PCN-20240611 TEBF0808-04A to TEBF0808-05 Hardware Revision Change

Products Affected

This change affects all Trenz Electronic TEBF0808 SoMs: TEBF0808-04A*.

ED: Tabelle ist fertig!

Changes

#1 Restructured power supply circuit. Power supply can be supplied either via power path ATX connector (J20) (signal "12V_input_A") → fuse 0451007.MRL (F1) (signal "12V_input_A_Fused") → protection circuit LTC4365ITS8#TRMPBF (U52) with MOSFET Si7114ADN-T1-GE3 (T2, T3) (signal "12V") or via power path power jack (J25) (signal "12V_input_B") → fuse 0451007.MRL (F2) (signal "12V_input_B_Fused") → protection circuit LTC4365ITS8#TRMPBF (U53) with MOSFET Si7114ADN-T1-GE3 ( T4, T5) (signal "12V"). Added input power protection circuit with TVS diode SMBJ20CA (D11, D19).

Type: Schematic Change

Reason: Improve power supply architecture.

Impact: None.

#2 Changed DCDC EN5335QI (U8) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: Power supply option 1.25 V removed. Minor changes in electrical characteristics. (???)

#3 Changed DCDC EN6347QI (U19) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Increased current output capability. Minor changes in electrical characteristics. (???)

#4 Changed DCDC 171050601 (U22, U26, U29) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: (???)

#5 Changed DCDC 171050601 (U18) to MPM3683GMN-10 and adapted power circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: (???)

#6 Changed DCDC EN5311QI (U28, U43) to MP2164GG-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Increased current output capability. Minor changes in electrical characteristics. (???)

#7 Changed load switch TPS27082LDDCR (Q1, Q2, Q3) to MP5077GG-Z and adapted circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Increased current output capability. Minor changes in electrical characteristics. (???)

#8 Changed battery power supply circuit (U37, D16) and diode (D16) from SDMG0340LC-7-F to BAS70-05W.

Type: Schematic Change

Reason: Change battery voltage supply from 1.8 V to 1.2 V to follow AMD recommendation.

Impact:  (???)

#9 Change eMMC (U2) from MTFC16GJVEC-2M WT to SDINBDG4-8G-XI2.

Type: BOM change

Reason: EOL of Component.

Impact: None. Replacement has same capacity as used on corresponding affected variant. Reference designs for vivado versions 2019.2 and 2020.2 were tested and work properly without any changes. (???)

#10 Restructered PCIe clock system tree. Differential clock (signals "CLK0_N" and "CLK0_P") is distributed via new added fanout buffer NB3L202KMN (U56) to PCIe connector (J11) (signals "PCI_REF_P" and "PCI_REF_N") and B2B connector (J2) (signals "B505_CLK0_P" and "B505_CLK0_N"). Removed clock oscillator DSC1123CI2-100.0000T (U6).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact:

#11 Changed AC coupling (C93/C94 in REV04A) to DC coupling (R263/R264 in REV05) for differential clock signals "CLK0_N" and "CLK0_P".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#12 Changed power supply for SFP+ connector (J14) from power rail "3.3V_PCI" to power rail "3.3V_PER".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#13 Removed pull-up resistor (R107, R108, R117, R118, R124, R127) for SFP+ connector (J14).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#14 Changed pull-up resistor voltage for resistor (R18, R21, R86, R87, R113 ... R115, R121 ... R123).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#15 Reordered MGT signal connection at FireFly connector (J6, J21).

Type: Schematic Change

Reason: Improve FireFly handling and harmonize with TEBF0818 series.

Impact: If FireFly is used custom firmware needs to be adapted by customer.

#16 Inserted level shifter circuit (T7, T8) between CPLD (U39) (signal "PWROK") and ATX connector (J20) (signal "PWR_OK").

Type: Schematic Change

Reason: Change voltage level between CPLD voltage rail "3V3SB" and ATX connector voltage rail "5VSB".

Impact: None.

#17 Inserted MOSFET (T9) circuit for level shifting and logic level inverting.

Type: Schematic Change

Reason: Change voltage level between CPLD voltage rail "3V3SB" and ATX connector voltage rail "5VSB" and harmonize with TEBF0818 series.

Impact: None. CPLD firmware reflects it but customer firmware needs to be checked/adapted by customer.

#18 Connected all shield signals for connector (J7) together to net "FGND". Removed shield signals from net "F2GND".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#19 Renamed shield net to FGND2 for connector (J13) and changed shield components from 0 Ohm resistor (R43, R44 [REV04A]) to 1 MOhm resistor (R143 [REV05]) and 100 pF capacitor (C149 [REV05]).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series. (???)

Impact: None.

#20 Inserted FGND3 with resistor (R43 [REV04A]) and capacitor (C93 [REV05]) for SFP+ connector (J14) shield.

Type: Schematic Change

Reason: Improve ESD protection.

Impact: None.

#21 Changed Fan F455B-05LD (M1) to Fan MF40060V2-1000U-A99 (MP1) and updated according mechanical screws and nuts.

Type: BOM change

Reason:  EOL of Component.

Impact: Specified airflow of fan decreases slightly from 0.03 m³/min to 0.028 m³/min. (???)

#22 Added assembly option (default: not fitted) for cooling solution with fan controller LM96163CISD/NOPB (U54), temperature sense MMBT3904 (T12), and AND Gate (U55).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#23 Connected fan controller LM96163CISD/NOPB (U54) to I2C bus (signals "SC_SCL" and "SC_SDA").

Type: Schematic Change

Reason: Fan controller handling.

Impact: None. For assembled fan controller I2C address 0x4C is used.

#24 Changed pin header (J19) from two pins to four pins.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None. Consider to use correct pins.

