNANANA
TE0803-03-5DI21-A5ev_i_4gbREV034GB128MBNANANA
TE0803-03-3RI21-A3eg_li_4gbREV034GB128MBNANANA
TE0803-03-3BI21-A3eg_i_4gbREV034GB128MBNANANA
TE0803-03-4DI21-L4ev_i_4gbREV034GB128MBNA1 mm connectorsNA
TE0803-03-4GI11-A4eg_2i_2gbREV032GB128MBNANANA
TE0803-03-4GE11-A4eg_2_2gbREV032GB128MBNANANA
TE0803-03-4GI21-A4eg_2i_4gbREV034GB128MBNANANA
TE0803-03-5BE11-A5eg_2gbREV032GB128MBNANANA
TE0803-03-5DI24-A5ev_i_4gbREV034GB512MBNANANA
TE0803-03-4BI21-X4eg_i_4gbREV034GB128MBNANAU41 replaced with diode
TE0803-03-3BE21-A3eg_4gbREV034GB128MBNANANA
TE0803-03-3BE31-A*3eg_8gbREV038GB128MBNANAdual die ddr
TE0803-04-2AE11-A2cg_2gbREV042GB128MBNANANA
TE0803-04-2BE11-A2eg_2gbREV042GB128MBNANANA
TE0803-04-3AE11-A3cg_2gbREV042GB128MBNANANA
TE0803-04-3BE11-A3eg_2gbREV042GB128MBNANANA
TE0803-04-4BE21-L4eg_4gbREV044GB128MBNA1 mm connectorsNA
TE0803-04-4BI21-A4eg_i_4gbREV044GB128MBNANANA
TE0803-04-4BI21-X4eg_i_4gbREV044GB128MBNANAU41 replaced with diode
TE0803-03-4BI61-A4eg_8gbREV038GB128MBNANAdual die ddr
TE0803-03-4BI61-X4eg_8gbREV038GB128MBNANAdual die ddr
TE0803-04-4BI61-A4eg_8gbREV048GB128MBNANAdual die ddr
TE0803-04-4BI61-X4eg_8gbREV048GB128MBNANAdual die ddr
TE0803-04-4DE11-A4ev_2gbREV042GB128MBNANANA
TE0803-04-4DE21-L4ev_4gbREV044GB128MBNA1 mm connectorsNA
TE0803-04-4DI21-L4ev_i_4gbREV044GB128MBNA1 mm connectorsNA
TE0803-03-4DI21-D4ev_i_4gbREV034GB128MBNA
NA
TE0803-04-4DI21-D4ev_i_4gbREV044GB128MBNA
NA
TE0803-04-4GE21-L4eg_2_4gbREV044GB128MBNA1 mm connectorsNA
TE0803-04-4GI21-A4eg_2i_4gbREV044GB128MBNANANA
TE0803-04-5BE11-A5eg_2gbREV042GB128MBNANANA
TE0803-04-5DE11-A5ev_2gbREV042GB128MBNANANA
TE0803-04-5DI21-A5ev_i_4gbREV044GB128MBNANANA
TE0803-03-S0034ev_2gbREV042GB128MBNANACAO
TE0803-03-S0064ev_4gbREV044GB128MBNA1 mm connectorsCAO
TE0803-04-4BE11-A4eg_2gbREV042GB128MBNANACAO
TE0803-03-S0054eg_2gbREV032GB128MBNANACAO: TE0803-03-4BI1?-A
TE0803-04-S0094eg_2_4gbREV044GB128MBNA1 mm connectorsCAO: TE0803-04-4GE21-L
TE0803-04-S0114eg_2_4gbREV044GB64MBNA1 mm connectorsCAO: TE0803-04-4GE25-L
TE0803-04-4AE11-A4cg_2gbREV042GB128MBNANANA
TE0803-04-S0122cg_2gbREV042GB128MBNANACAO

*used as reference

Note: Design contains also Board Part Files for TE0803+TEBF0808 configuration, this board part files are not used for this reference design.

