PCN-20240611 TEBF0808-04A to TEBF0808-05 Hardware Revision Change

Products Affected

This change affects all Trenz Electronic TEBF0808 SoMs: TEBF0808-04A*.

ED: Tabelle ist fertig!

ED: Aufnahme aller Änderungen in die PCN fertig.

Changes

#1 Restructured input power supply circuit architecture. Power supply can be supplied either via power path ATX connector (J20) (signal "12V_input_A") → fuse 0451007.MRL (F1) (signal "12V_input_A_Fused") → protection circuit LTC4365ITS8#TRMPBF (U52) with MOSFET Si7114ADN-T1-GE3 (T2, T3) (signal "12V") or via power path power jack (J25) (signal "12V_input_B") → fuse 0451007.MRL (F2) (signal "12V_input_B_Fused") → protection circuit LTC4365ITS8#TRMPBF (U53) with MOSFET Si7114ADN-T1-GE3 (T4, T5) (signal "12V"). Added input power protection circuit with TVS diode SMBJ20CA (D11, D19).

Type: Schematic Change

Reason: Improve power supply architecture.

Impact: Power supplies are separated. It is not possible to supply the board simultaneously with both connectors (J20, J25) at the same time. It is not possible to supply one connector and draw power from the other connector.

#2 Changed DCDC EN5335QI (U8) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: Power supply selection option 1.25 V removed. Slightly increased soft start time. Increased output current capability. Minor changes in electrical characteristics. (Firmware ???)

#3 Changed DCDC EN6347QI (U19) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Increased current output capability. Minor changes in electrical characteristics. (???)

#4 Changed DCDC 171050601 (U22, U26, U29) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: (???)

#5 Changed DCDC 171050601 (U18) to MPM3683GMN-10 and adapted power circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: (???)

#6 Changed DCDC EN5311QI (U28, U43) to MP2164GG-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Increased current output capability. Minor changes in electrical characteristics. (???)

#7 Changed load switch TPS27082LDDCR (Q1, Q2, Q3) to MP5077GG-Z and adapted circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Increased current output capability. Minor changes in electrical characteristics. (???)

#8 Changed battery power supply circuit architecture. Changed LDO (U37) from TPS780180300 to TPS7A0212PDBVR and diode (D16) from SDMG0340LC-7-F to BAS70-05W. Added capacitor (C278), resistor (R269), and assembly option (default: not fitted) resistor (R270).

Type: Schematic Change

Reason: Change battery voltage supply from 1.8 V to 1.2 V to follow AMD recommendation.

Impact:  (???)

#9 Reordered MGT signal connection at FireFly connector (J6, J21).

Type: Schematic Change

Reason: Improve FireFly handling and harmonize with TEBF0818 series.

Impact: If FireFly is used custom firmware needs to be adapted by customer.

#10 Change eMMC (U2) from MTFC16GJVEC-2M WT to SDINBDG4-8G-XI2.

Type: BOM change

Reason: EOL of Component.

Impact: None. Replacement has same capacity as used on corresponding affected variant. Reference designs for vivado versions 2019.2 and 2020.2 were tested and work properly without any changes. (???)

#11 Restructered PCIe clock system tree. Differential clock (signals "CLK0_N" and "CLK0_P") is distributed via new added fanout buffer NB3L202KMN (U56) to PCIe connector (J11) (signals "PCI_REF_P" and "PCI_REF_N") and B2B connector (J2) (signals "B505_CLK0_P" and "B505_CLK0_N"). Removed clock oscillator DSC1123CI2-100.0000T (U6).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact:

#12 Changed AC coupling (C93/C94 [REV04A]) to DC coupling (R263/R264 in REV05) for differential clock signals "CLK0_N" and "CLK0_P". Removed capacitor (C94).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#13 Changed MEMS oscillator (U10) from SiT8008AI-73-XXS-52.000000E to SiT8008BI-73-XXS-52.000000E

Type: BOM change

Reason: EOL of Component.

Impact: None. Clock revision changed.

#14 Changed power supply for SFP+ connector (J14) from power rail "3.3V_PCI" to power rail "3.3V_PER".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#15 Removed pull-up resistor (R107, R108, R117, R118, R124, R127) for SFP+ connector (J14).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#16 Changed pull-up resistor voltage for resistor (R18, R21, R86, R87, R113 ... R115, R121 ... R123).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#17 Inserted level shifter circuit (T7, T8) between CPLD (U39) (signal "PWROK") and ATX connector (J20) (signal "PWR_OK").

Type: Schematic Change

Reason: Change voltage level between CPLD voltage rail "3V3SB" and ATX connector voltage rail "5VSB".

Impact: None.

#18 Inserted MOSFET (T9) circuit for level shifting and logic level inverting.

Type: Schematic Change

Reason: Change voltage level between CPLD voltage rail "3V3SB" and ATX connector voltage rail "5VSB" and harmonize with TEBF0818 series.

Impact: None. CPLD firmware reflects it but customer firmware needs to be checked/adapted by customer.

