Page History
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Affected Product | Replacement |
|---|---|
| TEBF0808-04A | TEBF0808-05 |
ED: Tabelle ist fertig!
ED: Aufnahme aller Änderungen in die PCN fertig.
Changes
#1 Restructured input power supply circuit architecture. Power supply can be supplied either via power path ATX connector (J20) (signal "12V_input_A") → fuse 0451007.MRL (F1) (signal "12V_input_A_Fused") → protection circuit LTC4365ITS8#TRMPBF (U52) with MOSFET Si7114ADN-T1-GE3 (T2, T3) (signal "12V") or via power path power jack (J25) (signal "12V_input_B") → fuse 0451007.MRL (F2) (signal "12V_input_B_Fused") → protection circuit LTC4365ITS8#TRMPBF (U53) with MOSFET Si7114ADN-T1-GE3 (T4, T5) (signal "12V"). Added input power protection circuit with TVS diode SMBJ20CA (D11, D19).
Type: Schematic Change
Reason: Improve power supply architecture.
Impact: NonePower supplies are separated. It is not possible to supply the board simultaneously with both connectors (J20, J25) at the same time. It is not possible to supply one connector and draw power from the other connector.
#2 Changed DCDC EN5335QI (U8) to MPM3650CGQW-Z and adapted power circuit.
Type: Schematic Change
Reason: EOL of Component.
Impact: Power supply selection option 1.25 V removed. Minor changes in Slightly increased soft start time. Increased output current capability. Minor changes in electrical characteristics. (Firmware ???)
#3 Changed DCDC EN6347QI (U19) to MPM3650CGQW-Z and adapted power circuit.
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Reason: Change battery voltage supply from 1.8 V to 1.2 V to follow AMD recommendation.
Impact: (???)
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#9 Reordered MGT signal connection at FireFly connector (J6, J21).
Type: Schematic Change
Reason: (???)
Impact: (???)
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Improve FireFly handling and harmonize with TEBF0818 series.
Impact: If FireFly is used custom firmware needs to be adapted by customer.
#10 Change eMMC (U2) from MTFC16GJVEC-2M WT to SDINBDG4-8G-XI2.
Type: BOM change
Reason: EOL of Component.
Impact: None. Replacement has same capacity as used on corresponding affected variant. Reference designs for vivado versions 2019.2 and 2020.2 were tested and work properly without any changes. (???)
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#11 Restructered PCIe clock system tree. Differential clock (signals "CLK0_N" and "CLK0_P") is distributed via new added fanout buffer NB3L202KMN (U56) to PCIe connector (J11) (signals "PCI_REF_P" and "PCI_REF_N") and B2B connector (J2) (signals "B505_CLK0_P" and "B505_CLK0_N"). Removed clock oscillator DSC1123CI2-100.0000T (U6).
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact:
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#12 Changed AC coupling (C93/C94
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[REV04A]) to DC coupling (R263/R264 in REV05) for differential clock signals "CLK0_N" and "CLK0_P". Removed capacitor (C94).
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
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#13 Changed MEMS oscillator (U10) from SiT8008AI-73-XXS-52.000000E to SiT8008BI-73-XXS-52.000000E
Type: BOM change
Reason: EOL of Component.
Impact: None. Clock revision changed.
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#14 Changed power supply for SFP+ connector (J14) from power rail "3.3V_PCI" to power rail "3.3V_PER".
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
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#15 Removed pull-up resistor (R107, R108, R117, R118, R124, R127) for SFP+ connector (J14).
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
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#16 Changed pull-up resistor voltage for resistor (R18, R21, R86, R87, R113 ... R115, R121 ... R123).
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
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#17 Inserted level shifter circuit (T7, T8) between CPLD (U39) (signal "PWROK") and ATX connector (J20) (signal "PWR_OK").
Type: Schematic Change
Reason: Improve FireFly handling and harmonize with TEBF0818 seriesChange voltage level between CPLD voltage rail "3V3SB" and ATX connector voltage rail "5VSB".
Impact: If FireFly is used custom firmware needs to be adapted by customerNone.
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#18 Inserted
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MOSFET (T9) circuit for level shifting and logic level inverting.
Type: Schematic Change
Reason: Change voltage level between CPLD voltage rail "3V3SB" and ATX connector voltage rail "5VSB" and harmonize with TEBF0818 series.