Design supports following carriers:

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Carrier Model

Notes

Custom PCB

use simple Board Part files, if MIO connected is different to TEBF0808

TEBF0808*

Used as reference carrier. Important: CPLD Firmware REV07 or newer is recommended

TEBT0808-01

Change UART0 to UART1 (MIO68...69) and regenerate design

*used as reference

Additional HW Requirements:

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Additional Hardware

Notes

---

---

*used as reference

Content

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Notes :

  • content of the zip file

For general structure and usage of the reference design, see Project Delivery - Xilinx AMD devices

Design Sources

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TypeLocationNotes
Vivado<project folder>\block_design
<project folder>\constraints
<project folder>\ip_lib
<project folder>\board_files
Vivado Project will be generated by TE Scripts
Vitis<project folder>\sw_libAdditional Software Template for Vitis and apps_list.csv with settings automatically for Vitis app generation



Additional Sources

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Type

Location

Notes

---

---

---


Prebuilt

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Notes :

  • prebuilt files
  • Template Table:

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      File

      File-Extension

      Description

      BIF-File*.bifFile with description to generate Bin-File
      BIN-File*.binFlash Configuration File with Boot-Image (Zynq-FPGAs)
      BIT-File*.bitFPGA (PL Part) Configuration File
      Boot Script-File*.scr

      Distro Boot Script file

      DebugProbes-File*.ltxDefinition File for Vivado/Vivado Labtools Debugging Interface

      Debian SD-Image

      *.img

      Debian Image for SD-Card

      Diverse Reports---Report files in different formats
      Hardware-Platform-Description-File*.xsaExported Vivado hardware description file for Vitis and PetaLinux
      LabTools Project-File*.lprVivado Labtools Project File

      MCS-File

      *.mcs

      Flash Configuration File with Boot-Image (MicroBlaze or FPGA part only)

      MMI-File

      *.mmi

      File with BRAM-Location to generate MCS or BIT-File with *.elf content (MicroBlaze only)

      OS-Image*.ubImage with Linux Kernel (On Petalinux optional with Devicetree and RAM-Disk)
      Software-Application-File*.elfSoftware Application for Zynq or MicroBlaze Processor Systems

      SREC-File

      *.srec

      Converted Software Application for MicroBlaze Processor Systems





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File

File-Extension

Description

BIF-File

*.bif

File with description to generate Bin-File

BIN-File

*.bin

Flash Configuration File with Boot-Image (Zynq-FPGAs)

BIT-File

*.bit

FPGA (PL Part) Configuration File

Diverse Reports

---

Report files in different formats

Hardware-Platform-Description-File*.xsaExported Vivado hardware description file for Vitis and PetaLinux

LabTools Project-File

*.lpr

Vivado Labtools Project File

Software-Application-File

*.elf

Software Application for Zynq or MicroBlaze Processor Systems


Download

Reference Design is only usable with the specified Vivado/Vitis/PetaLinux version. Do never use different Versions of Xilinx Software for the same Project.

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Reference Design is available on:

Design Flow

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Notes :

  • Basic Design Steps

  • Add/ Remove project specific description


Note

Reference Design is available with and without prebuilt files. It's recommended to use TE prebuilt files for first launch.

Trenz Electronic provides a tcl based built environment based on Xilinx Design Flow.

See also:

The Trenz Electronic FPGA Reference Designs are TCL-script based project. Command files for execution will be generated with "_create_win_setup.cmd" on Windows OS and "_create_linux_setup.sh" on Linux OS.

TE Scripts are only needed to generate the vivado project, all other additional steps are optional and can also executed by Xilinx Vivado/Vitis GUI. For currently Scripts limitations on Win and Linux OS see: Project Delivery Currently limitations of functionality

Note

Caution! Win OS has a 260 character limit for path lengths which can affect the Vivado tools. To avoid this issue, use Virtual Drive or the shortest possible names and directory locations for the reference design (for example "x:\<project folder>")


  1. Run _create_win_setup.cmd/_create_linux_setup.sh and follow instructions on shell:

    Code Block
    languagebash
    themeMidnight
    title_create_win_setup.cmd/_create_linux_setup.sh
    ------------------------Set design paths----------------------------
    -- Run Design with: _create_win_setup
    -- Use Design Path: <absolute project path>
    --------------------------------------------------------------------
    -------------------------TE Reference Design---------------------------
    --------------------------------------------------------------------
    -- (0)  Module selection guide, project creation...prebuilt export...
    -- (1)  Create minimum setup of CMD-Files and exit Batch
    -- (2)  Create maximum setup of CMD-Files and exit Batch
    -- (3)  (internal only) Dev
    -- (4)  (internal only) Prod
    -- (c)  Go to CMD-File Generation (Manual setup)
    -- (d)  Go to Documentation (Web Documentation)
    -- (g)  Install Board Files from Xilinx Board Store (beta)
    -- (a)  Start design with unsupported Vivado Version (beta)
    -- (x)  Exit Batch (nothing is done!)
    ----
    Select (ex.:'0' for module selection guide):


