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Table of Contents
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Overview
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TheOn https://wiki.trenz-electronic.de/display/PD/TE0715 the online version of this manual and other documents can be found here: https://wiki.trenz-electronic.de/display/PD/TE0715. |
The Trenz Electronic TE0715 is an industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC (7015 or 7030), with a gigabit Ethernet PHY transceiver, 1 gigabyte DDR3 SDRAM, 32 megabyte Flash memory, a USB PHY transceiver and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking strips. All modules in 4 x 5 cm form factor are mechanically compatible.
Block diagram
Board Components
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Zynq-7000 All Programmable SoC
System Controller CPLD
Programmable clock generator
10/100/1000 Mbps Ethernet PHY
- DDR3-SDRAM
Hi-Speed USB 2.0 ULPI Transceiver
B2B-Connector
JM1
JM2
JM3
Key Features
Industrial-grade Xilinx Zynq-7000 (Z-7015, Z-7030) SoM
- Rugged for shock and high vibration
- 2 × ARM Cortex-A9
- 10/100/1000 tri-speed gigabit Ethernet transceiver PHY
- MAC Address EEPROM
- 32-Bit wide 1 GByte DDR3 SDRAM
- 32 MByte QSPI Flash memory
- Programmable Clock Generator
- Transceiver Clock (default 125 MHz)
- Plug-on module with 2 × 100-pin and 1 × 60-pin high-speed hermaphroditic strips
- 132 FPGA I/Os (65 LVDS pairs possible) and 14 PS MIO available on board-to-board connectors
- 4 GTP/GTX (high-performance transceiver) lanes
- GTP/GTX (high-performance transceiver) clock input
- USB 2.0 high-speed ULPI transceiver
- On-board high-efficiency DC-DC converters
- 4.0 A x 1.0 V power rail
- 1.5 A x 1.5 V power rail
- 1.5 A x 1.8 V power rail
- System management
- eFUSE bit-stream encryption
- AES bit-stream encryption
- Temperature compensated RTC (real-time clock)
- User LED
- Evenly-spread supply pins for good signal integrity
Assembly options for cost or performance optimization available upon request.
Signals, Interfaces and Pins
System Controller I/O Pins
Special purpose pins used by TE0720 are also available on TE0715 they are connected to smaller System Controller CPLD and have different or no function in default configuration.
Name | Note |
---|---|
EN1 | No hard wired function on PCB, when forced low pulls POR_B low to emulate power on reset |
PGOOD | Driven low by System Controller if power supply power fail detected |
NOSEQ | No function |
RESIN | Active low reset, gated to POR_B |
JTAGEN | Low for normal operation |
Boot Modes
By default the TE-0715 supports QSPI and SD boot modes.
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MODE signal | Boot Mode |
---|---|
high or open | SD Card |
low or ground | QSPI |
JTAG
JTAG access to the Xilinx Zynq-7000 device is provided through connector JM2.
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Note |
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JTAGEN pin in JM1 should be kept low or grounded for normal operation. |
Clocking
Clock | Frequency | IC | FPGA | Notes |
---|---|---|---|---|
PS CLK | 33.3333 Mhz | U11 | PS_CLK | PS Subsystem main clock |
ETH PHY reference | 25 MHz | U9 | - | |
USB PHY reference | 52 MHz | U15 | - | |
PLL reference | 25 MHz | U18 | - | |
GT REFCLK0 | - | B2B | U9/V9 | Externally supplied from base |
GT REFCLK1 | 125 Mhz | U10 Si5338 | U5/V5 | Default clock is 125 MHz |
Processing System (PS) Peripherals
IC | Designator | PS7 | MIO | Notes | |
---|---|---|---|---|---|
SPI Flash | S25FL256SAGBHI20 | U14 | QSPI0 | MIO1..MIO6 | |
EEPROM I2C | 24AA025E48 | U19 | I2C1 | MIO48, MIO49 | EEPROM for MAC Address |
RTC | ISL2020 | U16 | I2C1 | MIO48, MIO49 | Temperature compensated real time clock |
RTC Interrupt | ISL2020 | U16 | GPIO | MIO47 | Real Time Clock Interrupt |
Clock PLL | Si5338 | U10 | I2C1 | MIO48, MIO49 | Low jitter phase locked loop |
LED | D4 | GPIO | MIO7 | ||
USB | USB3320 | U6 | USB0 | MIO28..MIO39 | |
USB Reset | GPIO | MIO51 | |||
Ethernet | 88E1512 | U7 | ETH0 | MIO16..MIO27 | |
