Page History

Products Affected (ED: Table is finished!)

This change affects all Trenz Electronic TE0726 SoMs: TE0726-03*.

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Type: Schematic Change

Reason: Provide Enable DDR3L ECC functionality.

Impact: Enable DDR3L ECC availablefunctionality. Firmware reflects it but custom firmware needs to be updated by customer.

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Type: Schematic Change

Reason: Enable DDR3L ECC usagefunctionality.

Impact: None. Minor changes in electrical characteristics.

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Type: Schematic Change

Reason: Enable DDR3L ECC usagefunctionality.

Impact: DDR3 ECC is connected to MIO52 or MIO53 (default)Enable DDR3L ECC functionality. Firmware reflects it but custom firmware needs to be updated by customer.

#5 Changed power-up sequencing. ????

Type: Schematic Change

Reason: Updated power sequence according to AMD recommendation.

Impact: None. Updated power sequence.

#6 Added DIP switch (S1) and resistor (R152) to enable JTAG only boot mode.

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Impact: None. Fix QSPI programming problems with newer Vivado versions according to AR#00002 - QSPI Programming issues.

#7 Added 499 Ohm resistor (R162) and changed

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value for resistor (R141) from 2.61 kOhm to 499 Ohm to use signal "PUDC" as dual-

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purpose signal.

Type: Schematic Change

Reason: DualEnable dual-use option for signal "PUDC".

Impact: None. Firmware reflects it but custom firmware needs to be updated by customer.

#8

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Changed HDMI CEC circuit (R140, D5) and removed HDMI CEC functionality via not assembled resistors (R140, R42), capacitor (C127) and diode (D5) and completely removed ferrid bead (L11).

Type: Schematic Change

Reason: Improve HDMI functionality.

Impact: If HDMI CEC is used in customer firmware, firmware needs to be modified or components needs to be assembled. Please contact us.

#9 Added diode (D7) and resistors (R155, R160) for voltage level translation for signal "DONE_LV" at CPLD (U11) to signal "DONE" at FPGA (U1).

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Reason: Improve signal voltage level. ???

Impact: None.

#10 Added MIC bias power circuit (L12, C114, R151).

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Reason: EOL of Component.

Impact: None.

#14 Changed capacitors (C29, C32, C32) from 100 nF, 25 V

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, 0402 to 470 nF, 6.3 V

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, 0201.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#14 Changed resistors (R80, R81, R82) from 1.43 kOhm to 10 kOhm.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#15 Changed testpoint size from 0.8 mm to 1 mm diameter for testpoints (TP2, TP4, TP6, TP8...TP14).

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Production Shipment Schedule

From january april 2024, after old stock is gone. If the new revision is not suitable for your application and still the former revision of the board is needed, please contact us.

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