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#2 Changed DCDC EN5335QI (U8) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

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Reason: Harmonize with TEBF0818 series.

Impact:

#11 Changed AC coupling (C93/C94 in REV04A) to DC coupling (R263/R264 in REV05) for differential clock

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signals "CLK0_N" and "CLK0_P".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

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Reason: Harmonize with TEBF0818 series.

Impact: None.

#14 Changed pull-up resistor voltage for resistor (R18, R21, R86, R87, R113 ... R115, R121 ... R123).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

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Impact: None. CPLD firmware reflects it but customer firmware needs to be checked/adapted by customer.

#18 Connected all shield signals for connector (J7) together to net "FGND". Removed shield signals from net "F2GND".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#19 Renamed shield net to FGND2 for connector (J13) and changed shield components from 0 Ohm resistor (R43, R44 [REV04A]) to 1 MOhm resistor (

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R143 [REV05]) and 100 pF capacitor (C149 [REV05]).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series. (???)

Impact: None.

#20 Inserted FGND3 with resistor (R43 [REV04A]) and capacitor (C93 [REV05]) for SFP+ connector (J14) shield.

Type: Schematic Change

Reason: Improve ESD protection.

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Impact: Specified airflow of fan decreases slightly from 0.03 m³/min to 0.028 m³/min. (???)

#22 Added assembly option (default: not fitted) for cooling solution with fan controller LM96163CISD/NOPB (U54), temperature sense MMBT3904 (T12), and AND Gate (U55)

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.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

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Impact: None. Consider to use correct pins.

#25 Used resistor (R164) as pull-up resistor for signal "POK_1V8".

Type: Schematic Change

Reason: Use external pull-up resistor.

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Reason:BOM Optimization.

Impact: None.

#31 Changed power inductor (L8, L9, L11, L12) from 1 µH, 1.7 A, 55 mOhm to 4.7 µH, 1.5 A, 162 mOhm.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

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Reason: Follow SATA recommendation.

Impact: None.

#34 Changed capacitor (C69, C70) from 100 nF, 6.3 V, 0201 to 220 nF, 50 V, 0402.

Type: Schematic Change

Reason: Follow PCIe recommendation.

Impact: None.

#35 Changed capacitor (C47

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, C50, C52, C57,

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C60, C62) from 470 nF, 6.3 V, 0402 to 100 nF, 10 V, 0201.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

Impact: None.

#35 Changed capacitor (C48, C58) from 10 µF, 6.3 V, 0603 to 100 nF, 10 V, 0201.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

Impact: None.

#36 Changed capacitor (C39, C82, C207) from 4.7 µF, 6.3 V to 10 µF, 10 V.

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Reason: Follow SFP+ recommendation.

Impact: None.

#37 Changed capacitor (C72, C73) from 100 µF, 6.3 V, 20 % to 22 µF, 25 V, 10 %.

Type: Schematic Change

Reason: Increased voltage rating.

Impact: None.

#38 Changed resistor (R40) from 4.99 kOhm to 0 Ohm.

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Reason: Harmonize with TEBF0818 series.

Impact: None.

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#43 Changed resistor (R65) from 8.06 kOhm to 1 kOhm.

Type: Schematic Change

Reason: Enable OTG capability.

Impact: None. (???)

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#44 Added ferrid bead (L25) for fan power supply.

Type: Schematic Change

Reason: Improve power quality.

Impact: None.

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#45 Added additional decoupling capacitor (C263, C281 ... C287).

Type: Schematic Change

Reason: Improve power supply.

Impact: None.

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#46 Set capacitor (C16, C17) to not fitted.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

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#47 Set resistor (R98, R198) as not fitted.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

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#48 Changed net name (IN2_P → IN2_CLK_P and IN2_N → IN2_CLK_N).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

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#49 Changed net name from "3.3V_MOD" to "VCC_MOD".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

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#50 Changed net name from "5VSBIN" to "5VSB".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

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#51 Added testpoint (TP17, TP20 ... TP22).

Type: Schematic Change

Reason: Voltage and system monitoring improvement. (???)

Impact: None.

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#52 Changed impedance controlled routing for differential

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RX and TX PCIe signals to 90 Ohm differential impedance.

Type: PCB Change

Reason: Follow PCIe recommendation.

Impact: None.

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#53 Routed signals which are marked in schematic as "D100"

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with 100 Ohm differential impedance.

Type: PCB Change

Reason: Improve signal integrity.

Impact: None.

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#54 Changed CAN bus signals net names (CAN_H → CAN_P, CAN_L → CAN_N) to route them with 120 Ohm differential impedance.

Type: PCB Change

Reason: Improve signal integrity.

Impact: None.

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#55 Updated PCB with rules, signal layout, layerstack, polygons.

Type: PCB Change

Reason: Improve routing.

Impact: None.

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#56 Added module orientation mark in silkscreen top side.

Type: PCB change

Reason: Improve module orientation visibility.

Impact: None.

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#57 Added UKCA logo.

Type: PCB Change

Reason: Required for export to UK.

Impact: None.

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#58 Updated schematic sheet from template.

Type: Documentation Update

Reason: Documentation improvement.

Impact: None.

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#59 Updated block diagram.

Type: Documentation Update

Reason: Documentation improvement.

Impact: None.

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#60 Added power overview, I2C address table,

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and Power Voltage Range table. Updated revision history. Updated page count and order. 

Type: Documentation Update

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