#19 Changed ESD protection diode (U11, U20, U49 ... U51) from ESD3V3U4ULC E6327 to CPDA10R3V3U-HF.

Type: Schematic Change

Reason: EOL of Component.

Impact: None.

#20 Connected all shield signals for connector (J7) together to net "FGND". Removed shield signals (J7) from net "F2GND". Removed capacitor (C261).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#21 Renamed shield net to FGND2 for connector (J13) and changed shield components from 0 Ohm resistor (R43, R44 [REV04A]) to 1 MOhm resistor (R143 [REV05]) and 100 pF capacitor (C149 [REV05]). Removed resistor (R44 [REV04A]).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series. (???)

Impact: None.

#22 Inserted FGND3 with resistor (R43 [REV05]) and capacitor (C93 [REV05]) for SFP+ connector (J14) shield.

Type: Schematic Change

Reason: Improve ESD protection.

Impact: None.

#23 Changed Fan F455B-05LD (M1) to Fan MF40060V2-1000U-A99 (MP1) and updated according mechanical screws, nuts, crimp contacts, and housing (JX1).

Type: BOM change

Reason:  EOL of Component.

Impact: Specified airflow of fan decreases slightly from 0.03 m³/min to 0.028 m³/min. (???)

#24 Added assembly option (default: not fitted) for cooling solution with fan controller LM96163CISD/NOPB (U54), temperature sense MMBT3904 (T12), and AND Gate (U55).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#25 Connected fan controller LM96163CISD/NOPB (U54) to I2C bus (signals "SC_SCL" and "SC_SDA").

Type: Schematic Change

Reason: Fan controller handling.

Impact: None. For assembled fan controller I2C address 0x4C is used.

#26 Changed pin header (J19) from two pins to four pins.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None. Consider to use correct pins.

#27 Used resistor (R164) as pull-up resistor for signal "POK_1V8".

Type: Schematic Change

Reason: Use external pull-up resistor.

Impact: None.

#28 Added debounce circuit (R235, C211) for button (S1) and (R236, C213) for button (S2).

Type: Schematic Change

Reason: Improve button behaviour.

Impact: None.

#29 Added pull-up resistor (R228 ... R234) for signal ("PRSNT1", "PERST", "WAKE", "PRSNT2", "PRSNT3", "PRSNT4", "PRSNT5").

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#30 Added pull-up resistor (R293) for signal "I2C_RST".

Type: Schematic Change

Reason: Use external pull-up resistor.

Impact: None.

#31 Added termination resistor (R134) assembly option for differential clock signal "CLK0_N" and "CLK0_P".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#32 Changed LED (D8, D10) from 150060VS75000 to 19-213/G6C-BM1N2/DT.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#33 Changed 1 µH power inductor (L1) from 1.7 A, 20 %, 55 mOhm to 0.7 A, 5 %, 620 mOhm.

Type: Schematic Change

Reason: (???)

Impact: None.

#34 Changed power inductor (L2, L6, L13, L14) from 1 µH, 1.7 A, 55 mOhm to 3.3 µH, 1.5 A, 162 mOhm.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

Impact: None.

#35 Changed power inductor (L8, L9, L11, L12) from 1 µH, 1.7 A, 55 mOhm to 4.7 µH, 1.5 A, 84 mOhm.

Type: Schematic Change

Reason: (???)

Impact: None.

#36 Changed ferrid bead (L16, L17) from BKP0603HS121-T to MPZ0603S121HT000.

Type: BOM Change

Reason: EOL of component.

Impact: None.

#37 Changed 33 nF capacitor (192) from 50 V, 0603 to 25 V, 0402.

Type: Schematic Change

Reason: (???)

Impact: None.

#38 Changed capacitor (C121 ... C124, C179, C182, C185, C221 ... C223) from 100 nF, 6.3 V, X5R to 10 nF, 10 V, X7R.

Type: Schematic Change

Reason: Follow AMD recommendation.

Impact: None.

#39 Changed capacitor (C197, C200, C202, C203) from 100 nF, 6.3 V, X5R to 10 nF, 10 V, X7R.

Type: Schematic Change

Reason: Follow SATA recommendation.

Impact: None.

#40 Changed capacitor (C69, C70) from 100 nF, 6.3 V, 0201 to 220 nF, 50 V, 0402.

Type: Schematic Change

Reason: Follow PCIe recommendation.

Impact: None.

#41 Changed 220 nF capacitor (C170) from 16 V, X7R to 50 V, X5R.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#42 Changed capacitor (C47, C50, C52, C57, C60, C62) from 470 nF, 6.3 V, 0402 to 100 nF, 10 V, 0201.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

Impact: None.

#43 Changed 470 nF capacitor (C220) from 0201 to 0402.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

Impact: None.

#44 Changed capacitor (C160) from 4.7 µF to 470 nF.

Type: Schematic Change

Reason: (???)

Impact: None.

#45 Changed capacitor (C39, C82, C207) from 4.7 µF, 6.3 V to 10 µF, 10 V.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#46 Changed capacitor (C49, C51, C59, C61) from 10 µF, 6.3 V, 0603 to 22 µF, 25 V, 0805.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

Impact: None.