  2. Press 0 and enter to start "Module Selection Guide"

  3. Createproject and follow instructions of the product selection guide, settings file will be configured automatically during this process.
    • optional for manual changes: Select correct device and Xilinx install path on "design_basic_settings.cmd" and create Vivado project with "vivado_create_project_guimode.cmd"

      Note

      Note: Select correct one, see also Vivado Board Part Flow

      Important: Use Board Part Files, which did not ends with *_tebf0808


  4. Create hardware description file (.xsa file) for PetaLinux project and export to prebuilt folder

    Code Block
    languagepy
    themeMidnight
    titlerun on Vivado TCL (Script generates design and export files into "<project folder>\prebuilt\hardware\<short name>")
    TE::hw_build_design -export_prebuilt


    Info

    Using Vivado GUI is the same, except file export to prebuilt folder.


  5. Generate Programming Files with Vitis

    Code Block
    languagepy
    themeMidnight
    titlerun on Vivado TCL (Script generates applications and bootable files, which are defined in "test_board\sw_lib\apps_list.csv")
    TE::sw_run_vitis -all
    TE::sw_run_vitis (optional; Start Vitis from Vivado GUI or start with TE Scripts on Vivado TCL)


    Note

    TCL scripts generate also platform project, this must be done manually in case GUI is used. See Vitis


Launch

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Note:

  • Programming and Startup procedure

Programming

Note

Check Module and Carrier TRMs for proper HW configuration before you try any design.

Reference Design is also available with prebuilt files. It's recommended to use TE prebuilt files for first launch.

Xilinx documentation for programming and debugging: Vivado/Vitis/SDSoC-Xilinx Software Programming and Debugging

Get prebuilt boot binaries

  1. Run _create_win_setup.cmd/_create_linux_setup.sh and follow instructions on shell
  2. Press 0 and enter to start "Module Selection Guide"
    1. Select assembly version
    2. Validate selection
    3. Select create and open delivery binary folder

      Info

      Note: Folder "<project folder>\_binaries_<Article Name>" with subfolder "boot_<app name>" for different applications will be generated


QSPI-Boot mode

  1. Connect JTAG and power on carrier with module
  2. Open Vivado Project with "vivado_open_existing_project_guimode.cmd" or if not created, create with "vivado_create_project_guimode.cmd"

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    titlerun on Vivado TCL (Script programs BOOT.bin on QSPI flash)
    TE::pr_program_flash -swapp hello_te0803


SD-Boot mode

This does not work, because SD controller is not selected on PS.

JTAG

Load configuration and Application with Vitis Debugger into device

Usage

QSPI Boot:

  1. Prepare HW like described on section Programming

  2. Connect UART USB (most cases same as JTAG)

  3. Select QSPI as Boot Mode

    Info

    Note: See TRM of the Carrier, which is used.


  4. Power On PCB

    Expand
    titleboot process

    1. ZynqMP Boot ROM loads FSBL from QSPI into OCM,

    2. FSBL init the PS, programs the PL using the bitstream and loads PMU, ATF and U-boot from QSPI into DDR,


System Design - Vivado

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Note:

  • Description of Block Design, Constrains... BD Pictures from Export...

Block Design

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PS Interfaces

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Note:

  • optional for Zynq / ZynqMP only

  • add basic PS configuration

Activated interfaces:

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Type

Note

DDR


QSPI

MIO

UART0

MIO, please select other one, if you have connected UART to second controller or other MIO

SWDT0..1


TTC0..3



Constrains

Basic module constrains

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title_i_bitgen.xdc
set_property BITSTREAM.GENERAL.COMPRESS TRUE [current_design]
set_property BITSTREAM.CONFIG.UNUSEDPIN PULLNONE [current_design]

Design specific constrain

Not needed.

Software Design - Vitis

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Note:

  • optional chapter separate

  • sections for different apps

For Vitis project creation, follow instructions from:

Vitis


Application

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----------------------------------------------------------

FPGA Example

scu

MCS Firmware to configure SI5338 and Reset System.

srec_spi_bootloader

TE modified 2021.2 SREC

Bootloader to load app or second bootloader from flash into DDR

Descriptions:

  • Modified Files: blconfig.h, bootloader.c
  • Changes:
    • Add some console outputs and changed bootloader read address.
    • Add bugfix for 2018.2 qspi flash

xilisf_v5_11

TE modified 2021.2 xilisf_v5_11

  • Changed default Flash type to 5.