#25 Used resistor (R164) as pull-up resistor for signal "POK_1V8".

Type: Schematic Change

Reason: Use external pull-up resistor.

Impact: None.

#26 Added debounce circuit (R235, R236, C211, C213) for button (S1, S2).

Type: Schematic Change

Reason: Improve button behaviour.

Impact: None.

#27 Added pull-up resistor (R228 ... R234) for signal ("PRSNT1", "PERST", "WAKE", "PRSNT2", "PRSNT3", "PRSNT4", "PRSNT5").

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#28 Added pull-up resistor (R293) for signal "I2C_RST".

Type: Schematic Change

Reason: Use external pull-up resistor.

Impact: None.

#29 Added termination resistor (R134) assembly option for differential clock signal "CLK0_N" and "CLK0_P".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#30 Changed LED (D8, D10) from 150060VS75000 to 19-213/G6C-BM1N2/DT.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#31 Changed power inductor (L8, L9, L11, L12) from 1 µH, 1.7 A, 55 mOhm to 4.7 µH, 1.5 A, 162 mOhm.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

Impact: None.

#32 Changed capacitor (C121 ... C124, C179, C182, C185, C221 ... C223) from 100 nF, 6.3 V, X5R to 10 nF, 10 V, X7R.

Type: Schematic Change

Reason: Follow AMD recommendation.

Impact: None.

#33 Changed capacitor (C197, C200, C202, C203) from 100 nF, 6.3 V, X5R to 10 nF, 10 V, X7R.

Type: Schematic Change

Reason: Follow SATA recommendation.

Impact: None.

#34 Changed capacitor (C69, C70) from 100 nF, 6.3 V, 0201 to 220 nF, 50 V, 0402.

Type: Schematic Change

Reason: Follow PCIe recommendation.

Impact: None.

#35 Changed capacitor (C47, C50, C52, C57, C60, C62) from 470 nF, 6.3 V, 0402 to 100 nF, 10 V, 0201.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

Impact: None.

#35 Changed capacitor (C48, C58) from 10 µF, 6.3 V, 0603 to 100 nF, 10 V, 0201.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

Impact: None.

#36 Changed capacitor (C39, C82, C207) from 4.7 µF, 6.3 V to 10 µF, 10 V.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#37 Changed capacitor (C49, C51, C59, C61) from 10 µF, 6.3 V, 0603 to 22 µF, 25 V, 0805.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

Impact: None.

#37 Changed capacitor (C72, C73) from 100 µF, 6.3 V, 20 % to 22 µF, 25 V, 10 %.

Type: Schematic Change

Reason: Increased voltage rating.

Impact: None.

#38 Changed resistor (R40) from 4.99 kOhm to 0 Ohm.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#39 Changed resistor (R27, R196) from 4.99 kOhm to 100 Ohm.

Type: Schematic Change

Reason: BOM optimization.

Impact: None.

#40 Changed resistor (R14) from 4.99 kOHm to 2 kOhm.

Type: BOM Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#41 Changed pull-up resistor (R18, R21, R87, R115, R121, R122) from 4.99 kOhm to 7.5 kOhm.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#42 Changed resistor (R41) from 4.99 kOhm to 200 kOhm.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#43 Changed resistor (R65) from 8.06 kOhm to 1 kOhm.

Type: Schematic Change

Reason: Enable OTG capability.

Impact: None. (???)

#44 Added ferrid bead (L25) for fan power supply.

Type: Schematic Change

Reason: Improve power quality.

Impact: None.

#45 Added additional decoupling capacitor (C263, C281 ... C287).

Type: Schematic Change

Reason: Improve power supply.

Impact: None.

#46 Set capacitor (C16, C17) to not fitted.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#47 Set resistor (R98, R198) as not fitted.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#48 Changed net name (IN2_P → IN2_CLK_P and IN2_N → IN2_CLK_N).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#49 Changed net name from "3.3V_MOD" to "VCC_MOD".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#50 Changed net name from "5VSBIN" to "5VSB".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#51 Added testpoint (TP17, TP20 ... TP22).

Type: Schematic Change

Reason: Voltage and system monitoring improvement. (???)

Impact: None.

#52 Changed impedance controlled routing for differential RX and TX PCIe signals to 90 Ohm differential impedance.

Type: PCB Change

Reason: Follow PCIe recommendation.

Impact: None.

#53 Routed signals which are marked in schematic as "D100" with 100 Ohm differential impedance.

Type: PCB Change

Reason: Improve signal integrity.

Impact: None.

#54 Changed CAN bus signals net names (CAN_H → CAN_P, CAN_L → CAN_N) to route them with 120 Ohm differential impedance.

Type: PCB Change

Reason: Improve signal integrity.

Impact: None.

#55 Updated PCB with rules, signal layout, layerstack, polygons.

Type: PCB Change

Reason: Improve routing.

Impact: None.

#56 Added module orientation mark in silkscreen top side.

Type: PCB change

Reason: Improve module orientation visibility.

Impact: None.

#57 Added UKCA logo.

Type: PCB Change

Reason: Required for export to UK.

Impact: None.

#58 Updated schematic sheet from template.

Type: Documentation Update

Reason: Documentation improvement.

Impact: None.

#59 Updated block diagram.

Type: Documentation Update

Reason: Documentation improvement.

Impact: None.

#60 Added power overview, I2C address table, and Power Voltage Range table. Updated revision history. Updated page count and order. 

Type: Documentation Update

Reason: Documentation improvement.

Impact: None.

Method of Identification

Production Shipment Schedule

From XXXXX, after old stock is gone. If the new revision is not suitable for your application and still the former revision of the board is needed, please contact us.

This PCN follows JEDEC Standard J-STD-046.