#47 Changed capacitor (C48, C58) from 10 µF, 6.3 V, 0603 to 100 nF, 10 V, 0201.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

Impact: None.

#48 Changed 10 µF capacitor (C11, C12, C13, C15, C18, C20, C34, C63, C136, C204, C239) from 6.3 V, 0603 to 10 V, 0402.

Type: Schematic Change

Reason: (???)

Impact: None.

#49 Changed capacitor (C42, C67) from 47 µF, 6.3 V, 1206 to 22 µF, 25 V, 0805.

Type: Schematic Change

Reason: (???)

Impact: None.

#50 Changed capacitor (C72, C73) from 100 µF, 6.3 V, 20 % to 22 µF, 25 V, 10 %.

Type: Schematic Change

Reason: Increased voltage rating.

Impact: None.

#51 Changed 33 Ohm resistor (R7, R13, R19, R68, R103, R112, R128, R151, R168, R189) from 63 mW, 0402 to 50 mW, 0201.

Type: Schematic Change

Reason: (???)

Impact: None.

#52 Changed resistor (R101, R102, R104, R105) from 249 Ohm to 240 Ohm.

Type: Schematic Change

Reason: (???)

Impact: None.

#53 Changed resistor (R40) from 4.99 kOhm to 0 Ohm.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#54 Changed resistor (R27, R196) from 4.99 kOhm to 100 Ohm.

Type: Schematic Change

Reason: BOM optimization.

Impact: None.

#55 Changed resistor (R14) from 4.99 kOHm to 2 kOhm.

Type: BOM Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#56 Changed pull-up resistor (R18, R21, R86, R87, R113, R114, R115, R121 ... R123) from 4.99 kOhm to 7.5 kOhm.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#57 Changed resistor (R41) from 4.99 kOhm to 200 kOhm.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#58 Changed resistor (R65) from 8.06 kOhm to 1 kOhm.

Type: Schematic Change

Reason: Enable OTG capability.

Impact: None. (???)

#59 Added ferrid bead (L25) for fan power supply.

Type: Schematic Change

Reason: Improve power quality.

Impact: None.

#60 Added additional decoupling capacitor (C244, C254, C262, C263, C281 ... C287).

Type: Schematic Change

Reason: Improve power supply.

Impact: None.

#61 Added termination resistor (R277 ... R292).

Type: Schematic Change

Reason: Improve signal integrity for FireFly connector (J6, J21).

Impact: None.

#62 Set LDO TPS79901DRV (U47) and related components as not fitted.

Type: Schematic Change

Reason:  (???)

Impact:  (???)

#63 Set ferrid beat (L20) to not fitted.

Type: Schematic Change

Reason: (???)

Impact: None.

#64 Set capacitor (C16, C17, C127) to not fitted.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series. (???)

Impact: None.

#65 Set resistor (R98, R181, R198) as not fitted.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#66 Changed net name (IN2_P → IN2_CLK_P and IN2_N → IN2_CLK_N).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#67 Changed net name from "5VSBIN" to "5VSB".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#68 Changed net name from "3.3V_MOD" to "VCC_MOD".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#69 Added testpoint (TP14, TP16, TP17, TP20 ... TP25).

Type: Schematic Change

Reason: Voltage and system monitoring improvement. (???)

Impact: None.

#70 Changed impedance controlled routing for differential RX and TX PCIe signals to 90 Ohm differential impedance.

Type: PCB Change

Reason: Follow PCIe recommendation.

Impact: None.

#71 Routed signals which are marked in schematic as "D100" with 100 Ohm differential impedance.

Type: PCB Change

Reason: Improve signal integrity.

Impact: None.

#72 Changed CAN bus signals net names (CAN_H → CAN_P, CAN_L → CAN_N) to route them with 120 Ohm differential impedance.

Type: PCB Change

Reason: Improve signal integrity.

Impact: None.

#73 Updated PCB with rules, signal layout, layerstack, polygons.

Type: PCB Change

Reason: Improve routing.

Impact: None.

#74 Added module orientation mark in silkscreen top side.

Type: PCB change

Reason: Improve module orientation visibility.

Impact: None.

#75 Added UKCA logo.

Type: PCB Change

Reason: Required for export to UK.

Impact: None.

#76 Changed fiducials to standard fiducial type.

Type: Schematic Change

Reason: Use standard fiducials.

Impact: None.

#77 Updated schematic sheet from template.

Type: Documentation Update

Reason: Documentation improvement.

Impact: None.

#78 Added legal notices, power overview, I2C address table, and power voltage range table. Updated block diagram and revision history. Updated page count and order. 

Type: Documentation Update

Reason: Documentation improvement.

Impact: None.

Method of Identification

Production Shipment Schedule

From XXXXX, after old stock is gone. If the new revision is not suitable for your application and still the former revision of the board is needed, please contact us.

This PCN follows JEDEC Standard J-STD-046.