----------------------------------------------------------

Zynq Example:

fsbl

TE modified 2021.2 FSBL

General:

  • Modified Files: main.c, fsbl_hooks.h/.c (search for 'TE Mod' on source code)
  • Add Files: te_fsbl_hooks.h/.c (for hooks and board)

  • General Changes: 
    • Display FSBL Banner and Device ID

Module Specific:

  • Add Files: all TE Files start with te_*
    • READ MAC from EEPROM and make Address accessible by UBOOT (need copy defines on uboot platform-top.h)
    • CPLD access
    • Read CPLD Firmware and SoC Type
    • Configure Marvell PHY

fsbl_flash

TE modified 2021.2 FSBL

General:

  • Modified Files: main.c
  • General Changes:
    • Display FSBL Banner
    • Set FSBL Boot Mode to JTAG
    • Disable Memory initialisation

ZynqMP Example:

----------------------------------------------------------

zynqmp_fsbl

TE modified 2021.2 FSBL

General:

  • Modified Files: xfsbl_main.c, xfsbl_hooks.h/.c, xfsbl_board.h/.c (search for 'TE Mod' on source code)
  • Add Files: te_xfsbl_hooks.h/.c (for hooks and board)
  • General Changes: 
    • Display FSBL Banner and Device Name

Module Specific:

  • Add Files: all TE Files start with te_*
    • Si5338 Configuration
    • ETH+OTG Reset over MIO

zynqmp_fsbl_flash

TE modified 2021.2 FSBL

General:

  • Modified Files: xfsbl_initialisation.c, xfsbl_hw.h, xfsbl_handoff.c, xfsbl_main.c
  • General Changes:
    • Display FSBL Banner
    • Set FSBL Boot Mode to JTAG
    • Disable Memory initialisation


zynqmp_pmufw

Xilinx default PMU firmware.

----------------------------------------------------------

General Example:

hello_te0820

Hello TE0820 is a Xilinx Hello World example as endless loop instead of one console output.

u-boot

U-Boot.elf is generated with PetaLinux. Vitis is used to generate Boot.bin.

Template location: "<project folder>\sw_lib\sw_apps\"

zynqmp_fsbl

TE modified 2021.2 FSBL

General:

  • Modified Files: xfsbl_main.c, xfsbl_hooks.h/.c, xfsbl_board.h/.c (search for 'TE Mod' on source code)
  • Add Files: te_xfsbl_hooks.h/.c (for hooks and board)
  • General Changes: 
    • Display FSBL Banner and Device Name

zynqmp_fsbl_flash

TE modified 2021.2 FSBL

General:

  • Modified Files: xfsbl_initialisation.c, xfsbl_hw.h, xfsbl_handoff.c, xfsbl_main.c
  • General Changes:
    • Display FSBL Banner
    • Set FSBL Boot Mode to JTAG
    • Disable Memory initialisation

hello_te0803

Hello TE0803 is a Xilinx Hello World example as endless loop instead of one console output.

Additional Software

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Note:

  • Add description for other Software, for example SI CLK Builder ...

  • SI5338 and SI5345 also Link to:

No additional software is needed.

Appx. A: Change History and Legal Notices

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Document Change History

To get content of older revision go to "Change History" of this page and select older document revision number.

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Date

Document Revision

Authors

Description

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infoTypeCurrent version
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infoTypeModified by
typeFlat

  • script update
2022-09-06v.32Manuela Strücker
  • new assembly variants
2022-07-15v.30Manuela Strücker
  • Release 2021.2
2021-09-09v.25Manuela Strücker
  • Release 2020.2
2020-04-06v.24John Hartfiel
  • new assembly variants

2020-03-25

v.23

John Hartfiel

  • Script update

2020-01-23

v.22

John Hartfiel

  • Release 2019.2

2019-05-07

v.21

John Hartfiel

  • Release 2018.3

2018-10-26

v.18

John Hartfiel

  • new assembly variant

2018-08-14

v.16

John Hartfiel

  • new assembly variant

2018-07-13

v.15

John Hartfiel

  • Release 2018.2

2018-05-18

v.14

John Hartfiel

  • new assembly variant

2018-04-11

v.13

John Hartfiel

  • bugfix board part file

2018-04-03

v.11

John Hartfiel

  • new assembly variant

2018-01-18

v.6

John Hartfiel

  • Release 2017.4

2017-11-16

v.4

John Hartfiel

  • Update assembly versions with new Flash size

2017-11-14

v.3

John Hartfiel

  • Release 2017.2


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