Ethernet Reset | GPIO | MIO50 |
Default MIO mapping:
MIO | Configured as | B2B | Notes |
---|---|---|---|
0 | GPIO | JM1-87 | B2B |
1 | QSPI0 | - | SPI Flash-CS |
2 | QSPI0 | - | SPI Flash-DQ0 |
3 | QSPI0 | - | SPI Flash-DQ1 |
4 | QSPI0 | - | SPI Flash-DQ2 |
5 | QSPI0 | - | SPI Flash-DQ3 |
6 | QSPI0 | - | SPI Flash-SCK |
7 | GPIO | - | Green LED D4 |
8 | QSPI0 | - | SPI Flash-SCKFB |
9 | JM1-91 | B2B | |
10 | JM1-95 | B2B | |
11 | JM1-93 | B2B | |
12 | JM1-99 | B2B | |
13 | JM1-97 | B2B | |
14 | UART0 | JM1-92 | B2B |
15 | UART0 | JM1-85 | B2B |
16..27 | ETH0 | RGMII | |
28..39 | USB0 | ULPI | |
40 | SDIO0 | JM1-27 | B2B |
41 | SDIO0 | JM1-25 | B2B |
42 | SDIO0 | JM1-23 | B2B |
43 | SDIO0 | JM1-21 | B2B |
44 | SDIO0 | JM1-19 | B2B |
45 | SDIO0 | JM1-17 | B2B |
46 | GPIO | - | Ethernet PHY LED2/INTn Signal |
47 | GPIO | - | RTC Interrupt |
48 | I2C1 | - | SCL on-board I2C |
49 | I2C1 | - | SDA on-board I2C |
50 | GPIO | - | ETH0 Reset |
51 | GPIO | - | USB Reset |
52 | ETH0 | - | MDC |
53 | ETH0 | - | MDIO |
I2C Interface
The on-board I2C components are connected to MIO48 and MIO49 and configured as I2C1 by default.
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Device | I2C-Address | Notes |
---|---|---|
EEPROM | 0x50 | |
RTC | 0x6F | |
Battery backed RAM | 0x57 | integrated in RTC |
PLL | 0x70 |
B2B I/O
Number of I/O's connected to the SoC's I/O bank and B2B connector:
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For detailed information about the pin out, please refer to the Master Pinout Table.
Peripherals
LED's
There are 3 LED's on TE0715:
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Note |
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LED D2 is connected to the FPGA Done pin and will go off as soon as PL is configured. This LED will not operate if the SC can not power on the 3.3V output rail that also powers the 3.3V circuitry on the module. |
Ethernet
The TE0715 is populated with a Marvell Alaska 88E1512 Gigabit Ethernet PHY. The Ethernet PHY RGMII Interface is connected to the Zynq Ethernet0 PS GEM0. The I/O Voltage is fixed at 1.8V for HSTL signaling.
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Note: LED1 is connected to PL via level-shifter implemented in system controller CPLD.
USB
The USB PHY USB3320 from Microchip is used on the TE0715. The ULPI interface is connected to the Zynq PS USB0. The I/O Voltage is fixed at 1.8V.
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The schematic for the USB connector and required components is different depending on the USB usage. USB standard A or B connectors can be used for Host or Device modes. A Mini USB connector can be used for USB Device mode. A USB Micro connector can be used for Device mode, OTG Mode or Host Mode.
RTC
An Intersil temperature compensated real time clock IC ISL12020M is used for timekeeping (U16). Battery voltage must be supplied to the module from the main board.
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This RTC IC is supported in Linux so it can be used as hwclock device.
PLL
A Silicon Labs I2C-programmable clock generator Si5338A (U10) is populated on the module. The Si5338 can be programmed using the I2C-bus, to change the frequency on its outputs. It is accessible on the I2C slave address 0x70.
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Input/Output | Default Frequency | Notes |
---|---|---|
IN1/IN2 | Externally supplied | need decoupling on base board |
IN3 | 25MHz | Fixed input clock |
IN4 | - | not available and not used |
IN5/IN6 | 125MHz | Ethernet PHY output clock |
CLK0 | - | not used, disabled |
CLK1 | - | not used, disabled |
CLK2 A/B | 125MHz | MGT reference clock 1 |
CLK3A | 125MHz | Bank 34 clock input |
CLK3B | - | not used, disabled |
MAC-Address EEPROM
A Microchip 24AA025E48 EEPROM (U19) is used on the TE0715. It contains a globally unique 48-bit node address, that is compatible with EUI-48(TM) and EUI-64(TM). The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use. It is accessible through the I2C slave address 0x50.