Impact: None.
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. CPLD firmware reflects it but customer firmware needs to be checked/adapted by customer.
#19 Changed ESD protection diode (U11, U20, U49 ... U51) from ESD3V3U4ULC E6327 to CPDA10R3V3U-HF.
Type: Schematic Change
Reason: Change voltage level between CPLD voltage rail "3V3SB" and ATX connector voltage rail "5VSB" and harmonize with TEBF0818 seriesEOL of Component.
Impact: None. CPLD firmware reflects it but customer firmware needs to be checked/adapted by customer.
#14 Changed ESD protection diode (U11, U20, U49 ... U51) from ESD3V3U4ULC E6327 to CPDA10R3V3U-HF.
Type: Schematic Change
Reason: EOL of Component.
Impact: None.
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#20 Connected all shield signals for connector (J7) together to net "FGND". Removed shield signals (J7) from net "F2GND". Removed capacitor (C261).
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
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#21 Renamed shield net to FGND2 for connector (J13) and changed shield components from 0 Ohm resistor (R43, R44 [REV04A]) to 1 MOhm resistor (
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R143 [REV05]) and 100 pF capacitor (C149 [REV05]). Removed resistor (R44 [REV04A]).
Type: Schematic Change
Reason: Harmonize with TEBF0818 series. (???)
Impact: None.
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#22 Inserted FGND3 with resistor (R43 [
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REV05]) and capacitor (C93 [REV05]) for SFP+ connector (J14) shield.
Type: Schematic Change
Reason: Improve ESD protection.
Impact: None.
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#23 Changed Fan F455B-05LD (M1) to Fan MF40060V2-1000U-A99 (MP1) and updated according mechanical screws, nuts, crimp contacts, and housing (JX1).
Type: BOM change
Reason: EOL of Component.
Impact: Specified airflow of fan decreases slightly from 0.03 m³/min to 0.028 m³/min. (???)
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#24 Added assembly option (default: not fitted) for cooling solution with fan controller LM96163CISD/NOPB (U54), temperature sense MMBT3904 (T12), and AND Gate (U55).
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
#25 Connected fan controller LM96163CISD/NOPB
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(U54) to I2C bus (signals "SC_SCL" and "SC_SDA").
Type: Schematic Change
Reason:Fan controller handling.
Impact: None. For assembled fan controller I2C address 0x4C is used.
#26 Changed pin header (J19) from two pins to four pins.
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None. Consider to use correct pins.
#27 Used resistor (R164) as pull-up resistor for signal "POK_1V8".
Type: Schematic Change
Reason: Use external pull-up resistor.
Impact: None.
#28 Added debounce circuit (R235, C211) for button (S1) and (R236, C213) for button (S2).
Type: Schematic Change
Reason: Improve button behaviour.
Impact: None.
#29 Added pull-up resistor (R228 ... R234) for signal ("PRSNT1", "PERST", "WAKE", "PRSNT2", "PRSNT3", "PRSNT4", "PRSNT5").
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
#30 Added pull-up resistor (R293) for signal "I2C_RST".
Type: Schematic Change
Reason: Use external pull-up resistor.
Impact: None.
#31 Added termination resistor (R134) assembly option for differential clock signal "CLK0_N" and "CLK0_P".
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
#32 Changed LED (D8, D10) from 150060VS75000 to 19-213/G6C-BM1N2/DT.
Type: Schematic Change
Reason:BOM Optimization.
Impact: None.
#33 Changed 1 µH power inductor (L1) from 1.7 A, 20 %, 55 mOhm to 0.7 A, 5 %, 620 mOhm.
Type: Schematic Change
Reason: (???)
Impact: None.
#34 Changed power inductor (L2, L6, L13, L14) from 1 µH, 1.7 A, 55 mOhm to 3.3 µH, 1.5 A, 162 mOhm.
Type: Schematic Change
Reason: Follow SFP+ recommendation.
Impact: None.
#35 Changed power inductor (L8, L9, L11, L12) from 1 µH, 1.7 A, 55 mOhm to 4.7 µH, 1.5 A, 84 mOhm.
Type: Schematic Change
Reason: (???)
Impact: None.
#36 Changed ferrid bead (L16, L17) from BKP0603HS121-T to MPZ0603S121HT000.
Type: BOM Change
Reason:EOL of component.
Impact: None.
#37 Changed 33 nF capacitor (192) from 50 V, 0603 to 25 V, 0402
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
#23 Connected fan controller LM96163CISD/NOPB (U54) to I2C bus (signals "SC_SCL" and "SC_SDA").
Type: Schematic Change
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Impact: None. For assembled fan controller I2C address 0x4C is used.
#24 Changed pin header (J19) from two pins to four pins.
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None. Consider to use correct pins.
#25 Used resistor (R164) as pull-up resistor for signal "POK_1V8".
Type: Schematic Change
Reason: Use external pull-up resistor.
Impact: None.
...
.
Type: Schematic Change
Reason: Improve button behaviour.(???)
Impact: None.
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#38 Changed capacitor (C121 ... C124, C179, C182, C185, C221 ... C223) from 100 nF, 6.3 V, X5R to 10 nF, 10 V, X7R.
Type: Schematic Change
Reason: Harmonize with TEBF0818 seriesFollow AMD recommendation.
Impact: None.
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#39 Changed capacitor (C197, C200, C202, C203) from 100 nF, 6.3 V, X5R to 10 nF, 10 V, X7R.
Type: Schematic Change
Reason: Use external pull-up resistorFollow SATA recommendation.
Impact: None.
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#40 Changed capacitor (C69, C70) from 100 nF, 6.3 V, 0201 to 220 nF, 50 V, 0402.
Type: Schematic Change
Reason: Harmonize with TEBF0818 seriesFollow PCIe recommendation.
Impact: None.
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#41 Changed
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220 nF capacitor (C170) from 16 V, X7R to 50 V, X5R.
Type: Schematic Change
Reason: BOM Optimization.
Impact: None.
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#42 Changed
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capacitor (C47, C50, C52, C57, C60, C62) from 470 nF, 6.3 V, 0402 to 100 nF, 10 V, 0201.
Type: Schematic Change
Reason: Follow SFP+ recommendation.
Impact: None.
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#43 Changed 470 nF capacitor (C220) from 0201 to 0402.
Type: Schematic Change
Reason: (???)Follow SFP+ recommendation.
Impact: None.
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#44 Changed capacitor (
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C160) from 4.7 µF to 470 nF.
Type: Schematic Change
Reason: Follow AMD recommendation.(???)
Impact: None.
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#45 Changed capacitor (
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C39,
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C82,
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C207) from
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4.7 µF, 6.3 V
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to 10 µF, 10 V
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.
Type: Schematic Change
Reason: Follow SATA recommendationHarmonize with TEBF0818 series.
Impact: None.
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#46 Changed capacitor (
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C49, C51, C59, C61) from
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10 µF, 6.3 V,
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0603 to
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22 µF,
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25 V,
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0805.
Type: Schematic Change
Reason: Follow PCIe SFP+ recommendation.
Impact: None.
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#47 Changed capacitor (C48, C58) from 10 µF, 6.3 V,
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0603 to 100 nF, 10 V, 0201.
Type: Schematic Change
Reason: Follow SFP+ recommendation.
Impact: None.
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#48 Changed 10 µF capacitor (
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C11, C12, C13, C15, C18, C20, C34, C63, C136, C204, C239) from 6.3 V
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, 0603 to 10 V, 0402.
Type: Schematic Change
Reason:Harmonize with TEBF0818 series. (???)
Impact: None.
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#49 Changed capacitor (
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C42, C67) from
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47 µF, 6.3 V,
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1206 to 22 µF, 25 V, 0805.
Type: Schematic Change
Reason: Follow SFP+ recommendation.(???)
Impact: None.
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#50 Changed capacitor (
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C72,
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C73) from
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100 µF, 6.3 V,
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20 % to 22 µF, 25 V, 10 %.
Type: Schematic Change
Reason: Follow SFP+ recommendationIncreased voltage rating.
Impact: None.
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#51 Changed 33 Ohm resistor (R7, R13, R19, R68, R103, R112, R128, R151, R168, R189) from 63 mW, 0402 to 50 mW, 0201.
Type: Schematic Change
Reason: (???)
Impact: None.