Power
Warning |
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TE0715-xx-30 has several HP banks on B2B Connectors, those banks have maximal Voltage tolerance of 1.8V please check special instructions for the Baseboard use with TE0715-xx-30 |
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Note |
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VIN and 3.3VIN can be connected to the same source (3.3 V). |
Power Supplies
Vin | 3.3 V to 5.5 V | Typical 200 mA, depending on customer design and connections |
Vin 3.3V | 3.3 V | Typical 50 mA, depending on customer design and connections |
Bank Voltages
Bank | Voltage | TE0715-xx-15 | TE0715-xx-30 |
---|---|---|---|
500 MIO0 | 3.3V | ||
501 MIO1 | 1.8V | ||
502 DDR | 1.5V | ||
0 Config | 3.3V | ||
13 HR | User | Max 3.3V | Max 3.3V |
34 HR/HP | User | Max 3.3V | Max 1.8V |
35 HR/HP | User | Max 3.3V | Max 1.8V |
Initial Delivery state
Storage device name | Content | Notes |
---|---|---|
24AA025E48 EEPROM | User content not programmed | Valid MAC Address from manufacturer |
SPI Flash OTP Area | Empty, not programmed | Except serial number programmed by flash vendor |
SPI Flash Quad Enable bit | Programmed | |
SPI Flash main array | demo design | |
EFUSE USER | Not programmed | |
EFUSE Security | Not programmed |
Hardware Revision History
Revision | Changes | |
---|---|---|
01 | Current Hardware Revision, no changesPrototypes | |
02 | Prototypes | |
03 | First production release |
Technical Specification
Absolute Maximum Ratings
Parameter | Min | Max | Units | Notes |
---|---|---|---|---|
Vin supply voltage | -0.3 | 6.0 | V | |
Vin33 supply voltage | -0.4 | 3.6 | V | |
VBat supply voltage | -1 | 6.0 | V | |
PL IO Bank supply voltage for HR I/O banks (VCCO) | -0.5 | 3.6 | V | |
PL IO Bank supply voltage for HP I/O banks (VCCO) | -0.5 | 2.0 | V | TE0715-xx-15 does not have HP banks |
I/O input voltage for HR I/O banks | -0.4 | VCCO_X+0.55 | V | |
I/O input voltage for HP I/O banks | -0.55 | VCCO_X+0.55 | V | TE0715-xx-15 does not have HP banks |
GT Receiver (RXP/RXN) and Transmitter (TXP/TXN) | -0.5 | 1.26 | V | |
Voltage on Module JTAG pins | -0.4 | VCCO_0+0.55 | V | VCCO_0 is 3.3V nominal |
Storage Temperature | -40 | +85 | C | |
Storage Temperature without the ISL12020MIRZ | -55 | +100 | C |
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Note |
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Please check Xilinx Datasheet for complete list of Absolute maximum and recommended operating ratings for the Zynq device (DS181 Artix or DS182 Kintex). |
Recommended Operating Conditions
Parameter | Min | Max | Units | Notes | Reference document |
Vin supply voltage | 2.5 | 5.5 | V | ||
Vin33 supply voltage | 3.135 | 3.465 | V | ||
VBat supply voltage | 2.7 | 5.5 | V | ||
PL IO Bank supply voltage for HR I/O banks (VCCO) | 1.14 | 3.465 | V | Xilinx document DS191 | |
PL IO Bank supply voltage for HP I/O banks (VCCO) | 1.14 | 1.89 | V | TE0715-xx-15 does not have HP banks. | Xilinx document DS191 |
I/O input voltage for HR I/O banks | (*) | (*) | V | (*) Check datasheet | Xilinx document DS191 and DS187 |
I/O input voltage for HP I/O banks | (*) | (*) | V | TE0715-xx-15 does not have HP banks. (*) Check datasheet | Xilinx document DS191 |
Voltage on Module JTAG pins | 3.135 | 3.465 | V | VCCO_0 is 3.3 V nominal |
Physical Dimensions
Module size: 50 mm × 40 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8mm
PCB thickness: 1.6mm
Highest part on PCB: approx. 2.5mm. Please download the step model for exact numbers.
All dimensions are shown in mm.
Temperature Ranges
Commercial grade modules
All parts are at least commercial temperature range of 0°C to +70°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
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All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
Weight
26 g | Plain module |
8.8 g | Set of bolts and nuts |
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Document Change History
date | revision | authors | description |
---|---|---|---|
2016-04-27 | Emmanuel Vassilakis | Added the table "Recommended Operating Conditions", Storage Temperature edited | |
2016-03-31 | v10
| initial version |
Disclaimer
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