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#52 Changed
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resistor (R101, R102, R104, R105) from 249 Ohm to 240 Ohm.
Type: Schematic Change
Reason: (???)
Impact: None.
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#53 Changed
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resistor (
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R40) from
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4.99 kOhm to 0 Ohm.
Type: Schematic Change
Reason: Increased voltage ratingHarmonize with TEBF0818 series.
Impact: None.
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#54 Changed
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resistor (
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R27, R196) from 4.99 kOhm to 100 Ohm.
Type: Schematic Change
Reason: (???)BOM optimization.
Impact: None.
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#55 Changed resistor (
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R14) from 4.99 kOHm to 2 kOhm
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.
Type: Schematic ChangeBOM Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
...
.
Impact: None.
#56 Changed pull-up resistor (R18, R21, R86, R87, R113, R114, R115, R121 ... R123) from 4.99 kOhm to
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7.5 kOhm.
Type: Schematic Change
Reason: BOM optimizationHarmonize with TEBF0818 series.
Impact: None.
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#57 Changed resistor (
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R41) from 4.99
...
kOhm to
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200 kOhm.
Type:BOM Change Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
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#58 Changed
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resistor (
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R65) from
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8.
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06 kOhm to
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1 kOhm.
Type: Schematic Change
Reason: Harmonize with TEBF0818 seriesEnable OTG capability.
Impact: None.
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(???)
#59 Added ferrid bead (L25) for fan power supply.
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
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: Improve power quality.
Impact: None.
#60 Added additional decoupling capacitor (C244, C254, C262, C263, C281 ... C287).
Type: Schematic Change
Reason: Enable OTG capabilityImprove power supply.
Impact: None. (???)
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#61 Added
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termination resistor (R277 ... R292).
Type: Schematic Change
Reason: Improve power qualitysignal integrity for FireFly connector (J6, J21).
Impact: None.
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#62 Set LDO TPS79901DRV (U47) and related components as not fitted.
Type: Schematic Change
Reason:Improve power supply. (???)
Impact:None.
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(???)
#63 Set ferrid beat (L20) to not fitted.
Type: Schematic Change
Reason: Improve signal integrity for FireFly connector (J6, J21).(???)
Impact: None.
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#64 Set capacitor (C16, C17, C127) to not fitted.
Type: Schematic Change
Reason: Harmonize with TEBF0818 series. (???)
Impact: None.
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#65 Set resistor (R98, R181, R198) as not fitted.
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
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#66 Changed net name (IN2_P → IN2_CLK_P and IN2_N → IN2_CLK_N).
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
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#67 Changed net name from "5VSBIN" to "5VSB".
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
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#68 Changed net name from "3.3V_MOD" to "VCC_MOD".
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
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#69 Added testpoint (TP14, TP16, TP17,
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TP20 ... TP25).
Type: Schematic Change
Reason: Voltage and system monitoring improvement. (???)
Impact: None.
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#70 Changed impedance controlled routing for differential RX and
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TX PCIe signals to 90 Ohm differential impedance.
Type: PCB Change
Reason: Follow PCIe recommendation.
Impact: None.
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#71 Routed signals which are marked
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in schematic as "D100" with 100 Ohm differential impedance.
Type: PCB Change
Reason: Improve signal integrity.
Impact: None.
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#72 Changed CAN bus signals net names (CAN_H → CAN_P, CAN_L → CAN_N) to route them with 120 Ohm differential impedance.
Type: PCB Change
Reason: Improve signal integrity.
Impact: None.
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#73 Updated PCB with rules, signal layout, layerstack, polygons.
Type: PCB Change
Reason: Improve routing.
Impact: None.
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#74 Added module orientation mark in silkscreen top side.
Type: PCB change
Reason: Improve module orientation visibility.
Impact: None.
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#75 Added UKCA logo.
Type: PCB Change
Reason: Required for export to UK.
Impact: None.
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#76 Changed fiducials to standard fiducial type.
Type: Schematic Change
Reason: Use standard fiducials.
Impact: None.
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#77 Updated schematic sheet from template.
Type: Documentation Update
Reason: Documentation improvement.
Impact: None.
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#78 Added legal notices, power overview, I2C address table, and power voltage range table. Updated block diagram and revision history. Updated page count and order.
Type: Documentation Update
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